会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 5. 发明授权
    • Process for treating semiconductor substrates
    • 处理半导体衬底的工艺
    • US5454901A
    • 1995-10-03
    • US703726
    • 1991-05-21
    • Mikio Tsuji
    • Mikio Tsuji
    • H01L21/304H01L21/306H01L21/00
    • H01L21/02052Y10S438/974
    • Semiconductor substrates are treated in a treating solution consisting of hydrofluoric acid, hydrogen peroxide and a purified water or in a treating solution consisting of hydrofluoric acid, ammonium fluoride, hydrogen peroxide and a purified water, wherein the treating solution preferably has a hydrofluoric acid concentration of 0.1 to 10 wt % and a hydrogen peroxide concentration of 0.1 to 15 wt %. A process for treating semiconductor substrates is provided according to this invention, which allows less inclusion of metallic impurities from the treating solution and has excellent ability of removing metallic impurities with a very small amount of microparticles deposited on the substrate. The number of microparticles deposited on the semiconductor substrates can be reduced to about 1/10 the level in the conventional process.
    • 半导体衬底在由氢氟酸,过氧化氢和净化水组成的处理溶液中或在由氢氟酸,氟化铵,过氧化氢和纯化水组成的处理溶液中处理,其中处理溶液的氢氟酸浓度优选为 0.1〜10重量%,过氧化氢浓度为0.1〜15重量%。 根据本发明提供了一种用于处理半导体衬底的方法,其允许从处理溶液中更少地包含金属杂质,并且具有优异的去除沉积在衬底上的微量微粒的金属杂质的能力。 沉积在半导体衬底上的微粒的数量可以降低到常规工艺中的约1/10的水平。
    • 6. 发明授权
    • Filling and casing system
    • 灌装和套管系统
    • US4901504A
    • 1990-02-20
    • US180896
    • 1988-04-13
    • Mikio TsujiKazuo YoshitomiShingo NoroMasayuki HayashiHiroyasu MuraseNaoyoshi KatoKazunori ArakiKenjiro Tanaka
    • Mikio TsujiKazuo YoshitomiShingo NoroMasayuki HayashiHiroyasu MuraseNaoyoshi KatoKazunori ArakiKenjiro Tanaka
    • B65B7/28B65B21/18
    • B65B21/18B65B7/2807
    • An improved filling and casing system is disclosed herein, which comprises a case conveying device for conveying cases, a carrier conveying device disposed adjacent to and in parallel to the case conveying device for conveying carriers capable of accommodating and holding containers, an uncasing station including a container gripper movable between the case and the carrier for taking out the containers from the case and accommodating them in the carrier, a filling station including a filling head for performing a filling operation for the containers accommodated and held in the carrier, and a capping station including a capping head for performing a capping operation for the filled containers. The uncasing station, the filling station and the capping station are disposed in succession along the case conveying device and the carrier conveying device. An improved capping machine available in the capping station of the above-described filling and casing system, and an improved container gripper device available in the uncasing station as well as a casing station of the above-described filing and casing system, are also disclosed herein.
    • 本文公开了一种改进的填充和套管系统,其包括用于输送箱的壳体输送装置,与壳体输送装置相邻并平行布置的载体输送装置,用于输送能够容纳和保持容器的载体,包括 容器夹具可在壳体和托架之间移动,用于从容器中取出容器并将其容纳在托架中;一个加料站,包括用于对容纳和保持在托架中的容器执行填充操作的填充头,以及封盖站 包括用于对填充的容器执行封盖操作的封盖头。 防盗站,加油站和加盖站沿着箱体输送装置和载体输送装置连续布置。 本发明还公开了一种在上述填充和套管系统的封盖站中可用的改进的封盖机,以及在不合格站中可用的改进的容器夹持装置以及上述填充和套管系统的套管站。 。