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1. 发明授权

US07015418B2 Method and system for calibrating a laser processing system and laser marking system utilizing same 有权
公开(公告)号：US07015418B2
公开(公告)日：2006-03-21
申请号：US10438533
申请日：2003-05-15
申请人： Steven P. Cahill , Jonathan S. Ehrmann , You C. Li , Rainer Schramm , Kurt Pelsue
发明人： Steven P. Cahill , Jonathan S. Ehrmann , You C. Li , Rainer Schramm , Kurt Pelsue
IPC分类号： B23K26/00
CPC分类号： B23K26/04 , B23K26/042 , B23K26/043 , B23K26/0853 , B23K26/361 , B23K26/40 , B23K26/705 , B23K2101/007 , B23K2101/40 , B23K2103/50 , G06K1/126 , H01C17/242 , H01L21/67282 , H01L21/681 , H01L23/544 , H01L2223/5442 , H01L2223/54453 , H01L2223/54473 , H01L2223/5448 , H01L2924/0002 , H01L2924/00
摘要： A method of calibrating a laser marking system includes calibrating a laser marking system in three dimensions. The step of calibrating includes storing data corresponding to a plurality of heights. A position measurement of a workpiece is obtained to be marked. Stored calibration data is associated with the position measurement. A method and system for calibrating a laser processing or marking system is provided. The method includes: calibrating a laser marker over a marking field; obtaining a position measurement of a workpiece to be marked; associating stored calibration data with the position measurement; relatively positioning a marking beam and the workpiece based on at least the associated calibration data; and calibrating a laser marking system in at least three degrees of freedom. The step of calibrating includes storing data corresponding to a plurality of positions and controllably and relatively positioning a marking beam based on the stored data corresponding to the plurality of positions.

2. 发明授权

US07903336B2 Optical metrological scale and laser-based manufacturing method therefor 有权
标题翻译：光学计量尺度和激光制造方法
公开(公告)号：US07903336B2
公开(公告)日：2011-03-08
申请号：US11546024
申请日：2006-10-11
申请人： Kurt Pelsue , Stuart A. Dodson, II , Bradley L. Hunter , Donald V. Smart , Pierre-Yves Mabboux , Jonathan S. Ehrmann
发明人： Kurt Pelsue , Stuart A. Dodson, II , Bradley L. Hunter , Donald V. Smart , Pierre-Yves Mabboux , Jonathan S. Ehrmann
IPC分类号： G02B27/44 , G02F1/295 , H03M1/22 , G01B11/02
CPC分类号： B41M5/24 , B23K26/364 , G01D5/34707
摘要： A reflective metrological scale has a metal tape substrate and a scale pattern of elongated side-by-side marks surrounded by reflective surface areas of the substrate. Each mark has a furrowed cross section and may have a depth in the range of 0.5 to 2 microns. The central region of each mark may be rippled and darkened to provide an enhanced optical reflection ratio with respect to surrounding surface areas. A manufacturing method includes the repeated steps of (1) creating a scale mark by irradiating the substrate surface at a mark location with overlapped pulses from a laser, each pulse having an energy density of less than about 1 joule per cm2, and (2) changing the relative position of the laser and the substrate by a displacement amount defining a next mark location on the substrate at which a next mark of the scale is to be created.
摘要翻译：反射计量标尺具有金属带基板和由基板的反射表面区域包围的细长的并排标记的刻度图案。每个标记具有沟槽的横截面并且可以具有在0.5至2微米范围内的深度。每个标记的中心区域可能波纹和变暗，以提供相对于周围表面区域的增强的光反射率。一种制造方法包括以下重复步骤：（1）通过在来自激光器的重叠脉冲的标记位置处照射基板表面来产生刻度标记，每个脉冲具有小于约1焦耳/ cm 2的能量密度，以及（2）改变激光器和衬底的相对位置一个位移量，该位移量限定了要在其上产生刻度的下一个标记的衬底上的下一个标记位置。

