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1. 发明授权

US5372295A Solder material, junctioning method, junction material, and semiconductor device 失效
标题翻译：焊料，接合方法，接合材料和半导体器件
公开(公告)号：US5372295A
公开(公告)日：1994-12-13
申请号：US955307
申请日：1992-10-01
申请人： Shunichi Abe , Katunori Asai , Yoshihiro Tomita , Hideyuki Ichiyama , Seizou Ohumae , Yoshirou Nishinaka , Katsuyuki Fukutome , Naoto Ueda , Toshio Takeuchi
发明人： Shunichi Abe , Katunori Asai , Yoshihiro Tomita , Hideyuki Ichiyama , Seizou Ohumae , Yoshirou Nishinaka , Katsuyuki Fukutome , Naoto Ueda , Toshio Takeuchi
IPC分类号： B23K35/02 , B23K35/26 , H01L21/60 , H01L21/58
CPC分类号： H01L24/32 , B23K35/0238 , B23K35/268 , H01L24/29 , H01L24/83 , B23K35/262 , H01L2224/04026 , H01L2224/26175 , H01L2224/27013 , H01L2224/29 , H01L2224/29011 , H01L2224/29101 , H01L2224/29111 , H01L2224/29298 , H01L2224/32245 , H01L2224/325 , H01L2224/83051 , H01L2224/83101 , H01L2224/8319 , H01L2224/83801 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01018 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/15747 , H01L2924/351
摘要： A solder material comprises a first solder plate and a second solder plate having a thickness equal to or larger than 1 micron provided at the both surfaces of the first solder plate comprising material having a lower melting point than the first solder or material which reacts with the first solder to produce an alloy having a lower melting point than the first solder.A junctioning method comprises putting the above-described solder material inserted between two objects to be junctioned to each other; heating the solder material to a temperature higher than the melting point of the second solder or the alloy and lower than the melting point of said first solder thereby to melt the second solder or the alloy; and thereafter cooling or keeping the solder material at a temperature in the vicinity of the melting point thereby to junction the objects to be junctioned to each other. The second solder plate has preferably a thickness less than 5 microns and the first solder plate has preferably a thickness equal to or larger than 30 microns. By this construction, the interval between the objects to be junctioned can be controlled to a predetermined thickness and the stress functioning to the objects can be relaxed as well as there arises no positional deviation between the objects.
摘要翻译：焊料材料包括第一焊料板和厚度等于或大于1微米的第二焊料板，其设置在第一焊料板的两个表面处，该第一焊料板包括具有比与第一焊料或第二焊料反应的第一焊料或材料更低的熔点的材料第一焊料以产生熔点低于第一焊料的合金。接合方法包括将插入在两个物体之间的上述焊料彼此连接; 将焊料材料加热到高于第二焊料或合金的熔点并低于所述第一焊料的熔点的温度，从而熔化第二焊料或合金; 然后将焊料材料冷却或保持在熔点附近的温度，从而将要连接的物体彼此接合。第二焊盘优选具有小于5微米的厚度，并且第一焊料板优选具有等于或大于30微米的厚度。通过这种结构，要连接的物体之间的间隔可以被控制到预定厚度，并且可以放松对物体起作用的应力，并且不会在物体之间产生位置偏差。

