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    • 4. 发明申请
    • REACTOR FEEDWATER SYSTEM
    • 反应器给水系统
    • US20080025455A1
    • 2008-01-31
    • US11778888
    • 2007-07-17
    • Kazuo HISAJIMAShigeki YOKOHAMATakuya MIYAGAWASeijiro SUZUKIKoichi KONDO
    • Kazuo HISAJIMAShigeki YOKOHAMATakuya MIYAGAWASeijiro SUZUKIKoichi KONDO
    • G21C9/00
    • G21C9/00G21D1/02Y02E30/31
    • A reactor feedwater system of a boiling water reactor includes: a reactor feedwater pump and a high pressure feedwater heater, that are arranged at an outside of a reactor containment vessel containing a reactor pressure vessel of a boiling water reactor, for pressurizing and heating a coolant; a main feedwater pipe for supplying the coolant, that are pressurized and heated by the reactor feedwater pump and the high pressure feedwater heater, to a side of the reactor containment vessel; and a plurality of branch pipes, that are connected to the main feedwater pipe, for pouring the coolant into the reactor pressure vessel. The main feedwater pipe is provided to the outside of the reactor containment vessel, and branching positions at which the branch pipes are branched from the main feedwater pipe are set to the outside of the reactor containment vessel, so that only the branch pipes penetrate through the reactor containment vessel and are connected to the reactor pressure vessel.
    • 沸水反应堆的反应器给水系统包括:反应器给水泵和高压给水加热器,其布置在包含沸水反应堆的反应堆压力容器的反应堆容器的外部,用于加压和加热冷却剂 ; 用于将由反应器给水泵和高压给水加热器加压和加热的冷却剂的主给水管提供到反应堆容纳容器的一侧; 以及多个分支管,其连接到主给水管,用于将冷却剂倾倒入反应堆压力容器。 主给水管设置在反应堆容器的外部,分支管从主给水管分支的分支位置设置在反应堆容器的外侧,使得只有分支管穿过反应堆容器 反应堆安全壳,并连接到反应堆压力容器。
    • 5. 发明申请
    • ELECTRONIC DEVICE AND LIQUID EJECTION APPARATUS
    • 电子装置和液体喷射装置
    • US20140092169A1
    • 2014-04-03
    • US14039550
    • 2013-09-27
    • Koichi KONDO
    • Koichi KONDO
    • H02M3/335B41J2/17B41J2/01
    • H02M3/33561B41J2/01B41J2/1707B41J29/38B41J2029/3932H02J9/005Y10T307/406
    • An electronic device includes: a device body; a power supply circuitry which supplies electric power to the device body; and a real-time clock which measures a current time. The power supply circuitry includes: a transformer which converts electric power input to a primary side of the transformer and outputs the converted power to a secondary side of the transformer; a switching element disposed on the primary side to perform switching of a current to be supplied to the primary winding; and a switching controller disposed on the primary side. The real-time clock is disposed on the primary side to receive electric power. The device body includes; a main controller disposed on the secondary side to control the electronic device that receives electric power on the secondary side; and a circuit which couples the main controller and the real-time clock to allow communication therebetween in an electrically insulated state.
    • 电子设备包括:设备主体; 电源电路,其向所述装置主体供电; 以及测量当前时间的实时时钟。 电源电路包括:变压器,其将输入的电力输入到变压器的初级侧,并将转换的电力输出到变压器的次级侧; 开关元件,其设置在所述初级侧,以执行要提供给所述初级绕组的电流的切换; 以及设置在初级侧的切换控制器。 实时时钟设置在初级侧以接收电力。 设备主体包括: 设置在次级侧的主控制器,用于控制在二次侧接收电力的电子设备; 以及连接主控制器和实时时钟以允许它们之间的电绝缘状态的电路。
    • 6. 发明申请
    • DEVICE CHIP AND MANUFACTURING METHOD THEREFOR
    • 设备芯片及其制造方法
    • US20130056857A1
    • 2013-03-07
    • US13605257
    • 2012-09-06
    • Koichi KONDO
    • Koichi KONDO
    • H01L23/544H01L21/78
    • H01L23/544H01L21/6836H01L2221/68327H01L2221/68336H01L2221/6834H01L2223/54433H01L2223/5448H01L2223/54493H01L2924/0002H01L2924/00
    • A manufacturing method for a device chip having a substrate, a device formed on the front side of the substrate, and chip identification information marked inside the substrate includes preparing a device wafer having a base wafer and a plurality of devices formed on the front side of the base wafer so as to be partitioned by division lines, next applying a laser beam having a transmission wavelength to the device wafer from the back side thereof in the condition where the focal point of the laser beam is set inside the base wafer at the positions respectively corresponding to the devices, thereby forming a plurality of modified layer marks as the chip identification information inside the base wafer at the positions respectively corresponding to the devices, and finally dividing the device wafer along the division lines to obtain a plurality of device chips.
    • 一种用于具有基板的器件芯片的制造方法,形成在基板的前侧的器件以及在基板内标记的芯片识别信息,包括:准备具有基底晶片的器件晶片和形成在基板的前侧的多个器件 该基底晶片被分割线划分,接着在激光束的焦点被设置在基底晶片的位置处的状态下,从其后侧将具有透射波长的激光束施加到器件晶片 分别对应于这些装置,从而在分别对应于装置的位置处形成多个修改层标记作为基底晶片内部的芯片识别信息,最后沿分割线划分器件晶片以获得多个器件芯片。