会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 5. 发明授权
    • Fine pitch solder sphere placement
    • 细间距焊球放置
    • US06191022B1
    • 2001-02-20
    • US09295101
    • 1999-04-18
    • Steven B. Creswick
    • Steven B. Creswick
    • H01L2144
    • H05K3/3478B23K3/0623B23K2101/42H01L21/4867H01L24/11H01L2224/13099H01L2924/01005H01L2924/01006H01L2924/01013H01L2924/01027H01L2924/01033H01L2924/01077H01L2924/014H01L2924/3011H05K2203/041H05K2203/0557
    • In forming an interconnection between a component and an electronic circuit, a base with precise component pockets is loaded with components. The components are patterned with a thin layer of solder paste. Next, a frame including a stencil, vertical walls and locating or keying features is placed onto the base. The stencil rests a controlled distance above the components. A multitude of solder spheres are dispensed into the frame. Solder balls retained within the frame are passed through the stencil and into contact with solder paste. Most preferably, due to controlled spacing between the stencil and components, only one solder ball is able to pass through each stencil hole. The remaining solder spheres in the frame are collected through various alternative techniques, including a disclosed emptying gate. Then the frame with stencil is removed from the base. The solder paste and solder spheres are heated, resulting in a reflow of the solder paste and a bonding of the solder spheres to the component. Subsequent processing may also include further reflowing of the solder spheres, cleaning of any residue from the components, and device testing, as appropriate.
    • 在形成部件和电子电路之间的互连时,具有精确的部件袋的基座装载有部件。 这些部件用薄的焊膏图案化。 接下来,将包括模板,垂直壁和定位或键控特征的框架放置在基座上。 模板位于组件上方的受控距离处。 多个焊球被分配到框架中。 保留在框架内的焊球通过模板并与焊膏接触。 最优选地,由于模板和部件之间的受控的间隔,仅一个焊球能够通过每个模板孔。 框架中剩余的焊球通过各种替代技术收集,包括一个公开的排空门。 然后将带有模具的框架从基座上取下。 焊膏和焊球被加热,导致焊膏的回流和焊料球与组件的结合。 随后的处理还可以包括进一步回流焊球,适当地清洁组件中的任何残留物和器件测试。