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    • 1. 发明授权
    • Differential signal transmission device
    • 差分信号传输装置
    • US08283994B2
    • 2012-10-09
    • US12560445
    • 2009-09-16
    • Shou-Kuo HsuCheng-Hsien LeeYing-Tso LaiHsiao-Yun SuJia-Chi Chen
    • Shou-Kuo HsuCheng-Hsien LeeYing-Tso LaiHsiao-Yun SuJia-Chi Chen
    • H03H7/38
    • H04L25/0272
    • A differential signal transmission device transmits N differential signal pairs from a differential signal generator to a number of receiving terminals. The N differential signal pairs include N positive signals and N negative signals. The N positive signals are clustered at a first positive clustering point. The first positive clustering point is connected to a second positive clustering point via a first matching resistor. The second positive clustering point is grounded via a first grounding resistor, and outputs a number of positive signals to the number of receiving terminals respectively. The N negative signals are clustered at a first negative clustering point. The first negative clustering point is connected to a second negative clustering point via a second matching resistor. The second negative signal clustering point is grounded via a second grounding resistor, and outputs a number of negative signals to the number of receiving terminals respectively.
    • 差分信号传输装置将差分信号发生器的N个差分信号对发送到多个接收终端。 N个差分信号对包括N个正信号和N个负信号。 N个正信号聚集在第一个正聚类点。 第一正聚集点通过第一匹配电阻连接到第二正聚集点。 第二个正聚集点通过第一接地电阻接地,并分别输出多个正信号到接收端的数量。 N个负信号聚集在第一个负聚类点。 第一负聚集点通过第二匹配电阻器连接到第二负聚集点。 第二负信号聚簇点通过第二接地电阻接地,并分别输出多个负信号至接收端数。
    • 3. 发明授权
    • Method of optimizing parameters of electronic components on printed circuit boards
    • 优化印刷电路板上电子元器件参数的方法
    • US08266574B2
    • 2012-09-11
    • US13094807
    • 2011-04-26
    • Hsiao-Yun SuYing-Tso LaiCheng-Hsien Lee
    • Hsiao-Yun SuYing-Tso LaiCheng-Hsien Lee
    • G06F17/50
    • G06F17/505G06F17/5036G06F17/5068G06F2217/08
    • In a method of optimizing parameters of electronic components on printed circuit boards (PCBs), a first experiment table for m variables of one type of parameter of P electronic components on a PCB is designed using n values of each variable and the RSM. P EHs of each first experiment are obtained by simulating, and P EH empirical formulas are computed according to the P EHs. A second experiment table for the m variables is designed using n′ values of each variable and the full factorial design, and P EHs of each second experiment are computed using the P EH empirical formulas. Experiments, all the P EHs of which are greater than 1, are filtered from the second experiment tables, and an average EH of each filtered experiment is computed to pick an experiment the average EH of which is the greatest. The values of the m variables in the picked experiment are considered as optimized.
    • 在印刷电路板(PCB)上优化电子部件参数的方法中,使用每个变量和RSM的n个值设计PCB上P电子部件的一种类型参数的m个变量的第一个实验表。 通过模拟获得每个第一个实验的P EH,并且根据P EH计算P EH经验公式。 使用每个变量的n'值和全因子设计设计m个变量的第二个实验表,并且使用P EH经验公式计算每个第二个实验的P EH。 从第二个实验表中筛选出所有P EH大于1的实验,并计算每个滤波实验的平均EH,以选择其平均EH最大的实验。 所选实验中的m个变量的值被认为是优化的。
    • 7. 发明授权
    • Signal transmission apparatus
    • 信号传输装置
    • US08384491B2
    • 2013-02-26
    • US12620559
    • 2009-11-17
    • Po-Chuan HsiehHsiao-Yun SuYu-Chang PaiShou-Kuo Hsu
    • Po-Chuan HsiehHsiao-Yun SuYu-Chang PaiShou-Kuo Hsu
    • H01P3/08
    • H01Q13/08
    • A signal transmission apparatus includes two circuit layers. First and second ground sheets are arranged in the two circuit layers respectively. A third ground sheet is arranged between the two circuit layers. A differential pair includes a transmission line arranged between the first and third ground sheets and a transmission line arranged between the second and third ground sheets. The first to third ground sheets have same electric potential. Projections of the first and second ground sheets on the third ground sheet superpose a border of the third ground sheet. The third ground sheet is formed by extending the border along a signal transmission direction. A vertical distance between the first and second transmission lines is twice as each of a vertical distance from the first ground sheet to the first transmission line and a vertical distance from the second ground sheet to the second transmission line.
    • 信号传输装置包括两个电路层。 第一和第二接地片分别布置在两个电路层中。 第三接地片布置在两个电路层之间。 差动对包括布置在第一和第三接地片之间的传输线和布置在第二和第三接地片之间的传输线。 第一至第三接地片具有相同的电位。 第三接地片上的第一和第二接地片的投影叠加第三接地片的边界。 第三接地片是沿着信号传输方向延伸边界而形成的。 第一和第二传输线之间的垂直距离是从第一接地片到第一传输线的垂直距离以及从第二接地片到第二传输线的垂直距离的两倍。
    • 9. 发明授权
    • Printed circuit board
    • 印刷电路板
    • US08406005B2
    • 2013-03-26
    • US13050954
    • 2011-03-18
    • Hsiao-Yun SuYung-Chieh ChenCheng-Hsien Lee
    • Hsiao-Yun SuYung-Chieh ChenCheng-Hsien Lee
    • H05K7/10H05K7/12
    • H05K1/0245H05K1/0251H05K2201/09718
    • A printed circuit board includes first and second transmission lines connected to a first high speed differential signal control chip, third and fourth transmission lines connected to a second high speed differential signal control chip, and fifth and sixth transmission lines connected to a connector pad. To have the first high speed differential signal control chip communicate with the connector pad, the first transmission line is connected to the fifth transmission line through a first connection component, and the second transmission line is connected to the sixth transmission line through a second connection component. To have the second speed differential signal control chip communicate with the connector pad, the third transmission line is connected to the fifth transmission line through the first connection component, and the fourth transmission line is connected to the sixth transmission line through the second connection component.
    • 印刷电路板包括连接到第一高速差分信号控制芯片的第一和第二传输线,连接到第二高速差分信号控制芯片的第三和第四传输线以及连接到连接器焊盘的第五和第六传输线。 为了使第一高速差分信号控制芯片与连接器焊盘通信,第一传输线通过第一连接部件连接到第五传输线,并且第二传输线通过第二连接部件连接到第六传输线 。 为了使第二速度差分信号控制芯片与连接器焊盘通信,第三传输线通过第一连接部件连接到第五传输线,并且第四传输线通过第二连接部件连接到第六传输线。