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    • 4. 发明授权
    • Method for fabricating grating pattern
    • 光栅图案制作方法
    • US06361927B1
    • 2002-03-26
    • US09461175
    • 1999-12-14
    • Byung Sun Park
    • Byung Sun Park
    • H01L21473
    • G02B5/1857
    • There is a provided a method for fabricating a grating pattern, including the steps of: coating an SOG solution on a glass substrate by spin coating method; heat-treating the SOG thin film coated on the glass substrate, to form a silicon oxide layer; coating a photoresist on the silicon oxide layer and exposing the photoresist layer by masking process; developing the exposed photoresist layer and wet-etching the silicon oxide layer; and developing the photoresist layer used as a mask. According to the present invention, the grating pattern can be fabricated without etching the glass substrate, and high-quality products at a low cost is accomplished since the present invention does not require the expensive sputtering apparatus. Furthermore, the step-shape oxide layer pattern can be obtained through one-time wet etching since the multilevel oxide layer is easily formed.
    • 提供了一种制造光栅图案的方法,包括以下步骤:通过旋涂法在玻璃基板上涂覆SOG溶液; 对涂覆在玻璃基板上的SOG薄膜进行热处理,以形成氧化硅层; 在氧化硅层上涂覆光致抗蚀剂并通过掩蔽工艺曝光光致抗蚀剂层; 显影曝光的光致抗蚀剂层并湿法蚀刻氧化硅层; 并且将用作掩模的光致抗蚀剂层显影。 根据本发明,可以在不蚀刻玻璃基板的情况下制造光栅图案,并且实现了低成本的高质量产品,因为本发明不需要昂贵的溅射装置。 此外,由于多层氧化物层容易形成,所以可以通过一次湿法蚀刻获得阶梯形氧化物层图案。
    • 5. 发明授权
    • Method of fabricating compound semiconductor devices using lift-off of insulating film
    • 使用绝缘膜剥离制造复合半导体器件的方法
    • US06204102B1
    • 2001-03-20
    • US09207512
    • 1998-12-09
    • Hyung Sup YoonJin Hee LeeByung Sun ParkChul Soon ParkKwang Eui Pyun
    • Hyung Sup YoonJin Hee LeeByung Sun ParkChul Soon ParkKwang Eui Pyun
    • H01L21338
    • B82Y10/00H01L21/28587H01L29/66469H01L29/66878
    • A method of forming a gate electrode of a compound semiconductor device includes forming a first insulating film pattern having a first aperture, forming a second insulating film pattern having a second aperture consisting of inverse V-type on the first insulating film pattern, forming a T-type gate electrode by depositing a conductivity film on the entire structure, removing a second insulating film pattern, forming a insulating spacer on a pole sidewall by etching a first insulating film pattern, and forming an ohmic electrode of the source and drain by self-aligning method using T-type gate electrode as a mask. Thereby T-type gate electrode of materials such as refractory metals can be prevented to be deteriorate because of high annealing, as well as it is stably formed, by using an insulating film. Ohmic metal and gate electrodes formed by self-aligning method can be prevented an interconnection by forming an insulating film spacer between these electrodes.
    • 一种形成化合物半导体器件的栅电极的方法包括:形成具有第一孔的第一绝缘膜图案,在第一绝缘膜图案上形成具有由反V型构成的第二孔的第二绝缘膜图案,形成T 通过在整个结构上沉积导电膜,去除第二绝缘膜图案,通过蚀刻第一绝缘膜图案在极侧壁上形成绝缘隔离物,并通过自发形成源极和漏极的欧姆电极, 使用T型栅电极作为掩模的对准方法。 因此,通过使用绝缘膜,可以防止诸如难熔金属的材料的T型栅极电极由于高退火而被稳定地形成。 通过自对准方法形成的欧姆金属和栅电极可以通过在这些电极之间形成绝缘膜间隔来防止互连。