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    • 2. 发明申请
    • Manufacturing method of semiconductor integrated circuit device
    • 半导体集成电路器件的制造方法
    • US20050090120A1
    • 2005-04-28
    • US10967277
    • 2004-10-19
    • Norio HasegawaKatsuya HayanoShoji Hotta
    • Norio HasegawaKatsuya HayanoShoji Hotta
    • G03C5/00G03F1/30G03F1/32G03F1/68G03F7/20H01L21/027H01L21/302H01L21/311H01L21/768
    • H01L21/76808G03F1/30G03F1/32G03F1/50H01L21/31144
    • In a massed region of each of a plurality of transfer areas of a mask a plurality of light transmission patterns are formed by opening a half-tone film. A phase shifter is disposed in each of the light transmission patterns so that a 180° phase inversion occurs between the lights that transmit through adjacent light transmission patterns. In a sparse region of the plurality of transfer areas a solitary light transmission pattern is formed by opening the half-tone film. Both shape and size are the same among the light transmission patterns, which are disposed symmetrically in both the massed and sparse regions about the center between the transfer areas. The phase shifters in the massed regions are disposed so that the phase of each phase shifter in one of the transfer areas comes to be opposed to that of its counterpart in the other transfer area. In the exposure process, those transfer areas are overlaid one upon another in the same chip region.
    • 在掩模的多个转印区域的每一个的质量区域中,通过打开半色调膜形成多个透光图案。 在每个透光图案中设置移相器,使得在通过相邻光传输图案传输的光之间发生180°的相位反转。 在多个转印区域的稀疏区域中,通过打开半色调膜形成单独的透光图案。 在透光图案之间的形状和尺寸都相同,所述光透射图案在转印区域之间的中心周围的质量和稀疏区域中对称地设置。 配置区域中的移相器被布置成使得其中一个传送区域中的每个移相器的相位与其它传送区域中的相应部件的相位相反。 在曝光处理中,这些传送区域在相同的芯片区域中彼此重叠。
    • 3. 发明授权
    • Manufacturing method of semiconductor integrated circuit device
    • 半导体集成电路器件的制造方法
    • US07387867B2
    • 2008-06-17
    • US10967277
    • 2004-10-19
    • Norio HasegawaKatsuya HayanoShoji Hotta
    • Norio HasegawaKatsuya HayanoShoji Hotta
    • G03F7/00
    • H01L21/76808G03F1/30G03F1/32G03F1/50H01L21/31144
    • In a massed region of each of a plurality of transfer areas of a mask a plurality of light transmission patterns are formed by opening a half-tone film. A phase shifter is disposed in each of the light transmission patterns so that a 180° phase inversion occurs between the lights that transmit through adjacent light transmission patterns. In a sparse region of the plurality of transfer areas a solitary light transmission pattern is formed by opening the half-tone film. Both shape and size are the same among the light transmission patterns, which are disposed symmetrically in both the massed and sparse regions about the center between the transfer areas. The phase shifters in the massed regions are disposed so that the phase of each phase shifter in one of the transfer areas comes to be opposed to that of its counterpart in the other transfer area. In the exposure process, those transfer areas are overlaid one upon another in the same chip region.
    • 在掩模的多个转印区域的每一个的质量区域中,通过打开半色调膜形成多个透光图案。 在每个透光图案中设置移相器,使得在通过相邻光传输图案传输的光之间发生180°的相位反转。 在多个转印区域的稀疏区域中,通过打开半色调膜形成单独的透光图案。 在透光图案之间的形状和尺寸都相同,所述光透射图案在转印区域之间的中心周围的质量和稀疏区域中对称地设置。 配置区域中的移相器被布置成使得其中一个传送区域中的每个移相器的相位与其它传送区域中的相应部件的相位相反。 在曝光处理中,这些传送区域在相同的芯片区域中彼此重叠。
    • 5. 发明授权
    • Fabrication method of semiconductor integrated circuit device and mask
    • 半导体集成电路器件和掩模的制造方法
    • US06939649B2
    • 2005-09-06
    • US10259397
    • 2002-09-30
    • Shoji HottaNorio HasegawaToshihiko Tanaka
    • Shoji HottaNorio HasegawaToshihiko Tanaka
    • G03F1/29G03F1/54G03F1/68G03F7/20H01L21/027G03F9/00G03C5/00
    • G03F1/29
    • A method of fabrication of a semiconductor integrated circuit device uses a mark having, on a first main surface of a mask substrate, a first light transmitting region, a second light transmitting region disposed at the periphery of the first light transmitting region and permitting inversion of the phase of light transmitted through the second light transmitting region relative to light transmitted through the first light transmitting region, and a light shielding region disposed at the periphery of the second light transmitting region. The second light transmitting region is formed from a first film deposited over the first main surface of the mask substrate, said light shielding region is formed by a second film deposited over the first main surface of the mask substrate via said first film, and at least one of said first film and second is formed from a resist film.
