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1. 发明申请

US20080089020A1 Solid State Drive (SSD) With Open Top And Bottom Covers 失效
标题翻译：固态硬盘（SSD），带顶盖和底盖
公开(公告)号：US20080089020A1
公开(公告)日：2008-04-17
申请号：US11929917
申请日：2007-10-30
申请人： Siew Hiew , Jim Ni , Abraham Ma , Qijin Li , Nan Nan
发明人： Siew Hiew , Jim Ni , Abraham Ma , Qijin Li , Nan Nan
IPC分类号： H05K5/00
CPC分类号： H05K9/0067
摘要： A solid state drive (SSD) device includes a printed-circuit board assembly (PCBA), a connector mounted on the circuit board, an open-frame support-type housing including first and second parallel elongated brackets extending along opposing peripheral edges of said circuit board, each bracket including a first connecting structure for securing the circuit board to the housing, and a second connecting structure for connecting the housing to an internal rack frame of a host system. The open-frame support type housing does not include a top cover and a bottom cover, whereby both of said opposing first and second surfaces are exposed by first and second openings. The housing includes optional end rails that form a box-like frame. The elongated brackets are formed using die-cast metal, stamped metal, or molded plastic with copper posts. Optional clamp-type brackets clamp along side edges of the PCBA.
摘要翻译：固态驱动器（SSD）装置包括印刷电路板组件（PCBA），安装在电路板上的连接器，开放式框架支撑型壳体，包括沿着所述电路的相对外围边缘延伸的第一和第二平行细长支架每个支架包括用于将电路板固定到壳体的第一连接结构，以及用于将壳体连接到主机系统的内部机架框架的第二连接结构。开放框架支撑型壳体不包括顶盖和底盖，由此所述相对的第一表面和第二表面都由第一和第二开口暴露。壳体包括形成盒状框架的可选端部轨道。细长支架使用压铸金属，冲压金属或具有铜柱的模制塑料形成。可选的夹式支架夹在PCBA的侧边缘。

2. 发明申请

US20080067248A1 Extended USB Dual-Personality Card Reader 有权
标题翻译：扩展USB双人格读卡器
公开(公告)号：US20080067248A1
公开(公告)日：2008-03-20
申请号：US11927549
申请日：2007-10-29
申请人： Siew Hiew , Nan Nan , Jim Ni , Abraham Ma
发明人： Siew Hiew , Nan Nan , Jim Ni , Abraham Ma
IPC分类号： G06K7/06
CPC分类号： G06K19/077 , G06K19/07732 , G06K19/07741
摘要： A dual-personality card reader system supports both USB and micro-SD devices using a card reader and an extended 9-pin USB socket. The card reader includes a PCBA having four standard USB metal contact pads and several extended purpose contact pads disposed on an upper side, components and IC chips covered by a molded case on a lower side, a molded lead-frame connector mounted on the PCBA and including five forward-facing extended purpose pins and eight rear-facing micro-SD connector pins that communicate with the PCBA through the extended purpose contact pads, and a housing including a slot for receiving a micro-SD card such that it communicates with the PCBA through the micro-SD connector pins. The extended 9-pin USB socket includes standard USB contacts and extended use contacts that communicate with the PCBA through the standard USB metal contacts and forward-facing extended purpose pins. The PCBA includes dual-personality electronics for SD/USB communications.
摘要翻译：双卡个人读卡器系统使用读卡器和扩展的9针USB插座支持USB和micro-SD设备。读卡器包括具有四个标准USB金属接触焊盘和设置在上侧的多个扩展目的接触焊盘的PCBA，在下侧由模制壳体覆盖的部件和IC芯片，安装在PCBA上的模制引线框架连接器和包括五个前向扩展用引脚和八个后面的micro-SD连接器引脚，其通过扩展目的接触焊盘与PCBA通信，以及壳体，其包括用于接收微型SD卡的插槽，使得其与PCBA通信通过micro-SD连接器引脚。扩展的9针USB插座包括标准USB触点和扩展使用触点，通过标准USB金属触点和前端扩展目的引脚与PCBA通信。 PCBA包括用于SD / USB通信的双人格电子设备。

