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    • 1. 发明授权
    • Process for preparing silicon carbide powder for use in semiconductor
equipment
    • 制备用于半导体设备的碳化硅粉末的方法
    • US5318761A
    • 1994-06-07
    • US913951
    • 1992-07-17
    • Shoichi KojimaKazuhiro MinagawaTasuku SaitoTasuo KurachiHaruyuki Kano
    • Shoichi KojimaKazuhiro MinagawaTasuku SaitoTasuo KurachiHaruyuki Kano
    • C01B31/36C04B35/565H01L21/67C04B35/54
    • C01B31/36C01P2004/61C01P2004/62C01P2006/80
    • A process for the preparation of a beta-silicon carbide powder of high purity which is suitable for use in the manufacture of semiconductor equipment and which has a content of 1 ppm or less of each atom harmful to the manufacture of semiconductor devices. The process comprises preparing a carbon- and silicon-containing starting mixture comprising (a) at least one siliceous material selected from liquid silicon compounds and solid siliceous substances derived from a hydrolyzable silicon compound, and (b) at least one carbonaceous material selected from polymerizable or cross-linkable organic compounds prepared in the presence of a catalyst which is substantially free from atoms harmful to the manufacture of semiconductor devices. The starting mixture comprises at least one liquid substance used as component (a) or (b). The starting mixture is then solidified by heating and/or by use of a catalyst or a curing agent. The resulting solid body is optionally heat treated in a non-oxidizing atmosphere at a temperature in the range of from 500.degree. C. to 1300.degree. C. for a period sufficient to remove volatiles. The cured and optionally heat-treated body is calcined in a non-oxidizing atmosphere under conditions sufficient to give beta-silicon carbide powder.
    • 一种制备高纯度的β-碳化硅粉末的方法,其适用于制造半导体设备,并且其含量为每个对半导体器件的制造有害的原子的1ppm以下。 该方法包括制备含碳和含硅的起始混合物,其包含(a)至少一种选自液体硅化合物的硅质材料和源自可水解硅化合物的固体硅质物质,和(b)至少一种选自可聚合的 或可在不存在对半导体器件制造有害的原子的催化剂存在下制备的可交联的有机化合物。 起始混合物包含至少一种用作组分(a)或(b)的液体物质。 然后将起始混合物通过加热和/或通过使用催化剂或固化剂固化。 所得固体任选在非氧化性气氛中在500℃至1300℃的温度范围内热处理足以除去挥发物的时间。 固化和任选的热处理体在足以产生β-碳化硅粉末的条件下在非氧化性气氛中煅烧。
    • 2. 发明授权
    • Process for preparing a silicon carbide sintered body for use in
semiconductor equipment
    • 制备用于半导体设备的碳化硅烧结体的方法
    • US5589116A
    • 1996-12-31
    • US181945
    • 1994-01-18
    • Shoichi KojimaKazuhiro MinagawaHaruyuki KanoTadaaki MiyazakiHiroaki Wada
    • Shoichi KojimaKazuhiro MinagawaHaruyuki KanoTadaaki MiyazakiHiroaki Wada
    • C01B31/36C04B35/54C04B35/56
    • C01B31/36C01P2004/61C01P2004/62C01P2006/80
    • A process for the preparation of a silicon carbide sintered body of high purity which has a content of 1 ppm or less of each atom harmful to the manufacture of semiconductor equipment including the step of shaping a silicon carbide powder, calcining the shaped body in a non-oxidizing atmosphere to form a porous body, and subjecting the porous body to reaction sintering while being impregnated with molten metallic silicon. The starting silicon carbide powder also has a content of 1 ppm or less of each harmful atom and it has a free carbon content of not greater than 20% by weight and an average particle diameter of 0.5-20 .mu.m. Such silicon carbide powder can be prepared from a carbon- and silicon-containing starting mixture including at least one liquid hydrolyzable silicon compound and at least one carbonaceous material selected from polymerizable or cross-linkable organic compounds prepared in the presence of a catalyst which is substantially free from harmful atoms by solidifying the starting mixture and heating it so as to react and form silicon carbide.
    • 一种用于制备高纯度碳化硅烧结体的方法,其含有对于制造半导体设备有害的每个原子的1ppm以下,包括成形碳化硅粉末的步骤, 氧化气氛以形成多孔体,并且在浸渍熔融金属硅的同时使多孔体进行反应烧结。 起始碳化硅粉末的每个有害原子的含量为1ppm以下,游离碳含量为20重量%以下,平均粒径为0.5〜20μm。 这种碳化硅粉末可以由含碳和含硅的起始混合物制备,所述起始混合物包括至少一种液体可水解的硅化合物和至少一种选自在催化剂存在下制备的可聚合或可交联的有机化合物的碳质材料, 通过使起始混合物固化并加热以便反应并形成碳化硅,从而避免了有害原子。