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    • 9. 发明授权
    • Sprayed coating and production method for the same
    • 喷涂及生产方法相同
    • US07390583B2
    • 2008-06-24
    • US10751109
    • 2004-01-05
    • Shinya MiyajiShinji Saito
    • Shinya MiyajiShinji Saito
    • B32B9/00
    • C23C4/11
    • A sprayed coating is proposed in which a problem of a condition of oxygen defect which cannot be solved by conventional densification of the sprayed coating is solved, whereby excellent electrical insulation and corrosion resistance can be simultaneously obtained. A sprayed coating formed by plasma spraying inside a semiconductor processing device comprises a metal oxide or a semiconductor oxide, and composition ratio of oxygen with respect to a metal or a semiconductor which composes oxides, that is (oxygen/(metal or semiconductor)) is not less than 80% of a composition ratio in the case of stoichiometric composition.
    • 提出了一种喷涂涂层,其中解决了通过喷涂的常规致密化不能解决的氧缺陷状态的问题,从而可以同时获得优异的电绝缘性和耐腐蚀性。 通过在半导体处理装置内等离子体喷涂形成的喷镀涂层包括金属氧化物或半导体氧化物,氧相对于构成氧化物(即氧(金属或半导体))的金属或半导体的组成比为 在化学计量组成的情况下不少于80%的组成比。