专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20080041966A1 Mid-Seam Package Methods of Manufacture for Memory Cards Using Ultraviolet Cure Adhesive and Ultra-Sonic Press 审中-公开
标题翻译：使用紫外线固化粘合剂和超声波印刷机的存储卡制造中间封装方法
公开(公告)号：US20080041966A1
公开(公告)日：2008-02-21
申请号：US11851336
申请日：2007-09-06
申请人： Siew Hiew , Nan Nan , Abraham Ma , Jim Ni , Ming-Shiang Shen
发明人： Siew Hiew , Nan Nan , Abraham Ma , Jim Ni , Ming-Shiang Shen
IPC分类号： G06K19/06 , H01R43/00
CPC分类号： G11C7/24 , G06K19/07732 , Y10T29/49117
摘要： In an embodiment of the present invention, the hollow shell of a mid-seam memory card is composed of three, independently formed, plastic pieces—a bottom plastic piece, a top plastic piece, and a plastic lid. The plastic pieces are cross-linked using, for example, ultraviolet light (UV) activated epoxy, or ultrasonic-press methods. A printed circuit board (PCB) assembly, including memory, is positioned within the cavity of the plastic pieces, and the lid is attached. The PCB assembly can be made using chip on board (COB) or surface mount technology (SMT) components attached using ball grid array (BGA) or thin and small outline package (TSOP) connections. Various read-write/write-protect devices are possible, and can be implemented in the form of a physical feature present on one of the lateral sides of the bottom and top plastic pieces. Such devices allow the card to be read from, or written to, when in read-write mode; and upon action by the user, cause the card to function in a write-protect mode, where no more information can be written to the card's memory. These devices may be manifested as dynamic switches, removably connectible plugs, or permanently removable fin-structures.
摘要翻译：在本发明的一个实施例中，中缝存储卡的中空壳由三个独立形成的塑料件组成，一个底部塑料件，一个顶部塑料件和一个塑料盖。使用例如紫外线（UV）活化的环氧树脂或超声波压制方法将塑料片交联。包括存储器在内的印刷电路板（PCB）组件位于塑料片的空腔内，盖子被连接。 PCB组件可以使用板载（COB）或使用球栅阵列（BGA）或薄型和小型外形封装（TSOP）连接连接的表面贴装技术（SMT）组件进行制造。各种读/写保护装置是可能的，并且可以以存在于底部和顶部塑料件的侧面之一中的物理特征的形式来实现。这样的设备允许在读写模式下读取或写入卡; 并且在用户动作时，使得卡以写保护模式工作，其中不再有信息可以写入卡的存储器。这些装置可以表现为动态开关，可拆卸的可连接插头或永久可拆卸的鳍结构。

2. 发明申请

US20080059680A1 Single Chip Universal Serial Bus (USB) Package with Metal Housing 有权
标题翻译：带金属外壳的单芯片通用串行总线（USB）封装
公开(公告)号：US20080059680A1
公开(公告)日：2008-03-06
申请号：US11927387
申请日：2007-10-29
申请人： Siew Hiew , Jim Ni , Abraham Ma , Ming-Shiang Shen
发明人： Siew Hiew , Jim Ni , Abraham Ma , Ming-Shiang Shen
IPC分类号： G06F13/00
CPC分类号： G06K19/077 , G06K19/07732 , H05K5/0278
摘要： A Universal Serial Bus (USB) memory card includes a tube metal housing that is rectangularly-shaped and a Chip-On-Board (COB)-Universal Serial Bus (USB) device and a carrier substrate having a U-block disposed on one side of thereof and vertically extending upwardly from a bottom surface of the U-block, the COB-USB device positioned on the carrier substrate forming a USB card sub-assembly, the USB card sub-assembly being securely located inside the metal housing with the U-block serving to stop the COB-USB device from slipping out of the metal housing.
摘要翻译：通用串行总线（USB）存储卡包括矩形的管状金属外壳和片上芯片（COB） - 通用串行总线（USB）设备和具有设置在一侧的U形块的载体基板并且从U形块的底面垂直向上延伸，COB-USB装置定位在形成USB卡子组件的载体衬底上，USB卡子组件牢固地位于金属外壳内，U形块用于停止COB-USB设备从金属外壳滑出。