3. 发明申请

US20080037308A1 Fixed Write-Protect Seamless Memory Card 失效
标题翻译：固定写保护无缝存储卡
公开(公告)号：US20080037308A1
公开(公告)日：2008-02-14
申请号：US11770661
申请日：2007-06-28
申请人： Siew Hiew , Nan Nan , Abraham Ma , Jim Ni
发明人： Siew Hiew , Nan Nan , Abraham Ma , Jim Ni
IPC分类号： G11C5/00 , H05K3/10
CPC分类号： G06K19/07724 , G06K19/077 , G06K19/07732 , G11C5/04 , G11C2029/4402 , H01L23/5388 , H01L25/50 , H01L2924/0002 , H05K1/117 , H05K3/0052 , H05K3/284 , H05K2201/09063 , H05K2201/0909 , H05K2201/10053 , H05K2201/10159 , H05K2201/10446 , H05K2203/1316 , Y10T29/49155 , H01L2924/00
摘要： In an embodiment of the present invention, a memory card includes a bottom plastic piece having a plurality of lateral sides, one of which includes a notch, and a cavity interposed along the lateral sides. A printed circuit board (PCB) assembly, including memory, is positioned in the cavity. A fin-structure is created as part of the manufacturing process of the bottom plastic piece of the card. The memory card is configured to function in a read-write mode when the fin-structure is present, and in a write-protect mode when the fins are snapped off, and the notch is exposed. Alternatively, a plug device can be insertably positioned into the notch, causing the memory card to function in a read-write mode when the plug device is positioned into the notch, and in a write-protect mode when the plug device is removed and the notch is exposed.
摘要翻译：在本发明的一个实施例中，存储卡包括底部塑料片，其具有多个横向侧面，其中一个包括凹口，以及沿横向插入的空腔。包括存储器的印刷电路板（PCB）组件位于空腔中。作为卡的底部塑料件的制造过程的一部分，形成翅片结构。当存在鳍结构时，存储卡被配置为以读写模式工作，并且当散热片被卡扣并且凹口暴露时以写保护模式工作。或者，插头装置可插入凹口中，当插头装置位于凹口中时，存储卡可以以读写模式工作，并且当插头装置被移除时以写保护模式缺口暴露。

4. 发明申请

US20080041966A1 Mid-Seam Package Methods of Manufacture for Memory Cards Using Ultraviolet Cure Adhesive and Ultra-Sonic Press 审中-公开
标题翻译：使用紫外线固化粘合剂和超声波印刷机的存储卡制造中间封装方法
公开(公告)号：US20080041966A1
公开(公告)日：2008-02-21
申请号：US11851336
申请日：2007-09-06
申请人： Siew Hiew , Nan Nan , Abraham Ma , Jim Ni , Ming-Shiang Shen
发明人： Siew Hiew , Nan Nan , Abraham Ma , Jim Ni , Ming-Shiang Shen
IPC分类号： G06K19/06 , H01R43/00
CPC分类号： G11C7/24 , G06K19/07732 , Y10T29/49117
摘要： In an embodiment of the present invention, the hollow shell of a mid-seam memory card is composed of three, independently formed, plastic pieces—a bottom plastic piece, a top plastic piece, and a plastic lid. The plastic pieces are cross-linked using, for example, ultraviolet light (UV) activated epoxy, or ultrasonic-press methods. A printed circuit board (PCB) assembly, including memory, is positioned within the cavity of the plastic pieces, and the lid is attached. The PCB assembly can be made using chip on board (COB) or surface mount technology (SMT) components attached using ball grid array (BGA) or thin and small outline package (TSOP) connections. Various read-write/write-protect devices are possible, and can be implemented in the form of a physical feature present on one of the lateral sides of the bottom and top plastic pieces. Such devices allow the card to be read from, or written to, when in read-write mode; and upon action by the user, cause the card to function in a write-protect mode, where no more information can be written to the card's memory. These devices may be manifested as dynamic switches, removably connectible plugs, or permanently removable fin-structures.
摘要翻译：在本发明的一个实施例中，中缝存储卡的中空壳由三个独立形成的塑料件组成，一个底部塑料件，一个顶部塑料件和一个塑料盖。使用例如紫外线（UV）活化的环氧树脂或超声波压制方法将塑料片交联。包括存储器在内的印刷电路板（PCB）组件位于塑料片的空腔内，盖子被连接。 PCB组件可以使用板载（COB）或使用球栅阵列（BGA）或薄型和小型外形封装（TSOP）连接连接的表面贴装技术（SMT）组件进行制造。各种读/写保护装置是可能的，并且可以以存在于底部和顶部塑料件的侧面之一中的物理特征的形式来实现。这样的设备允许在读写模式下读取或写入卡; 并且在用户动作时，使得卡以写保护模式工作，其中不再有信息可以写入卡的存储器。这些装置可以表现为动态开关，可拆卸的可连接插头或永久可拆卸的鳍结构。

