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1. 发明授权

US5707902A Composite bump structure and methods of fabrication 失效
标题翻译：复合凸块结构及其制造方法
公开(公告)号：US5707902A
公开(公告)日：1998-01-13
申请号：US507533
申请日：1995-07-26
申请人： Shyh-Ming Chang , Yu-Chi Lee , Jwo-Huei Jou
发明人： Shyh-Ming Chang , Yu-Chi Lee , Jwo-Huei Jou
IPC分类号： H01L21/60 , H01L23/485 , H01L21/44
CPC分类号： H01L24/13 , H01L24/11 , H01L2224/114 , H01L2224/116 , H01L2224/11901 , H01L2224/13019 , H01L2224/13021 , H01L2224/13099 , H01L2224/13609 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14
摘要： A composite bump structure and methods of forming the composite bump structure. The composite bump structure comprises a polymer body of relatively low Young's Modulus compared to metals covered by a conductive metal coating formed at the input/output pads of an integrated circuit element or substrate. The composite bump is formed using material deposition, lithography, and etching techniques. A layer of soldering metal can be formed on the composite bumps if this is desired for subsequent processing. A base metal pad covering the integrated circuit element input/output pad can be used to provide added flexibility in location of the composite bump. The composite bump can be formed directly on the input/output pad or on the base metal pad.
摘要翻译：复合凸块结构和形成复合凸块结构的方法。与由在集成电路元件或衬底的输入/输出焊盘处形成的导电金属涂层覆盖的金属相比，复合凸块结构包括相对低的杨氏模量的聚合物体。使用材料沉积，光刻和蚀刻技术形成复合凸块。如果需要后续处理，可以在复合凸块上形成一层焊接金属。可以使用覆盖集成电路元件输入/输出垫的基底金属垫来提供复合凸块的位置的增加的灵活性。复合凸块可以直接形成在输入/输出垫或基底金属垫上。

2. 发明授权

US6084301A Composite bump structures 失效
标题翻译：复合凸块结构
公开(公告)号：US6084301A
公开(公告)日：2000-07-04
申请号：US950376
申请日：1997-10-14
申请人： Shyh-Ming Chang , Yu-Chi Lee , Jwo-Huei Jou
发明人： Shyh-Ming Chang , Yu-Chi Lee , Jwo-Huei Jou
IPC分类号： H01L21/60 , H01L23/485 , H01L29/43 , H01L23/50
CPC分类号： H01L24/13 , H01L24/11 , H01L2224/114 , H01L2224/116 , H01L2224/11901 , H01L2224/13019 , H01L2224/13021 , H01L2224/13099 , H01L2224/13609 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14
摘要： A composite bump structure and methods of forming the composite bump structure. The composite bump structure comprises a polymer body of relatively low Young's Modulus compared to metals covered by a conductive metal coating formed at the input/output pads of an integrated circuit element or substrate. The composite bump is formed using material deposition, lithography, and etching techniques. A layer of soldering metal can be formed on the composite bumps if this is desired for subsequent processing. A base metal pad covering the integrated circuit element input/output pad can be used to provide added flexibility in location of the composite bump. The composite bump can be formed directly on the input/output pad or on the base metal pad.
摘要翻译：复合凸块结构和形成复合凸块结构的方法。与由在集成电路元件或衬底的输入/输出焊盘处形成的导电金属涂层覆盖的金属相比，复合凸块结构包括相对低的杨氏模量的聚合物体。使用材料沉积，光刻和蚀刻技术形成复合凸块。如果需要后续处理，可以在复合凸块上形成一层焊接金属。可以使用覆盖集成电路元件输入/输出垫的基底金属垫来提供复合凸块的位置的增加的灵活性。复合凸块可以直接形成在输入/输出垫或基底金属垫上。