3. 发明申请

US20080020641A1 Single Chip USB Packages By Various Assembly Methods 失效
标题翻译：单芯片USB封装通过各种装配方法
公开(公告)号：US20080020641A1
公开(公告)日：2008-01-24
申请号：US11859685
申请日：2007-09-21
申请人： Siew Hiew , Jim Ni , Abraham Ma , Ming-Shiang Shen
发明人： Siew Hiew , Jim Ni , Abraham Ma , Ming-Shiang Shen
IPC分类号： H01R13/648
CPC分类号： H05K3/284 , H01L24/97 , H01L2224/48227 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/0103 , H01L2924/01033 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12041 , H01L2924/14 , H01L2924/19041 , H01R13/665 , H05K1/117 , H05K5/0278 , H01L2224/85
摘要： A low-profile Universal-Serial-Bus (USB) assembly includes a modular USB core component and an external case. The modular USB core component includes a PCBA in which all passive components and unpackaged IC chips are attached to a single side of a PCB opposite to the metal contacts. The IC chips (e.g., USB controller, flash memory) are attached to the PCB by wire bonding or other chip-on-board (COB) technique. The passive components are attached by conventional surface mount technology (SMT) techniques. A molded housing is then formed over the IC chips and passive components such that the device has a uniform thickness. The modular USB core component is then inserted or otherwise combined with an external plastic case to provide a USB assembly. An optional carrying case is disclosed.
摘要翻译：一个低调的通用串行总线（USB）组件包括一个模块化的USB内核组件和一个外壳。模块化USB核心组件包括一个PCBA，其中所有无源组件和未封装的IC芯片都连接到与金属触点相对的PCB的单侧。 IC芯片（例如，USB控制器，闪速存储器）通过引线接合或其它板上芯片（COB）技术附接到PCB。无源元件通过传统的表面贴装技术（SMT）技术连接起来。然后在IC芯片和无源部件上形成模制外壳，使得该装置具有均匀的厚度。然后将模块化的USB核心组件插入或以外部塑料外壳组合以提供USB组件。公开了一种可选的手提箱。

4. 发明申请

US20080006927A1 Manufacturing Process For Single-Chip MMC/SD Flash Memory Device With Molded Asymmetric Circuit Board 失效
标题翻译：具有模制不对称电路板的单芯片MMC / SD闪存器件的制造工艺
公开(公告)号：US20080006927A1
公开(公告)日：2008-01-10
申请号：US11831888
申请日：2007-07-31
申请人： Siew Hiew , Jim Ni , Paul Hsueh , Charles Lee , Ming-Shiang Shen
发明人： Siew Hiew , Jim Ni , Paul Hsueh , Charles Lee , Ming-Shiang Shen
IPC分类号： H01L23/488 , H01L21/52
CPC分类号： H05K3/284 , H01L23/544 , H01L24/48 , H01L24/97 , H01L2223/54406 , H01L2223/54433 , H01L2223/54486 , H01L2224/32145 , H01L2224/48091 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01033 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/12041 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H05K1/117 , H05K2201/09936 , H05K2201/10159 , Y10T29/49126 , H01L2224/85 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An MMC/SD core unit includes a PCBA in which all passive components and unpackaged IC chips are attached to a single side of a PCB opposite to the metal contacts. The IC chips include, for example, a controller chip and a flash memory chip, or a single-chip (combined controller/flash memory) chip. Multiple flash IC chips are optionally stacked to increase storage capacity. The IC chip(s) are attached to the PCB by wire bonding or other chip-on-board (COB) technique. The passive components are attached by conventional surface mount technology (SMT) techniques. A molded housing is then formed over the IC chips and passive components such that the device has a uniform thickness. The MMC/SD core unit is then inserted or otherwise mounted in an eternal casing to provide a finished MMC/SD device.
摘要翻译： MMC / SD核心单元包括PCBA，其中所有无源组件和未封装的IC芯片附接到与金属触点相对的PCB的单侧。 IC芯片例如包括控制器芯片和闪存芯片，或单芯片（组合的控制器/闪存）芯片。可选择堆叠多个闪存IC芯片以增加存储容量。 IC芯片通过引线接合或其他芯片上（COB）芯片技术连接到PCB。无源元件通过传统的表面贴装技术（SMT）技术连接起来。然后在IC芯片和无源部件上形成模制外壳，使得该装置具有均匀的厚度。然后将MMC / SD核心单元插入或以其他方式安装在永久壳体中以提供完成的MMC / SD设备。

