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1. 发明授权

US07748112B2 Component mounting apparatus and component mounting method 有权
标题翻译：组件安装装置和部件安装方法
公开(公告)号：US07748112B2
公开(公告)日：2010-07-06
申请号：US11792235
申请日：2005-12-06
申请人： Shuichi Hirata , Makoto Morikawa , Shinya Marumo , Yasuharu Ueno , Takafumi Tsujisawa
发明人： Shuichi Hirata , Makoto Morikawa , Shinya Marumo , Yasuharu Ueno , Takafumi Tsujisawa
IPC分类号： H05K3/30
CPC分类号： H01L23/544 , H01L21/563 , H01L21/67144 , H01L21/67253 , H01L21/67259 , H01L24/75 , H01L24/81 , H01L25/50 , H01L2223/54426 , H01L2223/5448 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05644 , H01L2224/13144 , H01L2224/16 , H01L2224/75 , H01L2224/759 , H01L2224/81121 , H01L2224/81203 , H01L2224/81205 , H01L2224/81801 , H01L2225/06513 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/14 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/53039 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A component mounting apparatus has a stage 41 with a fixed height position for holding a substrate 5, and a mounting head 48 that releasably holds a component 2, is moved downward toward the stage 41 from a first reference height position HB1 fixedly positioned above the stage 41, and mounts the held component 2 on the substrate 5 or an already mounted component 2. A controller 14 has a mounting reference height calculation unit 103 for calculating a mounting reference height Hn corresponding to a distance from the first reference height position HB1, and a first target movement height calculation unit 104 for calculating a first target movement height ZTAGn based on at least the mounting reference height Hn and a thickness PTn of the component 2 held by the mounting head 48. The controller 14 moves the mounting head 48 holding the component 2 downward from the first reference height position HB1 to the first target movement height ZTAGn to mount the held component 2 on the substrate 5 or the already mounted component 2.
摘要翻译：部件安装装置具有用于保持基板5的固定高度位置的台架41和可释放地保持部件2的安装头部48从固定地位于台架上方的第一基准高度位置HB1向下移动到台架41 控制器14具有安装基准高度计算部103，用于计算与第一基准高度位置HB1的距离对应的安装基准高度Hn，以及第一目标移动高度计算单元104，用于基于至少安装基准高度Hn和由安装头48保持的部件2的厚度PTn来计算第一目标移动高度ZTAGn。控制器14使安装头48保持组件2从第一参考高度位置HB1向下移动到第一目标移动高度ZTAGn以将保持的组件2安装在基板5上或已经安装的组件2。

2. 发明申请

US20080127486A1 Component Mounting Apparatus And Component Mounting Method 有权
标题翻译：组件安装装置和组件安装方法
公开(公告)号：US20080127486A1
公开(公告)日：2008-06-05
申请号：US11792235
申请日：2005-12-06
申请人： Shuichi Hirata , Makoto Morikawa , Shinya Marumo , Yasuharu Ueno , Takafumi Tsujisawa
发明人： Shuichi Hirata , Makoto Morikawa , Shinya Marumo , Yasuharu Ueno , Takafumi Tsujisawa
IPC分类号： H05K3/30
CPC分类号： H01L23/544 , H01L21/563 , H01L21/67144 , H01L21/67253 , H01L21/67259 , H01L24/75 , H01L24/81 , H01L25/50 , H01L2223/54426 , H01L2223/5448 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05644 , H01L2224/13144 , H01L2224/16 , H01L2224/75 , H01L2224/759 , H01L2224/81121 , H01L2224/81203 , H01L2224/81205 , H01L2224/81801 , H01L2225/06513 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/14 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/53039 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A component mounting apparatus has a stage 41 with a fixed height position for holding a substrate 5, and a mounting head 48 that releasably holds a component 2, is moved downward toward the stage 41 from a first reference height position HB1 fixedly positioned above the stage 41, and mounts the held component 2 on the substrate 5 or an already mounted component 2. A controller 14 has a mounting reference height calculation unit 103 for calculating a mounting reference height Hn corresponding to a distance from the first reference height position HB1, and a first target movement height calculation unit 104 for calculating a first target movement height ZTAGn based on at least the mounting reference height Hn and a thickness PTn of the component 2 held by the mounting head 48. The controller 14 moves the mounting head 48 holding the component 2 downward from the first reference height position HB1 to the first target movement height ZTAGn to mount the held component 2 on the substrate 5 or the already mounted component 2.
摘要翻译：部件安装装置具有用于保持基板5的固定高度位置的台架41和可释放地保持部件2的安装头部48从第一基准高度位置HB < / SUB>固定在台41上方，并将保持的部件2安装在基板5上或已经安装的部件2上。控制器14具有安装基准高度计算单元103，用于计算与从第一参考高度位置HB 1> 1的距离相对应的安装基准高度H SUB n和第一目标运动高度计算单元104，用于基于至少安装基准高度H n n n和厚度PT N n N计算第一目标移动高度ZTAG 由安装头48保持的部件2。控制器14将保持组件2的安装头48从第一参考高度位置HB <1>向下移动到第一目标移动高度ZTAG 以将保持的组件2安装在基板5或已经安装的部件2。