2. 发明授权

US5609287A Solder material, junctioning method, junction material, and semiconductor device 失效
标题翻译：焊料，接合方法，接合材料和半导体器件
公开(公告)号：US5609287A
公开(公告)日：1997-03-11
申请号：US335995
申请日：1994-11-08
申请人： Goro Izuta , Shunichi Abe , Yoshirou Nishinaka , Katsuyuki Fukutome , Naoto Ueda , Toshio Takeuchi , Yoshihiro Kashiba , Masaaki Namatame
发明人： Goro Izuta , Shunichi Abe , Yoshirou Nishinaka , Katsuyuki Fukutome , Naoto Ueda , Toshio Takeuchi , Yoshihiro Kashiba , Masaaki Namatame
IPC分类号： B23K35/02 , B23K35/26 , H01L21/60 , H01L21/58
CPC分类号： H01L24/32 , B23K35/0238 , B23K35/268 , H01L24/29 , H01L24/83 , B23K35/262 , H01L2224/04026 , H01L2224/26175 , H01L2224/27013 , H01L2224/29 , H01L2224/29011 , H01L2224/29101 , H01L2224/29111 , H01L2224/29298 , H01L2224/32245 , H01L2224/325 , H01L2224/83051 , H01L2224/83101 , H01L2224/8319 , H01L2224/83801 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01018 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/15747 , H01L2924/351
摘要： A solder material comprises a first solder plate and a second solder plate having a thickness equal to or larger than 1 micron provided at the both surfaces of the first solder plate comprising material-having a lower melting point than the first solder or material which reacts with the first solder to produce an alloy having a lower melting point than the first solder.A junctioning method comprise putting the above-described solder material inserted between two objects to be junctioned to each other; heating the solder material to a temperature higher than the melting point of the second solder or the alloy and lower than the melting point of said first solder thereby to melt the second solder or the alloy; and thereafter cooling or keeping the solder material at a temperature in the vicinity of the melting point thereby to junction the objects to be junctioned to each other. The second solder plate has preferably a thickness less than 5 microns and the first solder plate has preferably a thickness equal to or larger than 30 microns. By this construction, the interval between the objects to be junctioned can be controlled to a predetermined thickness and the stress functioning to the objects can be relaxed as well as there arises no positional deviation between the objects.
摘要翻译：焊料材料包括第一焊料板和第二焊料板，其具有等于或大于1微米的厚度，其设置在包含材料的第一焊料板的两个表面处，所述第一焊料板具有比与第一焊料反应的第一焊料或材料更低的熔点第一焊料以产生熔点低于第一焊料的合金。接合方法包括将插入在两个物体之间的上述焊料材料相互连接; 将焊料材料加热到高于第二焊料或合金的熔点并低于所述第一焊料的熔点的温度，从而熔化第二焊料或合金; 然后将焊料材料冷却或保持在熔点附近的温度，从而将要连接的物体彼此接合。第二焊盘优选具有小于5微米的厚度，并且第一焊料板优选具有等于或大于30微米的厚度。通过这种结构，要连接的物体之间的间隔可以被控制到预定厚度，并且可以放松对物体起作用的应力，并且不会在物体之间产生位置偏差。

3. 发明授权

US5724726A Method of making leadframe for lead-on-chip (LOC) semiconductor device 失效
标题翻译：制造引线框架（LOC）半导体器件的方法
公开(公告)号：US5724726A
公开(公告)日：1998-03-10
申请号：US614552
申请日：1996-03-13
申请人： Yoshihiro Tomita , Naoto Ueda , Yoshirou Nishinaka , Shunichi Abe , Hideyuki Ichiyama
发明人： Yoshihiro Tomita , Naoto Ueda , Yoshirou Nishinaka , Shunichi Abe , Hideyuki Ichiyama
IPC分类号： H01L21/52 , H01L21/56 , H01L21/60 , H01L23/495 , H01L23/50 , H01R43/00
CPC分类号： H01L24/06 , H01L21/565 , H01L23/49503 , H01L23/4951 , H01L23/49537 , H01L23/49551 , H01L24/32 , H01L24/83 , H01L2224/04042 , H01L2224/05554 , H01L2224/05599 , H01L2224/06136 , H01L2224/2919 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48247 , H01L2224/48253 , H01L2224/4826 , H01L2224/49113 , H01L2224/49171 , H01L2224/73265 , H01L2224/8319 , H01L2224/83801 , H01L2224/85207 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/0105 , H01L2924/01068 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/19043 , H01L2924/351 , Y10T29/49121 , Y10T29/49146 , Y10T29/49172
摘要： A method of making a semiconductor device having a lead-on-chip structure includes bending a die pad extending from an outer frame outwardly from the outer frame. Thereafter, with the die pad in a convenient position, a semiconductor chip is die-bonded to the die pad. Thereafter, the die pad is bent back toward the outer frame so that it is generally parallel to but spaced from the outer frame with leads extending from the outer frame being generally parallel to the semiconductor chip. Electrodes of the semiconductor chip are connected by wire-bonding to the leads extending from the outer frame. After resin molding, the outer frame lying outside the resin package is severed and removed, completing the lead-on-chip semiconductor device.
摘要翻译：制造具有芯片上芯片结构的半导体器件的方法包括从外框架向外弯曲从外框延伸的芯片焊盘。此后，当芯片焊盘处于便利位置时，半导体芯片被芯片焊接到芯片焊盘。此后，芯片焊盘向外框架弯曲，使得它大致平行于外框架，但与外框架大致平行于半导体芯片延伸。半导体芯片的电极通过引线接合连接到从外框延伸的引线。在树脂成型之后，将位于树脂封装外部的外框切断并移除，从而完成了片上半导体器件。