5. 发明申请

US20080032561A1 Slim memory card with retractable protection shield 审中-公开
标题翻译：带可伸缩保护罩的超薄记忆卡
公开(公告)号：US20080032561A1
公开(公告)日：2008-02-07
申请号：US11907024
申请日：2007-10-09
申请人： Siew Hiew , Jim Ni , Ming-Shiang Shen
发明人： Siew Hiew , Jim Ni , Ming-Shiang Shen
IPC分类号： H01R33/00
CPC分类号： H01R13/447 , G06K19/07732 , G06K19/07743 , H01R13/6658 , Y10T29/49124
摘要： A slim USB memory card is provided with retractable protection shield. A printed circuit board has a surface formed thereon a plurality of metal contacts. A main frame piece has two frame edges parallel with and opposite to each other for housing the printed circuit board. Each frame edge has an inner edge defined therein a track. A protection shield piece has two lateral sides. Each lateral side has a sliding bar, wherein the sliding bars sit on the tracks at the inner edges of the main frame piece, so as to glide back and forth on the tracks to perform cover and retract movement to protect the metal contacts.
摘要翻译：一个细长的USB存储卡提供有可伸缩保护屏蔽。印刷电路板具有在其上形成有多个金属触点的表面。主框架件具有彼此平行并彼此相对的两个框架边缘，用于容纳印刷电路板。每个框架边缘在其中限定有一个轨道。保护屏蔽片有两个侧面。每个侧面具有滑动杆，其中滑动杆位于主框架件的内边缘处的轨道上，以便在轨道上来回滑动以执行覆盖和缩回运动以保护金属触点。

6. 发明申请

US20070293088A1 Molding Methods To Manufacture Single-Chip Chip-On-Board USB Device 有权
标题翻译：制造单芯片片上USB设备的成型方法
公开(公告)号：US20070293088A1
公开(公告)日：2007-12-20
申请号：US11773830
申请日：2007-07-05
申请人： Siew Hiew , Jim Ni , Charles Lee , I-Kang Yu , Ming-Shiang Shen
发明人： Siew Hiew , Jim Ni , Charles Lee , I-Kang Yu , Ming-Shiang Shen
IPC分类号： H01R13/648 , G06F3/00
CPC分类号： G06F1/1632 , H01L24/97 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01074 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/12041 , H01L2924/14 , H01L2924/19041 , H05K1/117 , H05K3/0052 , H05K3/284 , H05K5/0278 , H05K2203/1316 , H01L2924/00014 , H01L2224/85
摘要： A low-profile Universal-Serial-Bus (USB) device includes a PCBA in which all passive components and unpackaged IC chips are attached to a single side of a PCB opposite to the metal contacts. The IC chips include, for example, a USB controller chip and a flash memory chip, or a single-chip (combined USB controller/flash memory) chip. Multiple flash IC chips are optionally stacked to increase storage capacity. The IC chip(s) are attached to the PCB by wire bonding or other chip-on-board (COB) technique. The passive components are attached by conventional surface mount technology (SMT) techniques. A molded housing is then formed over the IC chips and passive components such that the device has a uniform thickness. The low-profile USB device is optionally used as a modular insert that is mounted onto a metal case to provide a USB assembly having a plug shell similar to a standard USB male connector.
摘要翻译：一个低调的通用串行总线（USB）设备包括一个PCBA，其中所有无源组件和未封装的IC芯片都连接到与金属触点相对的PCB的单面。 IC芯片例如包括USB控制器芯片和闪存芯片，或单芯片（组合的USB控制器/闪存）芯片。可选择堆叠多个闪存IC芯片以增加存储容量。 IC芯片通过引线接合或其他芯片上（COB）芯片技术连接到PCB。无源元件通过传统的表面贴装技术（SMT）技术连接起来。然后在IC芯片和无源部件上形成模制外壳，使得该装置具有均匀的厚度。低调USB设备可选地用作安装在金属外壳上的模块化插件，以提供具有类似于标准USB公连接器的插头外壳的USB组件。