3. 发明授权

US07861908B2 Component mounting method, component mounting apparatus, and ultrasonic bonding head 有权
标题翻译：部件安装方法，部件安装装置和超声波焊接头
公开(公告)号：US07861908B2
公开(公告)日：2011-01-04
申请号：US11731312
申请日：2007-03-30
申请人： Shozo Minamitani , Takaharu Mae , Yasuharu Ueno , Akira Yamada , Shinji Kanayama , Makoto Akita , Nobuhisa Watanabe , Akira Mori , Hiroyuki Naito , Shinya Marumo , Makoto Morikawa
发明人： Shozo Minamitani , Takaharu Mae , Yasuharu Ueno , Akira Yamada , Shinji Kanayama , Makoto Akita , Nobuhisa Watanabe , Akira Mori , Hiroyuki Naito , Shinya Marumo , Makoto Morikawa
IPC分类号： B23K1/06
CPC分类号： H01L24/81 , B23K20/10 , B23K2101/40 , H01L21/67144 , H01L24/75 , H01L2224/75 , H01L2224/75252 , H01L2224/75355 , H01L2224/75743 , H01L2224/81205 , H01L2224/8121 , H01L2224/81222 , H01L2224/81224 , H01L2224/81815 , H01L2924/01005 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/00
摘要： A component mounting apparatus includes a component feeder that feeds a component with its bump electrodes facing down, a mounting head that mounts the component onto a substrate, a supporting base that secures the substrate, and a positioning device that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator, an ultrasonic vibration propagation member that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face holding the component as vibration parallel thereto, a pressure loader that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes on its face.
摘要翻译：部件安装装置包括：部件供给器，其部件的凸起电极朝下，将该部件安装在基板上的安装头，固定基板的支撑基座以及将部件与基板对准的定位装置。安装头包括：超声波振动发生器，将由超声波振动发生器提供的超声波的振动传递给保持部件的工作面与振动平行的超声波振动传播部件;压力加载器，其对工作面施加压力负荷; 在其上方垂直于其上方的位置，以及加热工作面附近的加热器。因此，即使在其表面上具有多个凸块电极，也可以高可靠性地进行超声波接合。

4. 发明申请

US20050227429A1 Electronic component mounting method and apparatus and ultrasondic bonding head 有权
标题翻译：电子元器件安装方法及装置及超级焊接头
公开(公告)号：US20050227429A1
公开(公告)日：2005-10-13
申请号：US10508460
申请日：2003-03-27
申请人： Shozo Minamitani , Takaharu Mae , Yasuharu Ueno , Akira Yamada , Shinji Kanayama , Makoto Akita , Nobuhisa Watanabe , Akira Mori , Hiroyuki Naito , Shinya Marumo , Makoto Morikawa
发明人： Shozo Minamitani , Takaharu Mae , Yasuharu Ueno , Akira Yamada , Shinji Kanayama , Makoto Akita , Nobuhisa Watanabe , Akira Mori , Hiroyuki Naito , Shinya Marumo , Makoto Morikawa
IPC分类号： B23K20/10 , H01L21/00 , H01L21/8238
CPC分类号： H01L24/81 , B23K20/10 , B23K2101/40 , H01L21/67144 , H01L24/75 , H01L2224/75 , H01L2224/75252 , H01L2224/75355 , H01L2224/75743 , H01L2224/81205 , H01L2224/8121 , H01L2224/81222 , H01L2224/81224 , H01L2224/81815 , H01L2924/01005 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/00
摘要： A component mounting apparatus includes a component feeder (20) that feeds a component (2) with its bump electrodes facing down, a mounting head (5) that mounts the component onto a substrate (3), a supporting base (8) that secures the substrate, and a positioning device (6, 7) that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator (24), an ultrasonic vibration propagation member (34, 38, 54) that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face (33, 41, 57) holding the component as vibration parallel thereto, a pressure loader (22, 23, 39, 55, 59) that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater (32, 47, 49, 50, 51, 52, 53) that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes (2a) on its face.
摘要翻译：一种部件安装装置，包括：一个部件供给器（20），其部件（2）的凸起电极朝下;一个安装头（5），该部件安装在基板（3）上;支撑基座（8）所述基板以及将所述部件与所述基板对准的定位装置（6,7）。安装头包括超声波振动发生器（24），超声波振动传播部件（34,38,54），其将由超声波振动发生器提供的超声波振动传递到保持部件的工作面（33,41,57），如振动平行的压力加载器（22,23,39,55,59），其从垂直于其垂直方向的上方的位置向工作面施加压力负荷;加热器（32,47,49,55,59） 51,52,53），其加热了工作面附近。因此，即使该部件的面上具有多个凸块电极（2a），也可以高可靠性地进行超声波接合。