4. 发明授权

US5535509A Method of making a lead on chip (LOC) semiconductor device 失效
标题翻译：制造片上（LOC）半导体器件的方法
公开(公告)号：US5535509A
公开(公告)日：1996-07-16
申请号：US325637
申请日：1994-10-19
申请人： Yoshihiro Tomita , Naoto Ueda , Yoshirou Nishinaka , Shunichi Abe , Hideyuki Ichiyama
发明人： Yoshihiro Tomita , Naoto Ueda , Yoshirou Nishinaka , Shunichi Abe , Hideyuki Ichiyama
IPC分类号： H01L21/52 , H01L21/56 , H01L21/60 , H01L23/495 , H01L23/50 , H01R43/00
CPC分类号： H01L24/06 , H01L21/565 , H01L23/49503 , H01L23/4951 , H01L23/49537 , H01L23/49551 , H01L24/32 , H01L24/83 , H01L2224/04042 , H01L2224/05554 , H01L2224/05599 , H01L2224/06136 , H01L2224/2919 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48247 , H01L2224/48253 , H01L2224/4826 , H01L2224/49113 , H01L2224/49171 , H01L2224/73265 , H01L2224/8319 , H01L2224/83801 , H01L2224/85207 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/0105 , H01L2924/01068 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/19043 , H01L2924/351 , Y10T29/49121 , Y10T29/49146 , Y10T29/49172
摘要： A semiconductor device including a lead on chip structure employs two frames. One of the frames includes a die pad and an outer frame portion and the other frame includes a plurality of leads and an outer lead portion. After a semiconductor chip is die bonded to the die pad, the two frames are connected to each other with the leads extending across the semiconductor chip. Slits within the second frame provide access to parts of the outer frame of the first frame and the first frame is severed at those slits. The severed portions of the first frame are removed after which the leads of the second frame are connected by wire bonding to the semiconductor chip. Finally, the semiconductor chip, the remaining part of the first frame, and the second frame are encapsulated in a resin with leads extending from the resin. The remaining parts of the outer frame of the second frame are removed by cutting and the exposed leads outside the resin are formed into a desired shape.
摘要翻译：包括片上芯片结构的半导体器件采用两帧。其中一个框架包括芯片焊盘和外部框架部分，另一个框架包括多个引线和外部引线部分。在将半导体芯片裸芯片接合到芯片焊盘之后，两个框架通过跨越半导体芯片的引线彼此连接。第二框架内的狭缝提供对第一框架的外框架的部件的访问，并且第一框架在那些狭缝处被切断。第一框架的切断部分被去除，之后第二框架的引线通过引线接合连接到半导体芯片。最后，半导体芯片，第一框架的剩余部分和第二框架被封装在具有从树脂延伸的引线的树脂中。通过切割除去第二框架的外框架的其余部分，并将树脂外部的暴露的引线形成为期望的形状。