7. 发明申请

US20080094807A1 Single Chip USB Packages With Swivel Cover 失效
标题翻译：带旋转盖的单芯片USB封装
公开(公告)号：US20080094807A1
公开(公告)日：2008-04-24
申请号：US11874176
申请日：2007-10-17
申请人： Siew Hiew , Jin Kim , Abraham Ma , Ming-Shiang Shen
发明人： Siew Hiew , Jin Kim , Abraham Ma , Ming-Shiang Shen
IPC分类号： H05K3/00 , H05K1/14
CPC分类号： H01L21/565 , G06F12/1416 , G06F21/32 , G06F21/78 , G06K9/00087 , G06K19/07 , G06K19/07354 , G07C9/00087 , H01L24/97 , H01L25/18 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01033 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12041 , H01L2924/14 , H01L2924/19041 , H01L2924/19105 , H05K1/117 , H05K3/284 , H05K5/0278 , Y10T29/49124 , H01L2224/85 , H01L2924/00014
摘要： A low-profile Universal-Serial-Bus (USB) assembly includes a modular USB core component that is mounted into a swivel casing. The modular USB core component includes a PCBA in which all passive components and unpackaged IC chips are attached to a single side of a PCB opposite to the metal contacts. The IC chips (e.g., USB controller, flash memory) are attached to the PCB by wire bonding or other chip-on-board (COB) technique. The passive components are attached by conventional surface mount technology (SMT) techniques. The swivel casing includes a holder that is pivotably mounted into an external housing by way of a pivot pin. The pivot pin is either a separate structure that is inserted into holes formed in the holder and housing, or is integrally formed on the holder.
摘要翻译：一个低调的通用串行总线（USB）组件包括安装在旋转外壳中的模块化USB内核组件。模块化USB核心组件包括一个PCBA，其中所有无源组件和未封装的IC芯片都连接到与金属触点相对的PCB的单侧。 IC芯片（例如，USB控制器，闪速存储器）通过引线接合或其它板上芯片（COB）技术附接到PCB。无源元件通过传统的表面贴装技术（SMT）技术连接起来。旋转壳体包括通过枢轴销可枢转地安装到外壳中的保持器。枢轴销是分离的结构，其插入形成在保持器和壳体中的孔中，或者一体地形成在保持器上。

8. 发明申请

US20080093720A1 Single Chip USB Packages With Contact-Pins Cover 有权
标题翻译：带触点引脚的单芯片USB封装
公开(公告)号：US20080093720A1
公开(公告)日：2008-04-24
申请号：US11874174
申请日：2007-10-17
申请人： Siew Hiew , Jin Kim , Abraham Ma , Ming-Shiang Shen
发明人： Siew Hiew , Jin Kim , Abraham Ma , Ming-Shiang Shen
IPC分类号： H01L23/043 , H01L21/50
CPC分类号： H05K5/0278 , H01L21/565 , H01L24/97 , H01L25/18 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/0103 , H01L2924/01033 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12041 , H01L2924/14 , H01L2924/19041 , H01L2924/19105 , H05K1/117 , H05K3/284 , H01L2924/00014 , H01L2224/85
摘要： A low-profile Universal-Serial-Bus (USB) assembly includes a modular USB core component that is retractably mounted into an external housing. The modular USB core component includes a PCBA in which all passive components and unpackaged IC chips are attached to a single side of a PCB opposite to the metal contacts. The IC chips (e.g., USB controller, flash memory) are attached to the PCB by wire bonding or other chip-on-board (COB) technique. The passive components are attached by conventional surface mount technology (SMT) techniques. The housing includes a retractable mechanism that facilitates selective exposure of metal contacts, either by sliding a front portion of the modular USB core component into and out of a front opening of the housing, or by providing a cover plate that slidably covers the front portion of the modular USB core component.
摘要翻译：一个低调的通用串行总线（USB）组件包括可缩回地安装到外部外壳中的模块化USB内核组件。模块化USB核心组件包括一个PCBA，其中所有无源组件和未封装的IC芯片都连接到与金属触点相对的PCB的单侧。 IC芯片（例如，USB控制器，闪速存储器）通过引线接合或其它板上芯片（COB）技术附接到PCB。无源元件通过传统的表面贴装技术（SMT）技术连接起来。壳体包括可伸缩机构，其可以通过将模块化USB芯部件的前部部分滑入和移出壳体的前开口来促进金属触点的选择性暴露，或者通过提供可滑动地覆盖壳体的前部的盖板模块化的USB核心组件。