3. 发明授权

US06537854B1 Method for bonding IC chips having multi-layered bumps with corrugated surfaces and devices formed 失效
标题翻译：用于接合具有波纹状表面的多层凸起的IC芯片和形成的器件的方法
公开(公告)号：US06537854B1
公开(公告)日：2003-03-25
申请号：US09317307
申请日：1999-05-24
申请人： Shyh-Ming Chang , Jwo-Huei Jou , Chi-Yuan Wu
发明人： Shyh-Ming Chang , Jwo-Huei Jou , Chi-Yuan Wu
IPC分类号： H01L2144
CPC分类号： H01L21/563 , H01L24/11 , H01L24/13 , H01L24/29 , H01L24/83 , H01L2224/05001 , H01L2224/05022 , H01L2224/05567 , H01L2224/05569 , H01L2224/05572 , H01L2224/05573 , H01L2224/13019 , H01L2224/13078 , H01L2224/13099 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13166 , H01L2224/13169 , H01L2224/13171 , H01L2224/13184 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83101 , H01L2224/83192 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/00 , H01L2924/3512 , H01L2924/00014
摘要： A method for bonding an IC chip formed with corrugated, multi-layered bumps to conductive elements on a substrate and devices formed by such method are disclosed. In the method, multi-layered bumps are formed by a cover layer of a conductive metal deposited on a base layer of a compliant material. The exposed bonding surface of the bump is formed in a corrugated fashion, or in a serrated shape with saw-tooth configurations. The saw-tooth configurations may either be rectangular or triangular. In the bonding method, instead of using an anisotropic conductive film loaded with conductive particles, a solid adhesive film without conductive particles or a liquid adhesive material without conductive particles can be utilized. The serrated bonding surface of the bumps is effective in expelling the adhesive material from the bonding interface between the bumps and the conductive elements such that a low resistance bond can be formed between an IC chip and a substrate. The solid adhesive layer or the liquid adhesive material, after bonding and curing, functions effectively as a moisture barrier layer.
摘要翻译：公开了一种用于将形成有波纹状多层凸起的IC芯片与基板上的导电元件和由该方法形成的器件接合的方法。在该方法中，多层凸起由沉积在柔性材料的基底层上的导电金属的覆盖层形成。凸起的暴露的接合表面以波纹形式形成，或者具有锯齿形状的锯齿状形状。锯齿配置可以是矩形或三角形。在接合方法中，代替使用负载有导电颗粒的各向异性导电膜，可以使用不具有导电颗粒的固体粘合剂膜或不具有导电颗粒的液体粘合剂材料。凸块的锯齿状接合面有效地将粘合剂材料从凸块和导电元件之间的结合界面排出，使得可以在IC芯片和基板之间形成低电阻结合。粘合和固化后的固体粘合剂层或液体粘合剂材料有效地用作防潮层。

4. 发明授权

US06767818B1 Method for forming electrically conductive bumps and devices formed 失效
标题翻译：形成导电凸块和器件的方法
公开(公告)号：US06767818B1
公开(公告)日：2004-07-27
申请号：US09634556
申请日：2000-08-07
申请人： Shyh-Ming Chang , Tai-Hong Chen , Yu-Te Hsieh , Chun-Ming Huang , Jui Ming Ni , Ching-Yun Chang , Jwo-Huei Jou
发明人： Shyh-Ming Chang , Tai-Hong Chen , Yu-Te Hsieh , Chun-Ming Huang , Jui Ming Ni , Ching-Yun Chang , Jwo-Huei Jou
IPC分类号： H01L2144
CPC分类号： H01L24/11 , H01L2224/05001 , H01L2224/05022 , H01L2224/05572 , H01L2224/114 , H01L2224/116 , H01L2224/13099 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2224/05624 , H01L2924/00014 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/05684 , H01L2224/05124 , H01L2224/05147
摘要： A method for forming electrically conductive bumps on a semiconductor substrate, or a semiconductor wafer and devices formed by the method are disclosed. In the method, a wafer that has an active surface, a plurality of conductive elements formed on the active surface and a passivation layer insulating the plurality of conductive bumps from each other is first provided. A first metal layer is then sputter deposited on top of the plurality of conductive elements and the passivation layer, followed by stencil printing a plurality of bumps of an insulating material on top of each one of the plurality of conductive elements. The plurality of bumps may be heat treated to a temperature of at least 100° C. for a period of at least 10 minutes for stress relief. A second metal layer is then sputter deposited on top of the plurality of bumps and the first metal layer. The first and the second metal layers are then patterned by a photolithographic process and formed by a wet or dry etching process to remove metal layers in areas in-between the plurality of bumps.
摘要翻译：公开了一种在半导体衬底或半导体晶片上形成导电凸块的方法以及通过该方法形成的器件。在该方法中，首先提供具有活性表面的晶片，形成在有源表面上的多个导电元件和使多个导电凸块彼此绝缘的钝化层。然后将第一金属层溅射沉积在多个导电元件和钝化层的顶部上，随后在多个导电元件中的每一个的顶部上模版印刷绝缘材料的多个凸块。多个凸起可以被热处理至至少100℃的温度至少10分钟的时间以减轻应力。然后将第二金属层溅射沉积在多个凸起和第一金属层的顶部上。然后通过光刻工艺对第一和第二金属层进行构图，并通过湿式或干式蚀刻工艺形成，以去除多个凸块之间的区域中的金属层。

