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1. 发明授权

US08446436B2 Overdrive topology structure for transmission of RGB Signal 失效
标题翻译：用于传输RGB信号的过载拓扑结构
公开(公告)号：US08446436B2
公开(公告)日：2013-05-21
申请号：US12483260
申请日：2009-06-12
申请人： Shou-Kuo Hsu , Yu-Chang Pai , Cheng-Shien Li , Jia-Chi Chen
发明人： Shou-Kuo Hsu , Yu-Chang Pai , Cheng-Shien Li , Jia-Chi Chen
IPC分类号： G09G5/10 , H01P3/00
CPC分类号： H04L25/0278 , G09G5/04 , G09G2300/0426
摘要： An overdrive topology structure for transmission of a RGB signal includes a signal sending terminal, a signal receiving terminal, and a transmission line to transmit the RGB signal from the signal sending terminal to the signal receiving terminal. The transmission line is divided into a number of section transmission lines. A node is formed between every two section transmission lines. An impedance of a first section transmission line approaching to the signal sending terminal is less than an impedance of a second section transmission line approaching to the first section transmission line to overdrive the RGB signal at a first node between the first and second section transmission lines. At least one node except the first node is grounded via a resistor. An equivalent resistance of the resistor is equal to a resistance of the first resistor.
摘要翻译：用于传输RGB信号的过驱动拓扑结构包括信号发送端，信号接收端和传输线，以将RGB信号从信号发送端发送到信号接收端。传输线被分成多个部分传输线。在每两段传输线之间形成节点。接近信号发送端的第一部分传输线的阻抗小于接近第一部分传输线的第二部分传输线的阻抗，以在第一和第二部分传输线之间的第一节点处过驱动RGB信号。除第一个节点之外的至少一个节点通过电阻器接地。电阻器的等效电阻等于第一电阻器的电阻。

2. 发明授权

US08283994B2 Differential signal transmission device 失效
标题翻译：差分信号传输装置
公开(公告)号：US08283994B2
公开(公告)日：2012-10-09
申请号：US12560445
申请日：2009-09-16
申请人： Shou-Kuo Hsu , Cheng-Hsien Lee , Ying-Tso Lai , Hsiao-Yun Su , Jia-Chi Chen
发明人： Shou-Kuo Hsu , Cheng-Hsien Lee , Ying-Tso Lai , Hsiao-Yun Su , Jia-Chi Chen
IPC分类号： H03H7/38
CPC分类号： H04L25/0272
摘要： A differential signal transmission device transmits N differential signal pairs from a differential signal generator to a number of receiving terminals. The N differential signal pairs include N positive signals and N negative signals. The N positive signals are clustered at a first positive clustering point. The first positive clustering point is connected to a second positive clustering point via a first matching resistor. The second positive clustering point is grounded via a first grounding resistor, and outputs a number of positive signals to the number of receiving terminals respectively. The N negative signals are clustered at a first negative clustering point. The first negative clustering point is connected to a second negative clustering point via a second matching resistor. The second negative signal clustering point is grounded via a second grounding resistor, and outputs a number of negative signals to the number of receiving terminals respectively.
摘要翻译：差分信号传输装置将差分信号发生器的N个差分信号对发送到多个接收终端。 N个差分信号对包括N个正信号和N个负信号。 N个正信号聚集在第一个正聚类点。第一正聚集点通过第一匹配电阻连接到第二正聚集点。第二个正聚集点通过第一接地电阻接地，并分别输出多个正信号到接收端的数量。 N个负信号聚集在第一个负聚类点。第一负聚集点通过第二匹配电阻器连接到第二负聚集点。第二负信号聚簇点通过第二接地电阻接地，并分别输出多个负信号至接收端数。

3. 发明授权

US08283574B2 Printed circuit board with compound via 失效
标题翻译：印刷电路板与复合通孔
公开(公告)号：US08283574B2
公开(公告)日：2012-10-09
申请号：US13031617
申请日：2011-02-22
申请人： Yung-Chieh Chen , Cheng-Hsien Lee , Po-Chuan Hsieh , Shou-Kuo Hsu , Shin-Ting Yen , Dan-Chen Wu , Jia-Chi Chen
发明人： Yung-Chieh Chen , Cheng-Hsien Lee , Po-Chuan Hsieh , Shou-Kuo Hsu , Shin-Ting Yen , Dan-Chen Wu , Jia-Chi Chen
IPC分类号： H05K1/11
CPC分类号： H05K1/0251 , H05K1/0225 , H05K1/0295 , H05K1/0298 , H05K1/113
摘要： A printed circuit board (PCB) with compound via includes a substrate and a pair of through holes passing through the substrate. The substrate includes a signal layer which is the top layer of the substrate, a first reference layer adjacent to the signal layer, and a second reference layer not adjacent to the signal layer. A first and a second pair of pads are mounted on the signal layer. Each of the through holes extends through the first pair of pads such that the through hole and the first pair of pads jointly form a compound via. A first reserved opening is formed on the first reference layer and corresponds to the first and the second pair of pads and the compound via. A second reserved opening is formed on the second reference layer and surrounds the through hole thereon.
摘要翻译：具有复合通孔的印刷电路板（PCB）包括基板和穿过基板的一对通孔。衬底包括作为衬底的顶层的信号层，与信号层相邻的第一参考层和不与信号层相邻的第二参考层。第一和第二对焊盘安装在信号层上。每个通孔延伸穿过第一对垫，使得通孔和第一对垫共同形成复合通孔。第一保留开口形成在第一参考层上，并且对应于第一和第二对焊盘和复合通孔。第二保留开口形成在第二参考层上并围绕其上的通孔。

4. 发明授权

US08049673B2 Electronic device and multi-frequency antenna thereof 失效
标题翻译：电子设备及其多频天线
公开(公告)号：US08049673B2
公开(公告)日：2011-11-01
申请号：US12475512
申请日：2009-05-30
申请人： Po-Chuan Hsieh , Yu-Chang Pai , Hsiao-Yun Su , Chien-Hung Liu , Jia-Chi Chen
发明人： Po-Chuan Hsieh , Yu-Chang Pai , Hsiao-Yun Su , Chien-Hung Liu , Jia-Chi Chen
IPC分类号： H01Q13/00
CPC分类号： H01Q21/24 , G06F1/1616 , G06F1/1698 , H01Q1/2266 , H01Q13/08 , H01Q13/10
摘要： An electronic device includes a multi-frequency antenna. The multi-frequency antenna includes a ground portion, a support body, a radiation portion, and a strap. The ground portion defines a gap, and two grooves communicating with the gap and located at opposite ends of the gap. The radiation portion resists against a sidewall bounding the gap, and is connected to the strap. The radiation portion is accommodated in the gap and substantially coplanar with the ground portion. The radiation portion defines a slot. The support body is located in the gap and on the radiation portion, to support the strap.
摘要翻译：电子设备包括多频天线。多频天线包括接地部分，支撑体，辐射部分和带子。接地部分限定了间隙，并且两个凹槽与间隙连通并且位于间隙的相对端。辐射部分抵抗围绕间隙的侧壁，并且连接到带子。辐射部分容纳在间隙中并且基本上与接地部分共面。辐射部分限定狭缝。支撑体位于间隙和辐射部分上，以支撑带子。

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