会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 3. 发明授权
    • Semiconductor substrate manufacturing method
    • 半导体衬底制造方法
    • US06251754B1
    • 2001-06-26
    • US09074384
    • 1998-05-08
    • Hisayoshi OhshimaMasaki MatsuiKunihiro OnodaShoichi Yamauchi
    • Hisayoshi OhshimaMasaki MatsuiKunihiro OnodaShoichi Yamauchi
    • H01L2120
    • H01L21/76254
    • The invention provides a number of semiconductor substrate manufacturing methods with which, in manufacturing a semiconductor substrate having a semiconductor layer in an insulated state on a supporting substrate, it is possible to obtain a thick semiconductor layer with a simple process and cheaply while reducing impurity contamination of the semiconductor layer to a minimum. One of these methods includes a defective layer forming step of carrying out ion implantation to a predetermined depth from the surface of a base substrate to partition off a monocrystalline thin film layer at the surface of the base substrate by a defective layer formed by implanted ions, a semiconductor film forming step of forming a monocrystalline semiconductor film of a predetermined thickness on the monocrystalline thin film layer, a laminating step of laminating the base substrate by the surface of the monocrystalline semiconductor film to the supporting substrate, and a detaching step of detaching the base substrate laminated to the supporting substrate at the defective layer.
    • 本发明提供了许多半导体衬底制造方法,在制造具有在支撑衬底上具有绝缘状态的半导体层的半导体衬底的情况下,可以以简单的工艺获得厚半导体层并且在降低杂质污染的同时廉价 的半导体层。 这些方法之一包括从基底表面进行离子注入到预定深度的缺陷层形成步骤,以通过由注入离子形成的缺陷层在基底基板的表面分隔单晶薄膜层, 在单晶薄膜层上形成预定厚度的单晶半导体膜的半导体膜形成步骤,通过单晶半导体膜的表面将基底基板层压到支撑基板上的层压步骤,以及将基板 基底基板层叠到不良层的支撑基板。
    • 4. 发明授权
    • Method for producing a semiconductor substrate
    • 半导体基板的制造方法
    • US6060344A
    • 2000-05-09
    • US136294
    • 1998-08-19
    • Masaki MatsuiMasatake NagayaHisayoshi Ohshima
    • Masaki MatsuiMasatake NagayaHisayoshi Ohshima
    • H01L21/02H01L21/76H01L21/762H01L27/12H02L21/20
    • H01L21/76264H01L21/76297H01L21/76275H01L21/76286
    • In a method for producing a semiconductor substrate completed through a bonding process for joining a semiconductor wafer to a support substrate by performing heat treatment thereto in a state in which the semiconductor wafer is closely joined to the support substrate, the method according to the present invention includes the following steps, i.e., a depositing process for depositing a poly-crystal semiconductor which covers all areas of a surface to be bonded on the surface of the semiconductor wafer; a heat treatment process for performing the heat treatment to the semiconductor wafer provided after the depositing process, during a predetermined time under a temperature equal to or higher than the heat treatment temperature at the bonding process; and a polishing process for flattening the surface of the poly-crystal semiconductor provided after the heat treatment process. After the above processes were performed in order, the bonding process is performed after the polishing process.
    • 在半导体基板的制造方法中,通过在将半导体晶片紧密接合到支撑基板的状态下对半导体晶片与支撑基板进行热处理的接合工序而完成,本发明的方法 包括以下步骤,即,用于沉积覆盖半导体晶片表面上要接合的表面的所有区域的多晶半导体的沉积工艺; 在接合工序的等于或高于所述热处理温度的温度下的预定时间内对所述沉积工艺之后提供的所述半导体晶片进行热处理的热处理工艺; 以及用于使在热处理工艺之后提供的多晶半导体的表面变平的抛光工艺。 在进行上述处理之后,在抛光处理之后进行接合处理。
    • 5. 发明授权
    • Magnesium-based battery
    • 镁基电池
    • US08877383B2
    • 2014-11-04
    • US12819325
    • 2010-06-21
    • Masaki Matsui
    • Masaki Matsui
    • H01M4/48H01M4/46H01M10/054
    • H01M4/48H01M4/466H01M10/054Y02E60/12
    • An electrochemical device, such as a magnesium-ion battery, comprises a first electrode including a first active material, a second electrode, and an electrolyte located between the first electrode and the second electrode. The electrolyte may include a magnesium compound, such as a magnesium salt. In representative examples, an improved active material includes a group 15 chalcogenide, in particular a bismuth chalcogenide, such as bismuth oxide or other chalcogenide. In various examples, the improved active material may be used in a positive or negative electrode of an example battery.
    • 诸如镁离子电池的电化学装置包括第一电极,其包括位于第一电极和第二电极之间的第一活性材料,第二电极和电解质。 电解质可以包括镁化合物,例如镁盐。 在代表性实例中,改进的活性材料包括15族硫族化物,特别是硫族铋,如氧化铋或其它硫族化物。 在各种实施例中,改进的活性材料可用于示例性电池的正极或负极。
    • 10. 发明申请
    • POLYANION ACTIVE MATERIALS AND METHOD OF FORMING THE SAME
    • POLYANION活性材料及其形成方法
    • US20130029227A1
    • 2013-01-31
    • US13191028
    • 2011-07-26
    • Wei SongMasaki MatsuiToshihiko Tani
    • Wei SongMasaki MatsuiToshihiko Tani
    • H01M4/02H01M4/04
    • C01B33/22H01M4/366H01M4/5825H01M10/0525H01M10/054
    • A method of forming a polyanion active material that includes providing a carbon source, providing a mobile ion source, providing an active metal material, providing a network material, providing a flux material, and mixing the various materials. In one aspect, the mixing step may include grinding or pulverizing materials to a uniform fine mixture. In one aspect, a ball mill may be utilized to mix the components. Following the mixing of the materials, the mixture is heated to a predetermined temperature in a non-oxidizing atmosphere to form a reaction product. In one aspect, the mixture is heated to a temperature above a melting temperature of the flux material. In this manner, the flux material provides a medium in which the various reactants may react to form the desired reaction product. Following the heating of the mixture the reaction product is washed, forming a carbon coated polyanion active material. Also disclosed is a polyanion active material that includes the in situ reaction product of a carbon source, mobile ion source, active metal material, network material, and a flux material wherein the polyanion active material includes a carbon coating formed thereon.
    • 一种形成聚阴离子活性材料的方法,其包括提供碳源,提供可移动离子源,提供活性金属材料,提供网状材料,提供助焊剂材料和混合各种材料。 在一个方面,混合步骤可以包括将材料研磨或粉碎成均匀的细混合物。 在一个方面,可以使用球磨机来混合组分。 在混合材料之后,将混合物在非氧化性气氛中加热至预定温度以形成反应产物。 在一个方面,将混合物加热至高于助熔剂材料的熔融温度的温度。 以这种方式,助焊剂材料提供了各种反应物可以反应形成所需反应产物的介质。 在混合物加热之后,将反应产物洗涤,形成碳涂覆的聚阴离子活性材料。 还公开了一种聚阴离子活性材料,其包括碳源,可移动离子源,活性金属材料,网络材料和助焊剂材料的原位反应产物,其中聚阴离子活性材料包括其上形成的碳涂层。