5. 发明申请

US20080064271A1 Plug and cap for a Universal-Serial-Bus (USB) device 失效
标题翻译：通用串行总线（USB）设备的插头和盖子
公开(公告)号：US20080064271A1
公开(公告)日：2008-03-13
申请号：US11901604
申请日：2007-09-17
申请人： Siew Hiew , Jim Ni , Abraham Ma , David Nguyen
发明人： Siew Hiew , Jim Ni , Abraham Ma , David Nguyen
IPC分类号： B23P19/04 , H01R13/502
CPC分类号： H01R13/6395 , H01R24/62 , Y10T29/49838
摘要： Embodiments of a plug and cap of a Universal-Serial-Bus (USB) device have been presented. In one embodiment, a USB device includes a main body, a piece of string, and a cap. The main body has a printed circuit board assembly (PCBA) and a casing, wherein the PCBA is partially housed in the casing, and the PCBA further includes a USB connector protruding out of the casing at a first end of the casing. The piece of string is coupled to the main body and the cap. The cap is detachably coupled to the first end of the casing of the main body to cover the USB connector, wherein the cap remains indirectly coupled to the casing via the piece of string when the cap is detached from the first end of the casing to expose the USB connector.
摘要翻译：已经提出了通用串行总线（USB）设备的插头和盖的实施例。在一个实施例中，USB设备包括主体，弦线和盖。主体具有印刷电路板组件（PCBA）和壳体，其中PCBA部分地容纳在壳体中，并且PCBA还包括在壳体的第一端处从壳体突出的USB连接器。琴弦连接到主体和帽上。盖可拆卸地联接到主体的壳体的第一端以覆盖USB连接器，其中当帽从壳体的第一端分离以暴露时，盖保持通过弦线间接地联接到壳体 USB连接器。

6. 发明申请

US20080059680A1 Single Chip Universal Serial Bus (USB) Package with Metal Housing 有权
标题翻译：带金属外壳的单芯片通用串行总线（USB）封装
公开(公告)号：US20080059680A1
公开(公告)日：2008-03-06
申请号：US11927387
申请日：2007-10-29
申请人： Siew Hiew , Jim Ni , Abraham Ma , Ming-Shiang Shen
发明人： Siew Hiew , Jim Ni , Abraham Ma , Ming-Shiang Shen
IPC分类号： G06F13/00
CPC分类号： G06K19/077 , G06K19/07732 , H05K5/0278
摘要： A Universal Serial Bus (USB) memory card includes a tube metal housing that is rectangularly-shaped and a Chip-On-Board (COB)-Universal Serial Bus (USB) device and a carrier substrate having a U-block disposed on one side of thereof and vertically extending upwardly from a bottom surface of the U-block, the COB-USB device positioned on the carrier substrate forming a USB card sub-assembly, the USB card sub-assembly being securely located inside the metal housing with the U-block serving to stop the COB-USB device from slipping out of the metal housing.
摘要翻译：通用串行总线（USB）存储卡包括矩形的管状金属外壳和片上芯片（COB） - 通用串行总线（USB）设备和具有设置在一侧的U形块的载体基板并且从U形块的底面垂直向上延伸，COB-USB装置定位在形成USB卡子组件的载体衬底上，USB卡子组件牢固地位于金属外壳内，U形块用于停止COB-USB设备从金属外壳滑出。