5. 发明授权

US08643287B2 Lighting device with switchable day/night illumination mode 有权
标题翻译：照明装置具有可切换的日/夜照明模式
公开(公告)号：US08643287B2
公开(公告)日：2014-02-04
申请号：US13184716
申请日：2011-07-18
申请人： Jwo-Huei Jou
发明人： Jwo-Huei Jou
IPC分类号： H05B37/02
CPC分类号： H05B33/0869
摘要： The present invention relates to a lighting device with switchable day/night illumination mode, comprising: a main controlling unit, a driving unit, a lighting unit, a light filtering unit, an illumination mode switching unit, and a power management unit, wherein the lighting unit is coupled to the driving unit and has a plurality of light-emitting devices. Moreover, the main controlling unit is used for controlling the driving unit, so as to drive the lighting unit output a visible light. In addition, the illumination mode switching unit is used for controlling the light filtering unit to show and cover the light-emitting surface of the lighting unit, so as to filter the visible light and make the visible light become a visible light with a specific wavelength; wherein the visible light with specific wavelength causes the smallest excitation to human sympathetic. Thus, using the visible light with specific wavelength as illumination light at night can not only assist users in reading, but also avoid from exciting users' sympathetic and causing melatonin suppression.
摘要翻译：本发明涉及具有可切换的日夜照明模式的照明装置，包括：主控制单元，驱动单元，照明单元，滤光单元，照明模式切换单元和电源管理单元，其中，照明单元耦合到驱动单元并且具有多个发光装置。此外，主控制单元用于控制驱动单元，以驱动照明单元输出可见光。此外，照明模式切换单元用于控制光过滤单元以显示和覆盖照明单元的发光表面，以便过滤可见光并使可见光变成具有特定波长的可见光 ; 其中具有特定波长的可见光引起对人的交感的最小激发。因此，晚上使用特定波长的可见光作为照明光，不仅可以帮助用户阅读，而且可以避免激发用户的同情和造成褪黑激素的抑制。