9. 发明申请

US20090097215A1 UV-EPOXY AND ULTRASONIC CASE ASSEMBLY METHODS FOR USB FLASH DRIVE 审中-公开
标题翻译：用于USB闪存驱动器的UV-环氧和超声波箱组件方法
公开(公告)号：US20090097215A1
公开(公告)日：2009-04-16
申请号：US11870435
申请日：2007-10-11
申请人： Siew S HIEW , Nan Nan , Jim Ni , Ming-Shiang Shen
发明人： Siew S HIEW , Nan Nan , Jim Ni , Ming-Shiang Shen
IPC分类号： H05K5/00
CPC分类号： H05K9/00
摘要： The present invention discloses UV-epoxy and ultrasonic case assembly methods for a USB flash drive, wherein a transparent or translucent top cover is fastened to a bottom cover containing a printed circuit board assembly via an UV-cure epoxy glue or an ultrasonic weld method. As the top cover of the USB flash drive is transparent or translucent, the USB flash drive has a see-through property and presents an aesthetic taste, which can attract the attention of consumers. Further, the method of the present invention uses less case parts and fewer steps and thus can fabricate a USB flash drive having a lower cost and a better quality at a higher throughput. Furthermore, the USB flash drive fabricated according to the method of the present invention has a better moisture resistance and a better water resistance.
摘要翻译：本发明公开了一种用于USB闪存驱动器的UV-环氧树脂和超声波外壳组装方法，其中透明或半透明的顶盖通过UV固化环氧胶或超声波焊接方法固定到包含印刷电路板组件的底盖上。由于USB闪存驱动器的顶盖是透明或半透明的，所以USB闪存驱动器具有透视属性，呈现出审美的味道，这可以吸引消费者的注意。此外，本发明的方法使用较少的部件和更少的步骤，因此可以以更高的吞吐量制造具有较低成本和更好质量的USB闪存驱动器。此外，根据本发明的方法制造的USB闪存驱动器具有更好的防潮性和更好的耐水性。

10. 发明申请

US20080003883A1 Manufacturing Process for a Super-Digital (SD) Flash Card with Slanted Asymmetric Circuit Board 失效
标题翻译：具有倾斜不对称电路板的超级数字（SD）闪存卡的制造工艺
公开(公告)号：US20080003883A1
公开(公告)日：2008-01-03
申请号：US11846733
申请日：2007-08-29
申请人： Jim Ni , Abraham Ma , Paul Hsueh , Ming-Shiang Shen
发明人： Jim Ni , Abraham Ma , Paul Hsueh , Ming-Shiang Shen
IPC分类号： H01R13/66
CPC分类号： G06K19/07743 , A45C2011/188 , G06F12/1416 , G06F21/32 , G06F21/78 , G06K9/00087 , G06K19/07 , G06K19/07354 , G06K19/077 , G06K19/07732 , G07C9/00087 , H05K1/117 , H05K1/118 , H05K1/189 , H05K3/284 , H05K3/4691 , H05K2201/091 , H05K2201/10159 , H05K2203/1527
摘要： A flash-memory device has a printed-circuit board assembly (PCBA) with a PCB with a flash-memory chip and a controller chip. The controller chip includes an external Secure-Digital (SD) interface, and a processing unit to read blocks of data from the flash-memory chip. The PCBA is encased inside an upper case and a lower case, with SD contact pads on the PCB that fit through contact openings in the upper case. Dividers between openings in the upper case that expose the SD contact pads also support the PCB at a slanted angle to the centerline of the device. The PCB slants upward at the far end to allow more thickness for the chips mounted to the bottom surface of the PCB, and slants downward at the insertion end to position the SD contact pads near the centerline. A metal switch-bar or an over-molded controller die may be substituted.
摘要翻译：闪存设备具有印刷电路板组件（PCBA），PCB组件具有闪存芯片和控制器芯片。控制器芯片包括一个外部安全数字（SD）接口，以及一个处理单元，用于从闪存芯片中读取数据块。 PCBA被封装在上壳体和下壳体内，PCB上的SD接触垫通过上壳体中的接触开口配合。暴露SD接触垫的上壳体中的开口之间的分隔线也以与设备中心线倾斜的角度支撑PCB。 PCB在远端向上倾斜以允许安装到PCB的底表面的芯片具有更大的厚度，并且在插入端向下倾斜以将SD接触垫定位在中心线附近。金属开关杆或过模制的控制器管芯可以被替代。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式