3. 发明授权

US06633338B1 Programmable illuminator for vision system 有权
标题翻译：视觉系统的可编程照明器
公开(公告)号：US06633338B1
公开(公告)日：2003-10-14
申请号：US09301002
申请日：1999-04-27
申请人： Kurt Pelsue , Jonathan S. Ehrmann
发明人： Kurt Pelsue , Jonathan S. Ehrmann
IPC分类号： H04N5222
CPC分类号： G01N21/8806
摘要： The field portion (40) of a workpiece (14) that an electro-optical system (28) can image is deflected by a field-of-view deflector (38) and an array of light sources (42, 44) illuminates the workpiece. As the field of view (40) moves about the workpiece surface, individual sources (42, 44) in the light-source array are so turned on and off that all sources that could be imaged into the field of view by specular reflection are turned off. In this way, proper dark-field illumination is maintained.
摘要翻译：电光学系统（）的工件（ 14 ）的场部分（ 40 > ）可以通过视场偏转器（ 38 ）和光源阵列（ 42，44 ）照亮工件。由于视野（ 40 ）在光线周围移动工件表面，单个光源（ 42，44 ） -source数组如此打开和关闭，所有可以通过镜面反射成像到视场的源都被关闭。以这种方式，保持适当的暗场照明。

4. 发明授权

US06573473B2 Method and system for precisely positioning a waist of a material-processing laser beam to process microstructures within a laser-processing site 有权
标题翻译：用于精确定位材料处理激光束的腰部以处理激光加工部位内的微结构的方法和系统
公开(公告)号：US06573473B2
公开(公告)日：2003-06-03
申请号：US10001104
申请日：2001-11-02
申请人： Bradley L. Hunter , Steven P. Cahill , Jonathan S. Ehrmann , Michael Plotkin
发明人： Bradley L. Hunter , Steven P. Cahill , Jonathan S. Ehrmann , Michael Plotkin
IPC分类号： B23K2602
CPC分类号： B23K26/046 , B23K26/02 , B23K26/04 , B23K26/043 , B23K26/0853 , B23K2101/40 , G03F7/70041 , G03F7/70725
摘要： A high-speed method and system for precisely positioning a waist of a material-processing laser beam to dynamically compensate for local variations in height of microstructures located on a plurality of objects spaced apart within a laser-processing site are provided. In the preferred embodiment, the microstructures are a plurality of conductive lines formed on a plurality of memory dice of a semiconductor wafer. The system includes a focusing lens subsystem for focusing a laser beam along an optical axis substantially orthogonal to a plane, an x-y stage for moving the wafer in the plane, and a first air bearing sled for moving the focusing lens subsystem along the optical axis.
摘要翻译：提供了一种用于精确定位材料处理激光束的腰部以动态地补偿位于激光加工部位内间隔开的多个物体上的微结构的局部高度变化的高速方法和系统。在优选实施例中，微结构是形成在半导体晶片的多个存储芯片上的多个导线。该系统包括聚焦透镜子系统，用于沿着基本上垂直于平面的光轴聚焦激光束，用于在平面中移动晶片的x-y级，以及用于沿着光轴移动聚焦透镜子系统的第一空气轴承滑座。

