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    • 3. 发明授权
    • Method for manufacturing a super self-aligned bipolar transistor
    • 用于制造超自对准双极晶体管的方法
    • US5696007A
    • 1997-12-09
    • US729840
    • 1996-10-15
    • Byung-Ryul RyumTae-Hyeon HanDeok-Ho ChoSoo-Min LeeKwang-Eui Pyun
    • Byung-Ryul RyumTae-Hyeon HanDeok-Ho ChoSoo-Min LeeKwang-Eui Pyun
    • H01L29/73H01L21/331H01L29/165H01L29/70H01L29/732H01L29/737H01L21/265
    • H01L29/66242H01L29/7378Y10S148/072
    • The invention relates to a method for manufacturing a super self-aligned heterojunction bipolar transistor which is capable of miniaturizing an element, simplifying the process step thereof by employing a selective collector epitaxial growth and a polycide base electrode without using a trench for isolating between elements, thereby enhancing the performance thereof, which comprises the steps of: forming sequently a first oxidation film, an electrically conducting thin film and a second oxidation film on top of a substrate; patterning the second oxidation film and the conducting thin film to form a preliminary spacer; removing an exposed portion of the first oxidation film, and selectively growing a collector layer; oxidizing the collector layer to form a thermal oxidation film, and removing the preliminary spacer; depositing a polysilicon and forming a silicon oxidation film and a polysilicon spacer on the second oxidation film and the removed portion of the preliminary spacer, respectively; exposing the base thin film, the spacer and the collector layer to form a SiGe/Si layer; forming a base electrode on the SiGe/Si layer; exposing a portion of the first oxidation film and forming a third oxidation film; exposing a surface of the SiGe/Si layer and forming a oxidation spacer on sides of an etched portion, then self-aligning the emitter and the emitter electrode; and performing a metal wiring process.
    • 本发明涉及一种能够使元件小型化的超自对准异质结双极晶体管的制造方法,通过采用选择性集电体外延生长和多选择性基极电极简化其工艺步骤,而不使用用于隔离元件之间的沟槽, 从而提高其性能,其包括以下步骤:在衬底的顶部上顺次形成第一氧化膜,导电薄膜和第二氧化膜; 图案化第二氧化膜和导电薄膜以形成预备间隔物; 去除第一氧化膜的暴露部分,并选择性地生长集电体层; 氧化所述集电体层以形成热氧化膜,并除去所述预备间隔物; 在所述第二氧化膜上分别沉积多晶硅并形成硅氧化膜和多晶硅间隔物和所述预备间隔物的去除部分; 暴露基底薄膜,间隔物和集电极层以形成SiGe / Si层; 在SiGe / Si层上形成基极; 暴露第一氧化膜的一部分并形成第三氧化膜; 暴露SiGe / Si层的表面并在蚀刻部分的侧面上形成氧化间隔物,然后自发对准发射极和发射极; 并执行金属布线处理。
    • 4. 发明授权
    • Method for fabricating a self-aligned T-gate metal semiconductor field
effect transistor
    • 制造自对准T型栅极金属半导体场效应晶体管的方法
    • US5496779A
    • 1996-03-05
    • US358886
    • 1994-12-19
    • Kyung-Ho LeeYoun-Kyu BaeKwang-Eui PyunKyung-Soo Kim
    • Kyung-Ho LeeYoun-Kyu BaeKwang-Eui PyunKyung-Soo Kim
    • H01L29/812H01L21/285H01L21/335H01L21/338H01L21/265
    • H01L29/66878H01L21/28587
    • Disclosed is a method of fabricating a metal semiconductor field effect transistor, comprising the steps for, forming the channel using an ion-implantation, sequentially forming a first insulator layer at a first predetermined temperature and a second insulation layer at second predetermined temperature over the surface of the substrate, etching the first and second insulation layers using a gate pattern of a photo-resist pattern to expose the channel region as a mask, forming a refractory metal over the surface of the first and second insulation layer add the exposed channel region, etching the refractory metal, thereby dividing it into two parts of which one is formed on the channel region and the other is formed on the second insulation layer, selectively etching the first and second insulation layers to lift-off the refractory metal over the first and second insulation layers, thereby forming a gate of a T-shape on the channel region, ion implanting Si into a substrate using the gate and a channel pattern of a photo-resist film to form a self-aligned high concentration ion implantation region, forming a third insulation layer for preventing As of evaporation, carrying out a rapid thermal annealing for activation, removing the third insulation layer; and forming an ohmic electrode using a lift-off process.