5. 发明授权

US5900582A Lead frame including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the lead frame 失效
标题翻译：引线框架包括用于片上芯片（LOC）半导体器件的框架切割狭缝和结合引线框架的半导体器件
公开(公告)号：US5900582A
公开(公告)日：1999-05-04
申请号：US50397
申请日：1998-03-31
申请人： Yoshihiro Tomita , Naoto Ueda , Yoshirou Nishinaka , Shunichi Abe , Hideyuki Ichiyama
发明人： Yoshihiro Tomita , Naoto Ueda , Yoshirou Nishinaka , Shunichi Abe , Hideyuki Ichiyama
IPC分类号： H01L21/52 , H01L21/56 , H01L21/60 , H01L23/495 , H01L23/50 , H01L23/28
CPC分类号： H01L24/06 , H01L21/565 , H01L23/49503 , H01L23/4951 , H01L23/49537 , H01L23/49551 , H01L24/32 , H01L24/83 , H01L2224/04042 , H01L2224/05554 , H01L2224/05599 , H01L2224/06136 , H01L2224/2919 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48247 , H01L2224/48253 , H01L2224/4826 , H01L2224/49113 , H01L2224/49171 , H01L2224/73265 , H01L2224/8319 , H01L2224/83801 , H01L2224/85207 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/0105 , H01L2924/01068 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/19043 , H01L2924/351 , Y10T29/49121 , Y10T29/49146 , Y10T29/49172
摘要： A leadframe for producing a semiconductor device having a lead-on chip (LOC) structure with leads extending across a semiconductor chip, the leadframe includes a frame for a die pad having an outer frame section, a die pad displaced from the outer frame section, and a suspending lead connecting the die pad to the outer frame section with the die pad disposed inside the outer frame section; and a frame for leads including an outer frame portion and leads extending from opposite sides of the outer frame portion, connected to the frame for a die pad, the die pad being connected to the frame for leads at the suspending lead, wherein one of the frame for a die pad and the frame for leads includes a projection and the other of the frame for a die pad and the frame for leads includes a hole, the hole receiving the projection, the projection being disposed parallel to the frame for leads, connecting the frame for a die pad to the frame for leads.
摘要翻译：一种用于制造半导体器件的引线框架，其具有穿过半导体芯片的引线引线芯片（LOC）结构，所述引线框架包括用于具有外框部分的管芯焊盘的框架，从所述外框架部分移位的管芯焊盘，以及悬挂引线，其将所述管芯焊盘连接到所述外框部，所述管芯焊盘设置在所述外框部内部; 以及用于引线的框架，所述框架包括外框架部分和从所述外框架部分的相对侧延伸的引线，所述引线连接到所述用于芯片焊盘的框架，所述芯片焊盘连接到所述悬挂引线的引线框架，其中，用于管芯焊盘的框架和用于引线的框架包括突起，并且用于管芯焊盘的框架中的另一个，用于引线的框架包括孔，孔接收突起，突起平行于引线的框架设置，连接用于芯片的框架用于引线的框架。

6. 发明授权

US5763829A Leadframe including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the leadframe 失效
标题翻译：引线框架包括用于片上芯片（LOC）半导体器件的框架切割狭缝和结合引线框架的半导体器件
公开(公告)号：US5763829A
公开(公告)日：1998-06-09
申请号：US506852
申请日：1995-07-25
申请人： Yoshihiro Tomita , Naoto Ueda , Yoshirou Nishinaka , Shunichi Abe , Hideyuki Ichiyama
发明人： Yoshihiro Tomita , Naoto Ueda , Yoshirou Nishinaka , Shunichi Abe , Hideyuki Ichiyama
IPC分类号： H01L21/52 , H01L21/56 , H01L21/60 , H01L23/495 , H01L23/50 , H01L23/02
CPC分类号： H01L24/06 , H01L21/565 , H01L23/49503 , H01L23/4951 , H01L23/49537 , H01L23/49551 , H01L24/32 , H01L24/83 , H01L2224/04042 , H01L2224/05554 , H01L2224/05599 , H01L2224/06136 , H01L2224/2919 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48247 , H01L2224/48253 , H01L2224/4826 , H01L2224/49113 , H01L2224/49171 , H01L2224/73265 , H01L2224/8319 , H01L2224/83801 , H01L2224/85207 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/0105 , H01L2924/01068 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/19043 , H01L2924/351 , Y10T29/49121 , Y10T29/49146 , Y10T29/49172
摘要： A high-reliability semiconductor device and a method of producing the device. Absorption of moisture into a semiconductor device is effectively avoided by using a hard solder material, such as common solder having no moisture absorption, for die-bonding a semiconductor chip to a die pad. Thus, in the semiconductor device in accordance with the present inventions there are no corrosion problems nor package-cracking due to absorbed moisture.
摘要翻译：高可靠性半导体器件及其制造方法。通过使用诸如不具有吸湿性的普通焊料等硬焊料材料将半导体芯片芯片接合到管芯焊盘，有效地避免了将水分吸收到半导体器件中。因此，在根据本发明的半导体器件中，由于吸收的水分而没有腐蚀问题和包装破裂。

