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    • 7. 发明授权
    • Semiconductor device and manufacturing method for the same
    • 半导体器件及其制造方法相同
    • US08946700B2
    • 2015-02-03
    • US13552805
    • 2012-07-19
    • Kengo AkimotoJunichiro SakataShunpei Yamazaki
    • Kengo AkimotoJunichiro SakataShunpei Yamazaki
    • H01L29/786H01L27/12
    • H01L29/78618H01L27/1225H01L29/7869
    • An object is to provide a method for manufacturing a highly reliable semiconductor device including thin film transistors which have stable electric characteristics and are formed using an oxide semiconductor. A method for manufacturing a semiconductor device includes the steps of: forming an oxide semiconductor film over a gate electrode with a gate insulating film interposed between the oxide semiconductor film and the gate electrode, over an insulating surface; forming a first conductive film including at least one of titanium, molybdenum, and tungsten, over the oxide semiconductor film; forming a second conductive film including a metal having lower electronegativity than hydrogen, over the first conductive film; forming a source electrode and a drain electrode by etching of the first conductive film and the second conductive film; and forming an insulating film in contact with the oxide semiconductor film, over the oxide semiconductor film, the source electrode, and the drain electrode.
    • 本发明的目的是提供一种用于制造具有稳定电特性并使用氧化物半导体形成的薄膜晶体管的高可靠性半导体器件的方法。 一种制造半导体器件的方法包括以下步骤:在绝缘表面上,在栅极上形成氧化物半导体膜,其中栅极绝缘膜置于氧化物半导体膜和栅电极之间; 在所述氧化物半导体膜上形成包括钛,钼和钨中的至少一种的第一导电膜; 在所述第一导电膜上形成包含具有比氢更低的电负性的金属的第二导电膜; 通过蚀刻第一导电膜和第二导电膜形成源电极和漏电极; 以及在所述氧化物半导体膜,所述源电极和所述漏极上形成与所述氧化物半导体膜接触的绝缘膜。