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    • 4. 发明申请
    • SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    • 半导体器件及其制造方法
    • US20080179675A1
    • 2008-07-31
    • US12015362
    • 2008-01-16
    • Shunpei YAMAZAKIAtsuo ISOBEHiromichi GODO
    • Shunpei YAMAZAKIAtsuo ISOBEHiromichi GODO
    • H01L27/12H01L21/782
    • H01L29/78621H01L29/42384H01L29/4908H01L29/66757H01L29/78618H01L2924/0002H01L2924/00
    • A semiconductor device having a novel structure by which the operating characteristics and reliability are improved and a manufacturing method thereof. An island-shaped semiconductor layer provided over a substrate, including a channel formation region provided between a pair of impurity regions; a first insulating layer provided so as to be in contact with the side surface of the semiconductor layer; a gate electrode provided over the channel formation region so as to get across the semiconductor layer; and a second insulating layer provided between the channel formation region and the gate electrode are included. The semiconductor layer is locally thinned, the channel formation region is provided in the thinned region, and the second insulating layer covers the first insulating layer provided on the side surface of the semiconductor layer at least in the region which overlaps with the gate electrode.
    • 具有改善其操作特性和可靠性的新颖结构的半导体器件及其制造方法。 一种岛状半导体层,设置在衬底上,包括设置在一对杂质区之间的沟道形成区; 设置成与半导体层的侧表面接触的第一绝缘层; 栅电极,设置在所述沟道形成区上方以穿过所述半导体层; 并且包括设置在沟道形成区域和栅电极之间的第二绝缘层。 半导体层被局部变薄,沟道形成区域设置在减薄区域中,并且第二绝缘层至少在与栅电极重叠的区域中覆盖设置在半导体层的侧表面上的第一绝缘层。
    • 9. 发明申请
    • SEMICONDUCTOR DEVICE, POWER DIODE, AND RECTIFIER
    • 半导体器件,功率二极管和整流器
    • US20120061662A1
    • 2012-03-15
    • US13220992
    • 2011-08-30
    • Shunpei YAMAZAKIHiromichi GODOSatoshi KOBAYASHI
    • Shunpei YAMAZAKIHiromichi GODOSatoshi KOBAYASHI
    • H01L29/78
    • H01L29/7869H01L29/24H01L29/42356H01L29/78648
    • An object is to provide a semiconductor device having electrical characteristics such as high withstand voltage, low reverse saturation current, and high on-state current. In particular, an object is to provide a power diode and a rectifier which include non-linear elements. An embodiment of the present invention is a semiconductor device including a first electrode, a gate insulating layer covering the first electrode, an oxide semiconductor layer in contact with the gate insulating layer and overlapping with the first electrode, a pair of second electrodes covering end portions of the oxide semiconductor layer, an insulating layer covering the pair of second electrodes and the oxide semiconductor layer, and a third electrode in contact with the insulating layer and between the pair of second electrodes. The pair of second electrodes are in contact with end surfaces of the oxide semiconductor layer.
    • 本发明的目的是提供具有诸如高耐受电压,低反向饱和电流和高导通电流等电特性的半导体器件。 特别地,目的是提供一种包括非线性元件的功率二极管和整流器。 本发明的一个实施例是一种半导体器件,包括第一电极,覆盖第一电极的栅极绝缘层,与栅极绝缘层接触并与第一电极重叠的氧化物半导体层,覆盖端部的一对第二电极 所述氧化物半导体层的绝缘层,覆盖所述一对第二电极和所述氧化物半导体层的绝缘层,以及与所述绝缘层和所述一对第二电极接触的第三电极。 一对第二电极与氧化物半导体层的端面接触。
    • 10. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    • 半导体器件及制造半导体器件的方法
    • US20110215317A1
    • 2011-09-08
    • US13037545
    • 2011-03-01
    • Shunpei YAMAZAKIHiromichi GODO
    • Shunpei YAMAZAKIHiromichi GODO
    • H01L27/088H01L29/78H01L21/34H01L21/8254
    • G06F15/7832H01L27/1225H01L29/1033H01L29/7869
    • Disclosed is a semiconductor device including an insulating layer, a source electrode and a drain electrode embedded in the insulating layer, an oxide semiconductor layer in contact with the insulating layer, the source electrode, and the drain electrode, a gate insulating layer covering the oxide semiconductor layer, and a gate electrode over the gate insulating layer. The upper surface of the surface of the insulating layer, which is in contact with the oxide semiconductor layer, has a root-mean-square (RMS) roughness of 1 nm or less. There is a difference in height between an upper surface of the insulating layer and each of an upper surface of the source electrode and an upper surface of the drain electrode. The difference in height is preferably 5 nm or more. This structure contributes to the suppression of defects of the semiconductor device and enables their miniaturization.
    • 公开了一种半导体器件,其包括绝缘层,源电极和漏电极,该绝缘层嵌入在绝缘层中,与绝缘层,源极和漏电极接触的氧化物半导体层,覆盖氧化物的栅极绝缘层 半导体层和栅绝缘层上的栅电极。 与氧化物半导体层接触的绝缘层的表面的上表面的均方根(RMS)粗糙度为1nm以下。 绝缘层的上表面与源电极的上表面和漏电极的上表面之间的高度差异。 高度差优选为5nm以上。 这种结构有助于抑制半导体器件的缺陷并使其能够小型化。