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    • 1. 发明授权
    • Method for etched cavity devices
    • 蚀刻腔体装置的方法
    • US08709848B2
    • 2014-04-29
    • US13088100
    • 2011-04-15
    • Srivatsa G. KundalgurkiScott Dye
    • Srivatsa G. KundalgurkiScott Dye
    • H01L21/02H01L21/3065
    • G01L9/0042B81C1/00047B81C2201/0123B81C2201/0146B81C2201/017H01L21/02057H01L21/30608H01L21/3065
    • MEMS devices (40) using etched cavities (42) are desirably formed using multiple etching steps. Preliminary cavities (20) formed by locally anisotropic etching to nearly the final depth have irregular (46) sidewalls (44) and steep and/or inconsistent sidewall (44) to bottom (54) intersection angles (48). This leads to less than desired cavity diaphragm (26) burst strengths. Final cavities (42) with smooth sidewalls (50), smaller and consistent sidewall (50) to bottom (54) intersection angles (58), and having more than doubled cavity diaphragm (26) burst strengths are obtained by treating the preliminary cavities (20) with TMAH etchant, preferably relatively dilute TMAH etchant. In a preferred embodiment, a cleaning step is performed between the etching step and the TMAH treatment step to remove any anisotropic etching by-products present on the preliminary cavities' (20) initial sidewalls (44). The multi-step cavity etching procedure is especially useful for forming robust MEMS pressure sensors, but is applicable to any type of MEMS device.
    • 期望使用多个蚀刻步骤形成使用蚀刻腔(42)的MEMS器件(40)。 通过局部各向异性腐蚀形成的接近最终深度的初级腔(20)具有不规则的(46)侧壁(44)和陡峭和/或不一致的侧壁(44)至底部(54)交叉角(48)。 这导致比所需的腔膜(26)突发强度小。 通过处理预备空腔(2)获得具有平滑侧壁(50),更小且一致的侧壁(50)到底部(54)交叉角(58)并且具有多于两倍的腔隔膜(26)的突出强度的最终腔(42) 20)与TMAH蚀刻剂,优选相对稀释的TMAH蚀刻剂。 在优选的实施方案中,在蚀刻步骤和TMAH处理步骤之间进行清洁步骤以去除预备空腔(20)初始侧壁(44)上存在的任何各向异性蚀刻副产物。 多阶腔蚀刻程序对于形成坚固的MEMS压力传感器尤其有用,但适用于任何类型的MEMS器件。
    • 2. 发明申请
    • METHOD FOR ETCHED CAVITY DEVICES
    • 蚀刻孔装置的方法
    • US20120264249A1
    • 2012-10-18
    • US13088100
    • 2011-04-15
    • Srivatsa G. KundalgurkiScott Dye
    • Srivatsa G. KundalgurkiScott Dye
    • H01L21/02H01L21/3065
    • G01L9/0042B81C1/00047B81C2201/0123B81C2201/0146B81C2201/017H01L21/02057H01L21/30608H01L21/3065
    • MEMS devices (40) using etched cavities (42) are desirably formed using multiple etching steps. Preliminary cavities (20) formed by locally anisotropic etching to nearly the final depth have irregular (46) sidewalls (44) and steep and/or inconsistent sidewall (44) to bottom (54) intersection angles (48). This leads to less than desired cavity diaphragm (26) burst strengths. Final cavities (42) with smooth sidewalls (50), smaller and consistent sidewall (50) to bottom (54) intersection angles (58), and having more than doubled cavity diaphragm (26) burst strengths are obtained by treating the preliminary cavities (20) with TMAH etchant, preferably relatively dilute TMAH etchant. In a preferred embodiment, a cleaning step is performed between the etching step and the TMAH treatment step to remove any anisotropic etching by-products present on the preliminary cavities' (20) initial sidewalls (44). The multi-step cavity etching procedure is especially useful for forming robust MEMS pressure sensors, but is applicable to any type of MEMS device.
    • 期望使用多个蚀刻步骤形成使用蚀刻腔(42)的MEMS器件(40)。 通过局部各向异性腐蚀形成的接近最终深度的初级腔(20)具有不规则的(46)侧壁(44)和陡峭和/或不一致的侧壁(44)至底部(54)交叉角(48)。 这导致比所需的腔膜(26)突发强度小。 通过处理预备空腔(2)获得具有平滑侧壁(50),更小且一致的侧壁(50)到底部(54)交叉角(58)并且具有多于两倍的腔隔膜(26)的突出强度的最终腔(42) 20)与TMAH蚀刻剂,优选相对稀释的TMAH蚀刻剂。 在优选的实施方案中,在蚀刻步骤和TMAH处理步骤之间进行清洁步骤以去除预备空腔(20)初始侧壁(44)上存在的任何各向异性蚀刻副产物。 多阶腔蚀刻程序对于形成坚固的MEMS压力传感器尤其有用,但适用于任何类型的MEMS器件。