6. 发明授权

US08368061B2 Organic light-emitting diode employing mixed host and method for fabricating the same 有权
标题翻译：采用混合主机的有机发光二极管及其制造方法
公开(公告)号：US08368061B2
公开(公告)日：2013-02-05
申请号：US13048574
申请日：2011-03-15
申请人： Jwo-Huei Jou , Sun-Zen Chen , Shiang-Hau Peng , Bo-Shian Wu
发明人： Jwo-Huei Jou , Sun-Zen Chen , Shiang-Hau Peng , Bo-Shian Wu
IPC分类号： H01L29/08
CPC分类号： H01L51/5016 , H01L51/0037 , H01L51/0042 , H01L51/0085 , H01L51/5012 , H01L51/56 , H01L2251/308 , H01L2251/5384
摘要： A method for fabricating an organic light-emitting diode employing a mixed host is disclosed, which comprises the following steps: (A) providing a substrate with a first electrode formed thereon; (B) coating a mold with a light-emitting layer material, wherein the light-emitting layer material comprises: a mixed host, and dye molecule(s) (or dye-function-group-composing materials) etc.; (C) pressing the mold coated with the light-emitting layer material onto the substrate to transfer the light-emitting layer material to the first electrode of the substrate, to form a light-emitting layer; and (D) forming a second electrode over the light-emitting layer. The mixed host consists of host-function molecule(s) and auxiliary additives. In addition, the present invention also provides a light-emitting diode, which is prepared by the aforementioned method.
摘要翻译：公开了一种使用混合主机制造有机发光二极管的方法，包括以下步骤：（A）为基板提供形成在其上的第一电极; （B）用发光层材料涂覆模具，其中发光层材料包括：混合主体和染料分子（或染料官能团组成材料）等; （C）将涂布有发光层材料的模具按压到基板上，将发光层材料转印到基板的第一电极，形成发光层; 和（D）在所述发光层上形成第二电极。混合宿主由宿主功能分子和辅助添加剂组成。此外，本发明还提供了通过上述方法制备的发光二极管。

7. 发明申请

US20120299491A1 Lighting Device with Color Temperature Adjusting Functionality 有权
标题翻译：具有色温调节功能的照明装置
公开(公告)号：US20120299491A1
公开(公告)日：2012-11-29
申请号：US13184730
申请日：2011-07-18
申请人： Jwo-Huei Jou
发明人： Jwo-Huei Jou
IPC分类号： H05B37/02
CPC分类号： H05B33/0857 , F21S6/003 , F21Y2113/10
摘要： The present invention relates to a lighting device with color temperature adjusting functionality, comprising: a light-emitting device array module, a first driving unit, a second driving unit, a third driving unit, a fourth driving unit, a main controlling unit, and a power management unit, wherein the first driving unit, the second driving unit, the third driving unit, the fourth driving unit are used for respectively driving a first high color temperature light-emitting device array, a first low color temperature light-emitting device array, a second low color temperature light-emitting device array, and a second high color temperature light-emitting device array of the light-emitting device array module, so as to selectively drive a plurality of first high color temperature light-emitting devices, a plurality of first low color temperature light-emitting devices, a plurality of second low color temperature light-emitting devices, and a plurality of second high color temperature light-emitting devices to emit a color light with a specific color temperature.
摘要翻译：本发明涉及一种具有色温调节功能的照明装置，包括：发光装置阵列模块，第一驱动单元，第二驱动单元，第三驱动单元，第四驱动单元，主控单元和功率管理单元，其中第一驱动单元，第二驱动单元，第三驱动单元，第四驱动单元用于分别驱动第一高色温发光器件阵列，第一低色温发光器件阵列，第二低色温发光元件阵列和发光元件阵列模块的第二高色温发光元件阵列，以选择性地驱动多个第一高色温发光元件，多个第一低色温发光元件，多个第二低色温发光元件和多个第二高色温发光元件发射器件发出具有特定色温的彩色光。

8. 发明授权

US08216634B2 High-molecule-based organic light-emitting diode and fabrication method thereof 有权
公开(公告)号：US08216634B2
公开(公告)日：2012-07-10
申请号：US12462608
申请日：2009-08-06
申请人： Jwo-Huei Jou , Wei-Ben Wang , Mao-Feng Hsu , Chun-Jang Wang , Yu-Chiao Chung
发明人： Jwo-Huei Jou , Wei-Ben Wang , Mao-Feng Hsu , Chun-Jang Wang , Yu-Chiao Chung
IPC分类号： B05D5/06 , B41M5/00 , H01J1/62 , H01J63/04 , C09K11/06
CPC分类号： H01L51/5012 , H01L51/0037 , H01L51/0085 , H01L51/0094 , H01L51/5016 , H01L51/5048 , Y10T428/24802
摘要： The present invention discloses a high-molecule-based organic light-emitting diode (OLED) and a fabrication method thereof. The high-molecule-based OLED comprises a layer selected from a group consisting of an organic emissive layer, a first emission-auxiliary layer and a second emission-auxiliary layer. The organic emissive layer, first emission-auxiliary layer or second emission-auxiliary layer comprises a molecular material having a molecular weight of larger than approximately 730 g mol−1, and is formed by a solution-process.