5. 发明授权

US06483071B1 Method and system for precisely positioning a waist of a material-processing laser beam to process microstructures within a laser-processing site 有权
标题翻译：用于精确定位材料处理激光束的腰部以处理激光加工部位内的微结构的方法和系统
公开(公告)号：US06483071B1
公开(公告)日：2002-11-19
申请号：US09572925
申请日：2000-05-16
申请人： Bradley L. Hunter , Steven P. Cahill , Jonathan S. Ehrmann , Michael Plotkin
发明人： Bradley L. Hunter , Steven P. Cahill , Jonathan S. Ehrmann , Michael Plotkin
IPC分类号： B23K2602
CPC分类号： B23K26/046 , B23K26/02 , B23K26/04 , B23K26/043 , B23K26/0853 , B23K2101/40 , G03F7/70041 , G03F7/70725
摘要： A high-speed method and system for precisely positioning a waist of a material-processing laser beam to dynamically compensate for local variations in height of microstructures located on a plurality of objects spaced apart within a laser-processing site are provided. In the preferred embodiment, the microstructures are a plurality of conductive lines formed on a plurality of memory dice of a semiconductor wafer. The system includes a focusing lens subsystem for focusing a laser beam along an optical axis substantially orthogonal to a plane, an x-y stage for moving the wafer in the plane, and a first air bearing sled for moving the focusing lens subsystem along the optical axis. The reference data is generated by the system which includes a modulator for reducing power of the material-processing laser beam to obtain a probe laser beam to measure height of the semiconductor wafer at a plurality of locations about the site to obtain reference height data. A computer computes a reference surface based on the reference height data. A trajectory planner generates trajectories for the wafer and the waist of the laser beam based on the reference surface.
摘要翻译：提供了一种用于精确定位材料处理激光束的腰部以动态地补偿位于激光加工部位内间隔开的多个物体上的微结构的局部高度变化的高速方法和系统。在优选实施例中，微结构是形成在半导体晶片的多个存储芯片上的多条导线。该系统包括聚焦透镜子系统，用于沿着基本上垂直于平面的光轴聚焦激光束，用于在平面中移动晶片的x-y级，以及用于沿着光轴移动聚焦透镜子系统的第一空气轴承滑座。参考数据由包括用于降低材料处理激光束的功率的调制器的系统产生，以获得探针激光束，以测量位于该位置的多个位置处的半导体晶片的高度，以获得参考高度数据。计算机基于参考高度数据计算参考曲面。轨迹计划器基于参考表面产生晶片和激光束的腰部的轨迹。

6. 发明授权

US07176407B2 Method and system for precisely positioning a waist of a material-processing laser beam to process microstructures within a laser-processing site 有权
标题翻译：用于精确定位材料处理激光束的腰部以处理激光加工部位内的微结构的方法和系统
公开(公告)号：US07176407B2
公开(公告)日：2007-02-13
申请号：US11114520
申请日：2005-04-26
申请人： Bradley L. Hunter , Steven P. Cahill , Jonathan S. Ehrmann , Michael Plotkin
发明人： Bradley L. Hunter , Steven P. Cahill , Jonathan S. Ehrmann , Michael Plotkin
IPC分类号： B23K26/02
CPC分类号： B23K26/046 , B23K26/02 , B23K26/04 , B23K26/043 , B23K26/0853 , B23K2101/40 , G03F7/70041 , G03F7/70725
摘要： A high-speed method and system for precisely positioning a waist of a material-processing laser beam to dynamically compensate for local variations in height of microstructures located on a plurality of objects spaced apart within a laser-processing site are provided. In the preferred embodiment, the microstructures are a plurality of conductive lines formed on a plurality of memory dice of a semiconductor wafer. The system includes a focusing lens subsystem for focusing a laser beam along an optical axis substantially orthogonal to a plane, an x-y stage for moving the wafer in the plane, and a first air bearing sled for moving the focusing lens subsystem along the optical axis.
摘要翻译：提供了一种用于精确定位材料处理激光束的腰部以动态地补偿位于激光加工部位内间隔开的多个物体上的微结构的局部高度变化的高速方法和系统。在优选实施例中，微结构是形成在半导体晶片的多个存储芯片上的多条导线。该系统包括聚焦透镜子系统，用于沿着基本上垂直于平面的光轴聚焦激光束，用于在平面中移动晶片的x-y级，以及用于沿着光轴移动聚焦透镜子系统的第一空气轴承滑座。