5. 发明申请

US20070187457A1 Component mounting method, component mounting apparatus, and ultrasonic bonding head 有权
标题翻译：部件安装方法，部件安装装置和超声波焊接头
公开(公告)号：US20070187457A1
公开(公告)日：2007-08-16
申请号：US11731312
申请日：2007-03-30
申请人： Shozo Minamitani , Takaharu Mae , Yasuharu Ueno , Akira Yamada , Shinji Kanayama , Makoto Akita , Nobuhisa Watanabe , Akira Mori , Hiroyuki Naito , Shinya Marumo , Makoto Morikawa
发明人： Shozo Minamitani , Takaharu Mae , Yasuharu Ueno , Akira Yamada , Shinji Kanayama , Makoto Akita , Nobuhisa Watanabe , Akira Mori , Hiroyuki Naito , Shinya Marumo , Makoto Morikawa
IPC分类号： B23K1/06
CPC分类号： H01L24/81 , B23K20/10 , B23K2101/40 , H01L21/67144 , H01L24/75 , H01L2224/75 , H01L2224/75252 , H01L2224/75355 , H01L2224/75743 , H01L2224/81205 , H01L2224/8121 , H01L2224/81222 , H01L2224/81224 , H01L2224/81815 , H01L2924/01005 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/00
摘要： A component mounting apparatus includes a component feeder that feeds a component with its bump electrodes facing down, a mounting head that mounts the component onto a substrate, a supporting base that secures the substrate, and a positioning device that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator, an ultrasonic vibration propagation member that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face holding the component as vibration parallel thereto, a pressure loader that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes on its face.
摘要翻译：部件安装装置包括：部件供给器，其部件的凸起电极朝下，将该部件安装在基板上的安装头，固定基板的支撑基座以及将部件与基板对准的定位装置。安装头包括：超声波振动发生器，将由超声波振动发生器提供的超声波的振动传递给保持部件的工作面与振动平行的超声波振动传播部件;压力加载器，其对工作面施加压力负荷; 在其上方垂直于其上方的位置，以及加热工作面附近的加热器。因此，即使在其表面上具有多个凸块电极，也可以高可靠性地进行超声波接合。

6. 发明授权

US07229854B2 Electronic component mounting method and apparatus and ultrasonic bonding head 有权
标题翻译：电子元件安装方法及设备及超声波焊接头
公开(公告)号：US07229854B2
公开(公告)日：2007-06-12
申请号：US10508460
申请日：2003-03-27
申请人： Shozo Minamitani , Takaharu Mae , Yasuharu Ueno , Akira Yamada , Shinji Kanayama , Makoto Akita , Nobuhisa Watanabe , Akira Mori , Hiroyuki Naito , Shinya Marumo , Makoto Morikawa
发明人： Shozo Minamitani , Takaharu Mae , Yasuharu Ueno , Akira Yamada , Shinji Kanayama , Makoto Akita , Nobuhisa Watanabe , Akira Mori , Hiroyuki Naito , Shinya Marumo , Makoto Morikawa
IPC分类号： H01L21/50
CPC分类号： H01L24/81 , B23K20/10 , B23K2101/40 , H01L21/67144 , H01L24/75 , H01L2224/75 , H01L2224/75252 , H01L2224/75355 , H01L2224/75743 , H01L2224/81205 , H01L2224/8121 , H01L2224/81222 , H01L2224/81224 , H01L2224/81815 , H01L2924/01005 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/00
摘要： A component mounting apparatus includes a component feeder (20) that feeds a component (2) with its bump electrodes facing down, a mounting head (5) that mounts the component onto a substrate (3), a supporting base (8) that secures the substrate, and a positioning device (6, 7) that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator (24), an ultrasonic vibration propagation member (34, 38, 54) that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face (33, 41, 57) holding the component as vibration parallel thereto, a pressure loader (22, 23, 39, 55, 59) that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater (32, 47, 49, 50, 51, 52, 53) that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes (2a) on its face.
摘要翻译：一种部件安装装置，包括：一个部件供给器（20），其部件（2）的凸起电极朝下;一个安装头（5），该部件安装在基板（3）上;支撑基座（8）所述基板以及将所述部件与所述基板对准的定位装置（6,7）。安装头包括超声波振动发生器（24），超声波振动传播部件（34,38,54），其将由超声波振动发生器提供的超声波振动传递到保持部件的工作面（33,41,57），如振动平行的压力加载器（22,23,39,55,59），其从垂直于其垂直方向的上方的位置向工作面施加压力负荷;加热器（32,47,49,55,59） 51,52,53），其加热了工作面附近。因此，即使该部件的面上具有多个凸块电极（2a），也可以高可靠性地进行超声波接合。