    • 半导体集成电路器件的制造方法使用在掩模衬底的第一主表面上具有第一透光区域,设置在第一透光区域的周围的第二透光区域并允许反转 透射通过第二透光区域的光相对于透过第一透光区域的光的相位,以及设置在第二透光区域周边的遮光区域。 第二透光区域由沉积在掩模基板的第一主表面上的第一膜形成,所述遮光区域由通过所述第一膜沉积在掩模基板的第一主表面上的第二膜形成,并且至少 所述第一膜和第二膜中的一个由抗蚀剂膜形成。
    • 7. 发明授权
    • Pattern dimension measurement method and charged particle beam apparatus
    • 图案尺寸测量方法和带电粒子束装置
    • US09297649B2
    • 2016-03-29
    • US14001433
    • 2011-12-12
    • Hiroki KawadaNorio HasegawaToru Ikegami
    • Hiroki KawadaNorio HasegawaToru Ikegami
    • G01B15/06G01N23/225H01J37/28H01J37/22G01N23/00H01J37/244
    • G01B15/06G01N23/00H01J37/222H01J37/244H01J37/28H01J2237/24578H01J2237/2816H01J2237/2817
    • The present invention aims to provide a pattern dimension measurement method for accurately measuring an amount of shrinkage of a pattern that shrinks and an original dimension value before the shrinkage and a charged particle beam apparatus.In order to attain the above-mentioned object, there are proposed a pattern dimension measurement method and a charged particle beam apparatus that are characterized by: forming a thin film on a sample including the pattern after carrying out beam scanning onto a first portion of the pattern; acquiring a first measurement value by scanning a beam onto a region corresponding to the first portion on which the thin film is formed; acquiring a second measurement value by scanning a beam onto a second portion that has identical dimensions as those of the first portion on design data; and finding the amount of shrinkage of the pattern based on subtraction processing of subtracting the first measurement value from the second measurement value.
    • 本发明的目的在于提供一种图形尺寸测量方法,用于精确测量收缩的图案的收缩量和收缩前的原始尺寸值以及带电粒子束装置。 为了实现上述目的,提出了一种图案尺寸测量方法和带电粒子束装置,其特征在于:在对包含图案的样品进行束扫描之后,在包含该图案的样品上形成薄膜至第一部分 模式; 通过将光束扫描到与其上形成有薄膜的第一部分对应的区域来获取第一测量值; 通过将光束扫描到与设计数据上的第一部分具有相同尺寸的第二部分上来获取第二测量值; 并且基于从第二测量值减去第一测量值的减法处理来找出图案的收缩量。
    • 9. 发明申请
    • PATTERN DIMENSION MEASUREMENT METHOD AND CHARGED PARTICLE BEAM APPARATUS
    • 图案尺寸测量方法和充电颗粒光束装置
    • US20140048706A1
    • 2014-02-20
    • US14001433
    • 2011-12-12
    • Hiroki KawadaNorio HasegawaToru Ikegami
    • Hiroki KawadaNorio HasegawaToru Ikegami
    • G01N23/00
    • G01B15/06G01N23/00H01J37/222H01J37/244H01J37/28H01J2237/24578H01J2237/2816H01J2237/2817
    • The present invention aims to provide a pattern dimension measurement method for accurately measuring an amount of shrinkage of a pattern that shrinks and an original dimension value before the shrinkage and a charged particle beam apparatus.In order to attain the above-mentioned object, there are proposed a pattern dimension measurement method and a charged particle beam apparatus that are characterized by: forming a thin film on a sample including the pattern after carrying out beam scanning onto a first portion of the pattern; acquiring a first measurement value by scanning a beam onto a region corresponding to the first portion on which the thin film is formed; acquiring a second measurement value by scanning a beam onto a second portion that has identical dimensions as those of the first portion on design data; and finding the amount of shrinkage of the pattern based on subtraction processing of subtracting the first measurement value from the second measurement value.
    • 本发明的目的在于提供一种图形尺寸测量方法,用于精确测量收缩的图案的收缩量和收缩前的原始尺寸值以及带电粒子束装置。 为了实现上述目的,提出了一种图案尺寸测量方法和带电粒子束装置,其特征在于:在对包含图案的样品进行束扫描之后,在包含该图案的样品上形成薄膜至第一部分 模式; 通过将光束扫描到与其上形成有薄膜的第一部分对应的区域来获取第一测量值; 通过将光束扫描到与设计数据上的第一部分具有相同尺寸的第二部分上来获取第二测量值; 并且基于从第二测量值减去第一测量值的减法处理来找出图案的收缩量。