7. 发明授权

US07469831B2 Laser-based method and system for processing targeted surface material and article produced thereby 有权
公开(公告)号：US07469831B2
公开(公告)日：2008-12-30
申请号：US11514660
申请日：2006-10-27
申请人： Bo Gu , Jonathan S. Ehrmann , Donald J. Svetkoff , Steven P. Cahill , Kevin E. Sullivan
发明人： Bo Gu , Jonathan S. Ehrmann , Donald J. Svetkoff , Steven P. Cahill , Kevin E. Sullivan
IPC分类号： G06K7/10
CPC分类号： G06K1/126 , B23K26/0624 , B23K26/0676 , B23K26/355 , B23K26/361 , B23K26/40 , B23K2103/50 , B33Y80/00 , B41M5/24 , H01L23/544 , H01L2223/54406 , H01L2223/54413 , H01L2223/54426 , H01L2223/54433 , H01L2223/54453 , H05K1/0266 , H05K3/0026
摘要： A laser-based method and system for processing targeted surface material and article produced thereby are provided. The system processes the targeted surface material within a region of a workpiece while avoiding undesirable changes to adjacent non-targeted material. The system includes a primary laser subsystem including a primary laser source for generating a pulsed laser output including at least one pulse having a wavelength and a pulse width less than 1 ns. A delivery subsystem irradiates the targeted surface material of the workpiece with the pulsed laser output including the at least one pulse to texture the targeted surface material. The pulsed laser output has sufficient total fluence to initiate ablation within at least a portion of the targeted surface material and the pulse width is short enough such that the region and the non-targeted material surrounding the material are substantially free of slag.

8. 发明授权

US08809734B2 Methods and systems for thermal-based laser processing a multi-material device 有权
标题翻译：用于热基激光加工多材料装置的方法和系统
公开(公告)号：US08809734B2
公开(公告)日：2014-08-19
申请号：US13541320
申请日：2012-07-03
申请人： James J. Cordingley , Jonathan S. Ehrmann , David M. Filgas , Shepard D. Johnson , Joohan Lee , Donald V. Smart , Donald J. Svetkoff
发明人： James J. Cordingley , Jonathan S. Ehrmann , David M. Filgas , Shepard D. Johnson , Joohan Lee , Donald V. Smart , Donald J. Svetkoff
IPC分类号： H01L21/00 , B23K26/067 , B23K26/08
CPC分类号： B23K26/0736 , B23K26/032 , B23K26/04 , B23K26/043 , B23K26/0613 , B23K26/0622 , B23K26/0624 , B23K26/064 , B23K26/0643 , B23K26/0648 , B23K26/0652 , B23K26/0665 , B23K26/067 , B23K26/082 , B23K26/10 , B23K26/16 , B23K26/361 , B23K26/389 , B23K26/40 , B23K2101/38 , B23K2101/40 , B23K2103/10 , B23K2103/12 , B23K2103/172 , B23K2103/50 , H01L21/485 , H01L21/76888 , H01L21/76894 , H01L22/12 , H01L23/5258 , H01L2924/0002 , H05K3/0026 , H01L2924/00
摘要： A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.
摘要翻译：提供一种用于局部处理形成在基板上的预定微结构而不引起基板或其上形成在基板上的其它结构的电学或物理特性的不期望的变化的方法和系统。该方法包括基于与预定微结构，衬底和其它结构的激光脉冲相互作用的模型来提供信息。基于该信息确定至少一个脉冲的至少一个特性。生成包括至少一个脉冲的脉冲激光束。该方法还包括将具有至少一个确定特性的至少一个脉冲照射到预定微结构上的点中。所述至少一个脉冲的至少一个确定的特征和其它特征足以在不引起不期望的变化的情况下局部地处理预定的微结构。