7. 发明授权

US07650691B2 Component supply head device and component mounting head device 有权
标题翻译：元件供应头装置和部件安装头装置
公开(公告)号：US07650691B2
公开(公告)日：2010-01-26
申请号：US11596577
申请日：2005-05-16
申请人： Shoriki Narita , Satoshi Shida , Yasuharu Ueno , Makoto Morikawa , Hironori Kobayashi , Shuichi Hirata
发明人： Shoriki Narita , Satoshi Shida , Yasuharu Ueno , Makoto Morikawa , Hironori Kobayashi , Shuichi Hirata
IPC分类号： H05K3/30
CPC分类号： H01L21/67144 , H01L21/67132 , H01L21/6838 , H01L2224/75 , H01L2224/75743 , H01L2924/01087 , Y10T29/49128 , Y10T29/4913 , Y10T29/53174 , Y10T29/53178 , Y10T29/53191
摘要： A suction nozzle (65) of a reversing head device (22) has a distal end surface (65a) with a suction hole (65b) opened therein, and a suction passage (65c) communicated with the suction hole (65b) at one end thereof. A portion of the distal end surface (65a) outside of the suction hole (65b) abuts against bumps (39) of an electronic component (12). The suction hole (65b) is opposed with a gap to a portion of a mounting side surface (12a) where no bumps (39) are present. A vacuum pump (65) creates an air flow that flows from the gap between the suction hole (65b) and the mounting side surface (12a) into the suction passage (65c) through the suction hole (65b). The electronic component (12) is held at the distal end surface (65a) by a negative pressure generated by the air flow.
摘要翻译：反转头装置（22）的吸嘴（65）具有在其内开有吸孔（65b）的前端面（65a）和与吸引孔（65b）一端连通的吸入通路（65c）其中。吸入孔（65b）外侧的远端面（65a）的一部分与电子部件（12）的凸块（39）抵接。抽吸孔（65b）与没有凸起（39）的安装侧表面（12a）的一部分相对。真空泵（65）通过吸入孔（65b）产生从吸入孔（65b）和安装侧面（12a）之间的间隙流入吸入通路（65c）的空气流。电子部件（12）由空气流产生的负压保持在前端面（65a）。

8. 发明申请

US20080040917A1 Component Supply Head Device And Component Mounting Head Device 有权
标题翻译：组件供应头设备和组件安装头设备
公开(公告)号：US20080040917A1
公开(公告)日：2008-02-21
申请号：US11596577
申请日：2005-05-16
申请人： Shoriki Narita , Satoshi Shida , Yasuharu Ueno , Makoto Morikawa , Hironori Kobayashi , Shuichi Hirata
发明人： Shoriki Narita , Satoshi Shida , Yasuharu Ueno , Makoto Morikawa , Hironori Kobayashi , Shuichi Hirata
IPC分类号： B23P19/027
CPC分类号： H01L21/67144 , H01L21/67132 , H01L21/6838 , H01L2224/75 , H01L2224/75743 , H01L2924/01087 , Y10T29/49128 , Y10T29/4913 , Y10T29/53174 , Y10T29/53178 , Y10T29/53191
摘要： A suction nozzle 65 of a reversing head device 22 has a distal end surface 65a with a suction hole 65b opened therein, and a suction passage 65c communicated with the suction hole 65b at one end thereof. A portion of the distal end surface 65a outside of the suction hole 65b abuts against bumps 39 of an electronic component 12. The suction hole 65b is opposed with a gap to a portion of a mounting side surface 12a where no bumps 39 are present. A vacuum pump 65 creates an air flow that flows from the gap between the suction hole 65b and mounting side surface 12a into the suction passage 65c through the suction hole 65b. The electronic component 12 is held at the distal end surface 65a by a negative pressure generated by the air flow.
摘要翻译：反转头装置22的吸嘴65具有在其中打开的吸入孔65b的远端表面65a和在其一端与吸入孔65b连通的吸入通道65c。远端面65的吸引孔65b的外侧的一部分与电子部件12的凸起39抵接。吸入孔65b与不存在凸块39的安装侧面12a的一部分相对。真空泵65通过吸入孔65b产生从吸入孔65b与安装侧面12a之间的间隙流入吸入通路65c的气流。电子部件12由空气流产生的负压保持在远端面65a。