7. 发明授权

US5440169A Resin-packaged semiconductor device with flow prevention dimples 失效
标题翻译：具有流动防止凹坑的树脂封装半导体器件
公开(公告)号：US5440169A
公开(公告)日：1995-08-08
申请号：US177380
申请日：1994-01-05
申请人： Yoshihiro Tomita , Shunichi Abe
发明人： Yoshihiro Tomita , Shunichi Abe
IPC分类号： H01L23/12 , H01L23/28 , H01L23/31 , H01L23/433 , H01L23/495 , H01L23/50 , H05K1/02 , H05K1/18 , H05K3/34 , H01L23/48
CPC分类号： H01L23/49503 , H01L23/3107 , H01L23/4334 , H01L23/49551 , H05K1/0204 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/73265 , H01L24/48 , H01L2924/00014 , H01L2924/01068 , H01L2924/01077 , H01L2924/07802 , H01L2924/1532 , H01L2924/1815 , H05K1/182 , H05K2201/10416 , H05K2201/10689 , H05K2201/10969 , H05K3/341
摘要： A resin-packaged semiconductor device having a semiconductor element mounted on a first surface of a mounting pad. The mounting pad has an edge molded in a frame-shaped portion of a molding material. A second surface of the mounting pad has a central portion that is not included in the edge of the mounting pad and that is not covered with the molding material, the central portion of the second surface being exposed at the outside of the device. The thickness of the molding material in the frame-shaped portion and on the second surface of the mounting pad can be readily reduced to reduce the thickness of the device. Since the molding material does not cover the entire second surface, molding characteristics as well as heat radiation characteristics are improved.
摘要翻译：一种树脂封装半导体器件，其具有安装在安装焊盘的第一表面上的半导体元件。安装垫具有模制在模制材料的框形部分中的边缘。安装垫的第二表面具有不包括在安装垫的边缘中并且不被模制材料覆盖的中心部分，第二表面的中心部分在设备的外部露出。可以容易地减小框架部分和安装垫的第二表面上的成型材料的厚度，以减小装置的厚度。由于成型材料不覆盖整个第二表面，因此改善了成型特性以及散热特性。

8. 发明申请

US20050116138A1 Method of manufacturing a solid state image sensing device 审中-公开
标题翻译：制造固体摄像装置的方法
公开(公告)号：US20050116138A1
公开(公告)日：2005-06-02
申请号：US10946035
申请日：2004-09-22
申请人： Kenji Hanada , Masaki Nakanishi , Kunio Shigemura , Takaomi Nishi , Koji Shida , Izumi Tezuka , Shunichi Abe , Yoshihiro Tomita , Mitsuaki Seino , Tohru Komatsu
发明人： Kenji Hanada , Masaki Nakanishi , Kunio Shigemura , Takaomi Nishi , Koji Shida , Izumi Tezuka , Shunichi Abe , Yoshihiro Tomita , Mitsuaki Seino , Tohru Komatsu
IPC分类号： G02B7/02 , G01J1/00 , H01J40/14 , H01L21/76 , H01L27/00 , H01L27/14 , H04N5/225 , H04N5/335
CPC分类号： H01L24/97 , H01L24/45 , H01L27/14618 , H01L27/14625 , H01L27/14683 , H01L2224/45144 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/3025 , H04N5/2254 , H04N5/2257 , H01L2224/85 , H01L2924/00014 , H01L2924/00
摘要： The reliability and production yield of a solid state image sensing device is improved. Over a surface of a wiring substrate, a sensor chip and a lens-barrel having the sensor chip housed therein are mounted. To the lens-barrel, a lens holder for retaining a lens is connected. Over a back surface of the wiring substrate, a logic chip, a memory chip and a passive part are mounted, and they are sealed with a sealing resin. The lens-barrel and lens holder are each threaded. They are thermally welded while the threads are fitted to each other. The passive part is bonded to the wiring substrate via a Sn—Ag type Pb-free solder. After the wiring substrate is subjected to plasma washing treatment, the sensor chip is mounted over the wiring substrate and an electrode pad of the sensor chip and an electrode of the wiring substrate are electrically connected via a bonding wire.
摘要翻译：提高了固态摄像装置的可靠性和产量。在布线基板的表面上安装传感器芯片和容纳有传感器芯片的透镜筒。连接透镜镜筒，用于保持透镜的透镜保持器。在布线基板的背面上安装有逻辑芯片，存储芯片和无源部件，并且用密封树脂密封。透镜镜筒和镜头支架均为螺纹。它们在螺纹彼此安装时被热焊接。无源部分通过Sn-Ag型无铅焊料与布线基板接合。在布线基板进行等离子体洗涤处理之后，将传感器芯片安装在布线基板上，并且传感器芯片的电极焊盘和布线基板的电极经由接合线电连接。