7. 发明申请

US20080020641A1 Single Chip USB Packages By Various Assembly Methods 失效
标题翻译：单芯片USB封装通过各种装配方法
公开(公告)号：US20080020641A1
公开(公告)日：2008-01-24
申请号：US11859685
申请日：2007-09-21
申请人： Siew Hiew , Jim Ni , Abraham Ma , Ming-Shiang Shen
发明人： Siew Hiew , Jim Ni , Abraham Ma , Ming-Shiang Shen
IPC分类号： H01R13/648
CPC分类号： H05K3/284 , H01L24/97 , H01L2224/48227 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/0103 , H01L2924/01033 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12041 , H01L2924/14 , H01L2924/19041 , H01R13/665 , H05K1/117 , H05K5/0278 , H01L2224/85
摘要： A low-profile Universal-Serial-Bus (USB) assembly includes a modular USB core component and an external case. The modular USB core component includes a PCBA in which all passive components and unpackaged IC chips are attached to a single side of a PCB opposite to the metal contacts. The IC chips (e.g., USB controller, flash memory) are attached to the PCB by wire bonding or other chip-on-board (COB) technique. The passive components are attached by conventional surface mount technology (SMT) techniques. A molded housing is then formed over the IC chips and passive components such that the device has a uniform thickness. The modular USB core component is then inserted or otherwise combined with an external plastic case to provide a USB assembly. An optional carrying case is disclosed.
摘要翻译：一个低调的通用串行总线（USB）组件包括一个模块化的USB内核组件和一个外壳。模块化USB核心组件包括一个PCBA，其中所有无源组件和未封装的IC芯片都连接到与金属触点相对的PCB的单侧。 IC芯片（例如，USB控制器，闪速存储器）通过引线接合或其它板上芯片（COB）技术附接到PCB。无源元件通过传统的表面贴装技术（SMT）技术连接起来。然后在IC芯片和无源部件上形成模制外壳，使得该装置具有均匀的厚度。然后将模块化的USB核心组件插入或以外部塑料外壳组合以提供USB组件。公开了一种可选的手提箱。

8. 发明申请

US20080006927A1 Manufacturing Process For Single-Chip MMC/SD Flash Memory Device With Molded Asymmetric Circuit Board 失效
标题翻译：具有模制不对称电路板的单芯片MMC / SD闪存器件的制造工艺
公开(公告)号：US20080006927A1
公开(公告)日：2008-01-10
申请号：US11831888
申请日：2007-07-31
申请人： Siew Hiew , Jim Ni , Paul Hsueh , Charles Lee , Ming-Shiang Shen
发明人： Siew Hiew , Jim Ni , Paul Hsueh , Charles Lee , Ming-Shiang Shen
IPC分类号： H01L23/488 , H01L21/52
CPC分类号： H05K3/284 , H01L23/544 , H01L24/48 , H01L24/97 , H01L2223/54406 , H01L2223/54433 , H01L2223/54486 , H01L2224/32145 , H01L2224/48091 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01033 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/12041 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H05K1/117 , H05K2201/09936 , H05K2201/10159 , Y10T29/49126 , H01L2224/85 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An MMC/SD core unit includes a PCBA in which all passive components and unpackaged IC chips are attached to a single side of a PCB opposite to the metal contacts. The IC chips include, for example, a controller chip and a flash memory chip, or a single-chip (combined controller/flash memory) chip. Multiple flash IC chips are optionally stacked to increase storage capacity. The IC chip(s) are attached to the PCB by wire bonding or other chip-on-board (COB) technique. The passive components are attached by conventional surface mount technology (SMT) techniques. A molded housing is then formed over the IC chips and passive components such that the device has a uniform thickness. The MMC/SD core unit is then inserted or otherwise mounted in an eternal casing to provide a finished MMC/SD device.
摘要翻译： MMC / SD核心单元包括PCBA，其中所有无源组件和未封装的IC芯片附接到与金属触点相对的PCB的单侧。 IC芯片例如包括控制器芯片和闪存芯片，或单芯片（组合的控制器/闪存）芯片。可选择堆叠多个闪存IC芯片以增加存储容量。 IC芯片通过引线接合或其他芯片上（COB）芯片技术连接到PCB。无源元件通过传统的表面贴装技术（SMT）技术连接起来。然后在IC芯片和无源部件上形成模制外壳，使得该装置具有均匀的厚度。然后将MMC / SD核心单元插入或以其他方式安装在永久壳体中以提供完成的MMC / SD设备。