9. 发明申请

US20070056157A1 Method of controlling contact load in electronic component mounting apparatus 有权
标题翻译：控制电子部件安装装置的接触负荷的方法
公开(公告)号：US20070056157A1
公开(公告)日：2007-03-15
申请号：US10596218
申请日：2005-08-31
申请人： Shuichi Hirata , Yasuharu Ueno , Makoto Morikawa , Hiroyuki Yoshida , Noriaki Yoshida
发明人： Shuichi Hirata , Yasuharu Ueno , Makoto Morikawa , Hiroyuki Yoshida , Noriaki Yoshida
IPC分类号： B23K3/08 , H05K3/30
CPC分类号： B23K3/087 , B23K37/047 , H01L2224/75502 , Y10T29/49004 , Y10T29/4913 , Y10T29/49133 , Y10T29/49137 , Y10T29/53187
摘要： A method of controlling contact load in an apparatus for mounting electronic components on a substrate includes moving a head holding an electronic component down by a predetermined distance. Contact load is measured after moving the head down. A determination is made as to whether the measured contact load has reached the target contact load. The moving and measuring are repeated until the measured contact load reaches the predetermined target contact load.
摘要翻译：在将电子部件安装在基板上的装置中控制接触负荷的方法包括将保持电子部件的头部向下移动预定距离。在向下移动头后测量接触负载。确定测量的接触载荷是否达到目标接触载荷。重复移动和测量，直到测得的接触载荷达到预定的目标接触载荷。

10. 发明授权

US07513036B2 Method of controlling contact load in electronic component mounting apparatus 有权
标题翻译：控制电子部件安装装置的接触负荷的方法
公开(公告)号：US07513036B2
公开(公告)日：2009-04-07
申请号：US10596218
申请日：2005-08-31
申请人： Shuichi Hirata , Yasuharu Ueno , Makoto Morikawa , Hiroyuki Yoshida , Noriaki Yoshida
发明人： Shuichi Hirata , Yasuharu Ueno , Makoto Morikawa , Hiroyuki Yoshida , Noriaki Yoshida
IPC分类号： H05K3/30
CPC分类号： B23K3/087 , B23K37/047 , H01L2224/75502 , Y10T29/49004 , Y10T29/4913 , Y10T29/49133 , Y10T29/49137 , Y10T29/53187
摘要： A method of controlling contact load in an apparatus for mounting electronic components on a substrate, in which a head is lowered at high speed to slow down starting position where there is no risk that the electronic component makes contact with the substrate (S1), and from there the head is lowered at low speed until a predetermined target contact load is detected. The process of lowering the head at low speed includes the steps of moving down the head a predetermined distance (S3), measuring load after the step of moving down the head (S5), and determining whether the measured contact load has reached the target contact load (S9). The steps of moving down the head (S3) and measuring the load (S5) are repeated until the measured load reaches the target contact load. The actual load is precisely controlled to be close to a very small set level of target contact load. Accordingly, electronic components using low dielectric constant material are mounted without the risk of damage.
摘要翻译：一种控制用于将电子部件安装在基板上的装置中的接触负载的方法，其中头部以高速降低以减慢起始位置，其中电子部件不接触基板的风险（S1）;以及从那里头部以低速降低，直到检测到预定的目标接触负载。低速降低头部的处理包括以下步骤：使头部向下移动预定距离（S3），测量头部向下移动步骤后的负载（S5），以及确定所测量的接触负载是否已达到目标接触负载（S9）。重复下降头部（S3）和测量负载（S5）的步骤，直到测量的负载达到目标接触负载。实际负载被精确地控制为接近非常小的目标接触负载的设定水平。因此，使用低介电常数材料的电子部件安装而不会有损坏的危险。

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