9. 发明申请

US20120032153A1 Organic Light-Emitting Diode Device 审中-公开
标题翻译：有机发光二极管装置
公开(公告)号：US20120032153A1
公开(公告)日：2012-02-09
申请号：US13156407
申请日：2011-06-09
申请人： Jwo-Huei Jou , Po-Shien Wu
发明人： Jwo-Huei Jou , Po-Shien Wu
IPC分类号： H01L51/54 , H01L51/52
CPC分类号： H01L51/5036 , H01L51/5016 , H01L2251/558
摘要： The present invention relates to an improved organic light-emitting diode (OLED) device which comprises a first conductive layer, a first light-emitting material layer, a second light-emitting material layer, a second conductive layer, and at least one third light-emitting material layer, wherein the first conductive layer is adapted for being an anode substrate, moreover, by way of evaporation process, the first light-emitting material layer, the third light-emitting material layer, the second light-emitting material layer, and the second conductive layer are formed on the anode substrate in turns. Besides, the phenomenon of efficiency roll-off occurring in a high luminance region of the OLED device may be improved by adding the third light-emitting material layer between the first light-emitting material layer and the second light-emitting material layer.
摘要翻译：本发明涉及一种改进的有机发光二极管（OLED）器件，其包括第一导电层，第一发光材料层，第二发光材料层，第二导电层和至少一个第三光所述第一发光材料层，所述第一发光材料层，所述第三发光材料层，所述第二发光材料层，所述第二发光材料层，所述第一发光材料层，所述第三发光材料层，并且第二导电层依次形成在阳极基板上。此外，通过在第一发光材料层和第二发光材料层之间添加第三发光材料层，可以提高在OLED器件的高亮度区域中发生的效率滚降现象。

10. 发明申请

US20100102294A1 ORGANIC LIGHT EMITTING DIODE WITH NANO-DOTS AND FABRICATION METHOD THEREOF 审中-公开
标题翻译：有机发光二极管与纳米光束及其制造方法
公开(公告)号：US20100102294A1
公开(公告)日：2010-04-29
申请号：US12564507
申请日：2009-09-22
申请人： Jwo-Huei Jou , Wei-Ben Wang , Mao-Feng Hsu , Cheng-Chung Chen
发明人： Jwo-Huei Jou , Wei-Ben Wang , Mao-Feng Hsu , Cheng-Chung Chen
IPC分类号： H01L51/52 , H01L51/56
CPC分类号： H01L51/5096 , H01L51/0037 , H01L51/0085 , H01L2251/5369 , H05B33/20
摘要： An organic light emitting diode (OLED) with nano-dots and a fabrication method thereof are disclosed. The OLED apparatus comprises a substrate, a first electrically conductive layer, a first emission-auxiliary layer, an emissive layer, a second emission-auxiliary layer and a second electrically conductive layer. Its fabrication method is described below. Nano-dots with functional groups on the surface are incorporated into the emissive layer, the first emission-auxiliary layer or the second emission-auxiliary layer to form a layered electro-luminescent structure. By using the fabrication method, the resultant efficiency of the OLEDs can be markedly enhanced.
摘要翻译：公开了一种具有纳米点的有机发光二极管（OLED）及其制造方法。 OLED装置包括衬底，第一导电层，第一发射辅助层，发射层，第二发射辅助层和第二导电层。其制造方法如下所述。表面上具有官能团的纳米点被并入到发光层，第一发射辅助层或第二发射辅助层中，以形成层状电致发光结构。通过使用该制造方法，可以显着提高OLED的合成效率。

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