9. 发明申请

US20080032561A1 Slim memory card with retractable protection shield 审中-公开
标题翻译：带可伸缩保护罩的超薄记忆卡
公开(公告)号：US20080032561A1
公开(公告)日：2008-02-07
申请号：US11907024
申请日：2007-10-09
申请人： Siew Hiew , Jim Ni , Ming-Shiang Shen
发明人： Siew Hiew , Jim Ni , Ming-Shiang Shen
IPC分类号： H01R33/00
CPC分类号： H01R13/447 , G06K19/07732 , G06K19/07743 , H01R13/6658 , Y10T29/49124
摘要： A slim USB memory card is provided with retractable protection shield. A printed circuit board has a surface formed thereon a plurality of metal contacts. A main frame piece has two frame edges parallel with and opposite to each other for housing the printed circuit board. Each frame edge has an inner edge defined therein a track. A protection shield piece has two lateral sides. Each lateral side has a sliding bar, wherein the sliding bars sit on the tracks at the inner edges of the main frame piece, so as to glide back and forth on the tracks to perform cover and retract movement to protect the metal contacts.
摘要翻译：一个细长的USB存储卡提供有可伸缩保护屏蔽。印刷电路板具有在其上形成有多个金属触点的表面。主框架件具有彼此平行并彼此相对的两个框架边缘，用于容纳印刷电路板。每个框架边缘在其中限定有一个轨道。保护屏蔽片有两个侧面。每个侧面具有滑动杆，其中滑动杆位于主框架件的内边缘处的轨道上，以便在轨道上来回滑动以执行覆盖和缩回运动以保护金属触点。

10. 发明申请

US20070293088A1 Molding Methods To Manufacture Single-Chip Chip-On-Board USB Device 有权
标题翻译：制造单芯片片上USB设备的成型方法
公开(公告)号：US20070293088A1
公开(公告)日：2007-12-20
申请号：US11773830
申请日：2007-07-05
申请人： Siew Hiew , Jim Ni , Charles Lee , I-Kang Yu , Ming-Shiang Shen
发明人： Siew Hiew , Jim Ni , Charles Lee , I-Kang Yu , Ming-Shiang Shen
IPC分类号： H01R13/648 , G06F3/00
CPC分类号： G06F1/1632 , H01L24/97 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01074 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/12041 , H01L2924/14 , H01L2924/19041 , H05K1/117 , H05K3/0052 , H05K3/284 , H05K5/0278 , H05K2203/1316 , H01L2924/00014 , H01L2224/85
摘要： A low-profile Universal-Serial-Bus (USB) device includes a PCBA in which all passive components and unpackaged IC chips are attached to a single side of a PCB opposite to the metal contacts. The IC chips include, for example, a USB controller chip and a flash memory chip, or a single-chip (combined USB controller/flash memory) chip. Multiple flash IC chips are optionally stacked to increase storage capacity. The IC chip(s) are attached to the PCB by wire bonding or other chip-on-board (COB) technique. The passive components are attached by conventional surface mount technology (SMT) techniques. A molded housing is then formed over the IC chips and passive components such that the device has a uniform thickness. The low-profile USB device is optionally used as a modular insert that is mounted onto a metal case to provide a USB assembly having a plug shell similar to a standard USB male connector.
摘要翻译：一个低调的通用串行总线（USB）设备包括一个PCBA，其中所有无源组件和未封装的IC芯片都连接到与金属触点相对的PCB的单面。 IC芯片例如包括USB控制器芯片和闪存芯片，或单芯片（组合的USB控制器/闪存）芯片。可选择堆叠多个闪存IC芯片以增加存储容量。 IC芯片通过引线接合或其他芯片上（COB）芯片技术连接到PCB。无源元件通过传统的表面贴装技术（SMT）技术连接起来。然后在IC芯片和无源部件上形成模制外壳，使得该装置具有均匀的厚度。低调USB设备可选地用作安装在金属外壳上的模块化插件，以提供具有类似于标准USB公连接器的插头外壳的USB组件。

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