9. 发明申请

US20120276754A1 METHODS AND SYSTEMS FOR THERMAL-BASED LASER PROCESSING A MULTI-MATERIAL DEVICE 有权
标题翻译：用于基于热的激光加工多物质装置的方法和系统
公开(公告)号：US20120276754A1
公开(公告)日：2012-11-01
申请号：US13541320
申请日：2012-07-03
申请人： James J. Cordingley , Jonathan S. Ehrmann , David M. Filgas , Shepard D. Johnson , Joohan Lee , Donald V. Smart , Donald J. Svetkoff
发明人： James J. Cordingley , Jonathan S. Ehrmann , David M. Filgas , Shepard D. Johnson , Joohan Lee , Donald V. Smart , Donald J. Svetkoff
IPC分类号： H01L21/263 , B23K26/00
CPC分类号： B23K26/0736 , B23K26/032 , B23K26/04 , B23K26/043 , B23K26/0613 , B23K26/0622 , B23K26/0624 , B23K26/064 , B23K26/0643 , B23K26/0648 , B23K26/0652 , B23K26/0665 , B23K26/067 , B23K26/082 , B23K26/10 , B23K26/16 , B23K26/361 , B23K26/389 , B23K26/40 , B23K2101/38 , B23K2101/40 , B23K2103/10 , B23K2103/12 , B23K2103/172 , B23K2103/50 , H01L21/485 , H01L21/76888 , H01L21/76894 , H01L22/12 , H01L23/5258 , H01L2924/0002 , H05K3/0026 , H01L2924/00
摘要： A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.
摘要翻译：提供一种用于局部处理形成在基板上的预定微结构而不引起基板或其上形成在基板上的其它结构的电学或物理特性的不期望的变化的方法和系统。该方法包括基于与预定微结构，衬底和其它结构的激光脉冲相互作用的模型来提供信息。基于该信息确定至少一个脉冲的至少一个特性。生成包括至少一个脉冲的脉冲激光束。该方法还包括将具有至少一个确定特性的至少一个脉冲照射到预定微结构上的点中。所述至少一个脉冲的至少一个确定的特征和其它特征足以在不引起不期望的变化的情况下局部地处理预定的微结构。

10. 发明授权

US08217304B2 Methods and systems for thermal-based laser processing a multi-material device 有权
标题翻译：用于热基激光加工多材料装置的方法和系统
公开(公告)号：US08217304B2
公开(公告)日：2012-07-10
申请号：US10107890
申请日：2002-03-27
申请人： James J. Cordingley , Jonathan S. Ehrmann , David M. Filgas , Shepard D. Johnson , Joohan Lee , Donald V. Smart , Donald J. Svetkoff
发明人： James J. Cordingley , Jonathan S. Ehrmann , David M. Filgas , Shepard D. Johnson , Joohan Lee , Donald V. Smart , Donald J. Svetkoff
IPC分类号： B23K26/08 , B23K26/067 , H01L21/00
CPC分类号： B23K26/0736 , B23K26/032 , B23K26/04 , B23K26/043 , B23K26/0613 , B23K26/0622 , B23K26/0624 , B23K26/064 , B23K26/0643 , B23K26/0648 , B23K26/0652 , B23K26/0665 , B23K26/067 , B23K26/082 , B23K26/10 , B23K26/16 , B23K26/361 , B23K26/389 , B23K26/40 , B23K2101/38 , B23K2101/40 , B23K2103/10 , B23K2103/12 , B23K2103/172 , B23K2103/50 , H01L21/485 , H01L21/76888 , H01L21/76894 , H01L22/12 , H01L23/5258 , H01L2924/0002 , H05K3/0026 , H01L2924/00
摘要： A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.
摘要翻译：提供一种用于局部处理形成在基板上的预定微结构而不引起基板或其上形成在基板上的其它结构的电学或物理特性的不期望的变化的方法和系统。该方法包括基于与预定微结构，衬底和其它结构的激光脉冲相互作用的模型来提供信息。基于该信息确定至少一个脉冲的至少一个特性。生成包括至少一个脉冲的脉冲激光束。该方法还包括将具有至少一个确定特性的至少一个脉冲照射到预定微结构上的点中。所述至少一个脉冲的至少一个确定的特征和其它特征足以在不引起不期望的变化的情况下局部地处理预定的微结构。

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