9. 发明授权

US08428503B2 Fixing device and image forming apparatus 有权
标题翻译：固定装置和成像装置
公开(公告)号：US08428503B2
公开(公告)日：2013-04-23
申请号：US12929859
申请日：2011-02-22
申请人： Tetsurou Sasamoto , Takuma Nakamura , Masafumi Yamada , Yuichi Aoyama , Takanori Inadome , Kazuya Nagao , Shunichi Abe
发明人： Tetsurou Sasamoto , Takuma Nakamura , Masafumi Yamada , Yuichi Aoyama , Takanori Inadome , Kazuya Nagao , Shunichi Abe
IPC分类号： G03G15/20
CPC分类号： G03G15/2096
摘要： A disclosed fixing device for fixing resin particles softened by applying a foam fixer thereon to a recording medium includes a foam fixer generator unit to introduce air bubbles into a liquid fixer containing a softener for softening the resin particles by dissolving or swelling a part of the resin particles to generate the foam fixer, a fixer application member to be brought into contact with a facing member facing the fixer application member to form an application nip and transfer the generated foam fixer to the application nip by moving its surface while carrying the foam fixer to apply the foam fixer to a surface of the recording medium carrying the resin particles at the application nip, and a foam accumulation detector unit to detect a foam accumulation formed of the foam fixer accumulated at an entrance side of the application nip.
摘要翻译：公开的用于固定通过在其上施加泡沫定影剂而软化的树脂颗粒的定影装置包括泡沫定影剂发生器单元，其将气泡引入含有软化剂的液体定影剂中，所述液体定影剂通过溶解或溶胀树脂的一部分而使树脂颗粒软化用于产生泡沫定影剂的颗粒，定影剂施加构件，其与面向定影剂施加构件的面对构件接触以形成施加辊隙，并将产生的泡沫定影剂通过移动其表面并将泡沫定影剂运送到施加辊隙将泡沫定影剂施加到在施加辊隙处承载树脂颗粒的记录介质的表面，以及泡沫聚积检测器单元，用于检测由在施加辊隙的入口侧积聚的泡沫定影剂形成的泡沫聚积。

10. 发明申请

US20110217099A1 Fixing device and image forming apparatus 有权
标题翻译：固定装置和成像装置
公开(公告)号：US20110217099A1
公开(公告)日：2011-09-08
申请号：US12929859
申请日：2011-02-22
申请人： Tetsurou Sasamoto , Takuma Nakamura , Masafumi Yamada , Yuichi Aoyama , Takanori Inadome , Kazuya Nagao , Shunichi Abe
发明人： Tetsurou Sasamoto , Takuma Nakamura , Masafumi Yamada , Yuichi Aoyama , Takanori Inadome , Kazuya Nagao , Shunichi Abe
IPC分类号： G03G15/20
CPC分类号： G03G15/2096
摘要： A disclosed fixing device for fixing resin particles softened by applying a foam fixer thereon to a recording medium includes a foam fixer generator unit to introduce air bubbles into a liquid fixer containing a softener for softening the resin particles by dissolving or swelling a part of the resin particles to generate the foam fixer, a fixer application member to be brought into contact with a facing member facing the fixer application member to form an application nip and transfer the generated foam fixer to the application nip by moving its surface while carrying the foam fixer to apply the foam fixer to a surface of the recording medium carrying the resin particles at the application nip, and a foam accumulation detector unit to detect a foam accumulation formed of the foam fixer accumulated at an entrance side of the application nip.
摘要翻译：公开的用于固定通过在其上施加泡沫定影剂而软化的树脂颗粒的定影装置包括泡沫定影剂发生器单元，其将气泡引入含有软化剂的液体定影剂中，所述液体定影剂通过溶解或溶胀树脂的一部分而使树脂颗粒软化用于产生泡沫定影剂的颗粒，定影剂施加构件，其与面向定影剂施加构件的面对构件接触以形成施加辊隙，并将产生的泡沫定影剂通过移动其表面并将泡沫定影剂运送到施加辊隙将泡沫定影剂施加到在施加辊隙处承载树脂颗粒的记录介质的表面，以及泡沫聚积检测器单元，用于检测由在施加辊隙的入口侧积聚的泡沫定影剂形成的泡沫聚积。

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