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    • 2. 发明申请
    • SEMICONDUCTOR DEVICE HAVING A PLURALITY OF METAL LAYERS DEPOSITED THEREON
    • 具有多孔金属层的半导体器件
    • US20070178681A1
    • 2007-08-02
    • US11621589
    • 2007-01-10
    • Young-su CHUNGSung-kee HANHyung-suk JUNGHyung-ik LEE
    • Young-su CHUNGSung-kee HANHyung-suk JUNGHyung-ik LEE
    • H01L21/20
    • H01L29/4966H01L21/28088H01L21/28194H01L29/517H01L29/78
    • A semiconductor device has a plurality of stacked metal layers. The semiconductor device includes a substrate, a gate oxide layer deposited on the substrate and formed from a high-k dielectric material, a first metal layer deposited on the gate oxide layer and formed from a nitride of a metal of the high-k dielectric material of the gate oxide layer, a second metal layer deposited on the first metal layer, a third metal layer deposited on the second metal layer, and a material layer deposited on the third metal layer, wherein the material layer taken together with the first, second and third metal layers forms a gate electrode. Because any chemical reaction between the gate oxide layer and the metal layer can be controlled, deterioration of the capacitance equivalent oxide thickness) and leakage of current are prevented, and a semiconductor device having improved insulation can be provided.
    • 半导体器件具有多个堆叠的金属层。 半导体器件包括衬底,沉积在衬底上并由高k电介质材料形成的栅极氧化物层,沉积在栅极氧化物层上并由高k电介质材料的金属的氮化物形成的第一金属层 栅极氧化物层,沉积在第一金属层上的第二金属层,沉积在第二金属层上的第三金属层和沉积在第三金属层上的材料层,其中材料层与第一,第二金属层 并且第三金属层形成栅电极。 由于可以控制栅氧化层和金属层之间的任何化学反应,所以可以防止电容当量氧化物厚度的劣化)和电流泄漏,并且可以提供绝缘性提高的半导体器件。