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    • 4. 发明授权
    • Semiconductor device
    • 半导体器件
    • US08530892B2
    • 2013-09-10
    • US12917569
    • 2010-11-02
    • Shunpei YamazakiSuzunosuke HiraishiKengo AkimotoJunichiro Sakata
    • Shunpei YamazakiSuzunosuke HiraishiKengo AkimotoJunichiro Sakata
    • H01L29/10H01L21/16
    • H01L29/45G02F1/1368H01L29/7869
    • An object is, in a thin film transistor including an oxide semiconductor layer, to reduce contact resistance between the oxide semiconductor layer and source and drain electrode layers electrically connected to the oxide semiconductor layer. The source and drain electrode layers have a stacked-layer structure of two or more layers in which a layer in contact with the oxide semiconductor layer is formed using an oxide of a metal whose work function is lower than the work function of the oxide semiconductor layer or an oxide of an alloy containing such a metal. Layers other than the layer in contact with the oxide semiconductor layer of the source and drain electrode layers are formed using an element selected from Al, Cr, Cu, Ta, Ti, Mo, or W, an alloy containing any of these elements as a component, an alloy containing any of these elements in combination, or the like.
    • 在包括氧化物半导体层的薄膜晶体管中,目的是减少氧化物半导体层与与氧化物半导体层电连接的源电极层和漏电极层之间的接触电阻。 源极和漏极层具有两层或多层的层叠结构,其中使用其功函数低于氧化物半导体层的功函数的金属的氧化物形成与氧化物半导体层接触的层 或含有这种金属的合金的氧化物。 使用选自Al,Cr,Cu,Ta,Ti,Mo或W的元素形成与源极和漏极电极层的氧化物半导体层接触的层以外的层,包含任何这些元素作为 组分,包含任何这些元素组合的合金等。
    • 10. 发明授权
    • Semiconductor device and manufacturing method for the same
    • 半导体器件及其制造方法相同
    • US08946700B2
    • 2015-02-03
    • US13552805
    • 2012-07-19
    • Kengo AkimotoJunichiro SakataShunpei Yamazaki
    • Kengo AkimotoJunichiro SakataShunpei Yamazaki
    • H01L29/786H01L27/12
    • H01L29/78618H01L27/1225H01L29/7869
    • An object is to provide a method for manufacturing a highly reliable semiconductor device including thin film transistors which have stable electric characteristics and are formed using an oxide semiconductor. A method for manufacturing a semiconductor device includes the steps of: forming an oxide semiconductor film over a gate electrode with a gate insulating film interposed between the oxide semiconductor film and the gate electrode, over an insulating surface; forming a first conductive film including at least one of titanium, molybdenum, and tungsten, over the oxide semiconductor film; forming a second conductive film including a metal having lower electronegativity than hydrogen, over the first conductive film; forming a source electrode and a drain electrode by etching of the first conductive film and the second conductive film; and forming an insulating film in contact with the oxide semiconductor film, over the oxide semiconductor film, the source electrode, and the drain electrode.
    • 本发明的目的是提供一种用于制造具有稳定电特性并使用氧化物半导体形成的薄膜晶体管的高可靠性半导体器件的方法。 一种制造半导体器件的方法包括以下步骤:在绝缘表面上,在栅极上形成氧化物半导体膜,其中栅极绝缘膜置于氧化物半导体膜和栅电极之间; 在所述氧化物半导体膜上形成包括钛,钼和钨中的至少一种的第一导电膜; 在所述第一导电膜上形成包含具有比氢更低的电负性的金属的第二导电膜; 通过蚀刻第一导电膜和第二导电膜形成源电极和漏电极; 以及在所述氧化物半导体膜,所述源电极和所述漏极上形成与所述氧化物半导体膜接触的绝缘膜。