    • 公开了一种制造金属半导体场效应晶体管的方法,包括以下步骤:使用离子注入形成沟道,顺序地形成第一预定温度的第一绝缘体层和在表面上的第二预定温度的第二绝缘层 使用光致抗蚀剂图案的栅极图案蚀刻第一绝缘层和第二绝缘层以暴露沟道区域作为掩模,在第一和第二绝缘层的表面上形成耐火金属添加暴露的沟道区, 蚀刻耐火金属,从而将其分成两部分,其中一部分形成在沟道区上,另一部分形成在第二绝缘层上,选择性地蚀刻第一绝缘层和第二绝缘层以在第一绝缘层上剥离难熔金属, 第二绝缘层,从而在沟道区上形成T形栅极,使用ga将Si离子注入衬底 和形成自对准高浓度离子注入区的通道图案,形成用于防止As蒸发的第三绝缘层,进行激活的快速热退火,去除第三绝缘层; 并使用剥离工艺形成欧姆电极。
    • 5. 发明授权
    • Bias stabilization circuit
    • 偏置稳压电路
    • US6100753A
    • 2000-08-08
    • US137886
    • 1998-08-21
    • Chang Seok LeeMin Gun KimJae Jin LeeKwang Eui Pyun
    • Chang Seok LeeMin Gun KimJae Jin LeeKwang Eui Pyun
    • H01L29/70G05F3/24G05F1/10
    • G05F3/247G05F3/245
    • The present invention relates to a bias stabilization circuit, specifically to a bias stabilization circuit for minimizing the current variations of amplification transistors caused by variations of device parameters which occur during the manufacturing of high-frequency integrated circuits using field-effect transistors, and caused by variations of supply voltage and temperature. In the present invention, the above problem is solved by configuring a level shifter circuit between the drain node and the gate node of the reference voltage generation transistor. Further, by using a constant current source utilizing a depletion transistor and series feedback resistors as a reference current, this circuit becomes stable against the variations of the device parameters as well as the variations of the temperature and supply voltage.
    • 本发明涉及一种偏置稳定电路,特别涉及一种偏置稳定电路,用于使由场效应晶体管制造高频集成电路期间发生的器件参数变化引起的放大晶体管的电流变化最小化,并由 电源电压和温度变化。 在本发明中,通过在基准电压产生晶体管的漏极节点和栅极节点之间配置电平移位电路来解决上述问题。 此外,通过使用利用耗尽晶体管和串联反馈电阻器的恒流源作为参考电流,该电路针对器件参数的变化以及温度和电源电压的变化而变得稳定。
    • 9. 发明授权
    • Gain controlled amplifier
    • 增益控制放大器
    • US6057736A
    • 2000-05-02
    • US135576
    • 1998-08-18
    • Min Gun KimChang Seok LeeJae Jin LeeKwang Eui Pyun
    • Min Gun KimChang Seok LeeJae Jin LeeKwang Eui Pyun
    • H03G1/00H03F1/34H03G3/30
    • H03F1/342H03G1/007H03F2200/151
    • The present invention relates to a gain controlled amplifier, and more particularly, to a gain controlled amplifier using active feedback and variable resistance. It is an object of the present invention to provide a gain controlled amplifier minimizing the gain and the degradation of power characteristics generated when adjusting gain in a variable gain amplifier which receives signals having different power levels, amplifies them in accordance with each power level and outputs output signals in a constant power level. In order to achieve the above object, a gain controlled amplifier in accordance with the present invention comprises an amplifier and an active feedback means for negative feedbacking the output of the amplifier to the input of the amplifier, and further has a feedback amount controller inputting the controlled feedback signal to the amplifier by controlling the feedback amount of said active feedback means.
    • 增益控制放大器本发明涉及一种增益控制放大器,更具体地说,涉及一种使用有源反馈和可变电阻的增益控制放大器。 本发明的一个目的是提供一种增益控制放大器,其最大程度地减小在接收具有不同功率电平的信号的可变增益放大器中调节增益时产生的功率特性的增益和劣化,根据每个功率电平放大它们 输出信号处于恒定功率电平。 为了实现上述目的,根据本发明的增益控制放大器包括放大器和用于将放大器的输出负反馈到放大器的输入的有源反馈装置,并且还具有反馈量控制器,其输入 通过控制所述主动反馈装置的反馈量来控制反馈信号到放大器。