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1. 发明申请

US20100173163A1 METHOD FOR PRODUCING CURING AGENT HAVING ACIDIC SUBSTITUENT AND UNSATURATED MALEIMIDE GROUP, THERMOSETTING RESIN COMPOSITION, PREPREG, AND LAMINATE 有权
标题翻译：制备具有酸性取代基和不饱和马来酰亚胺基的固化剂，热固性树脂组合物，PREPREG和层压体的方法
公开(公告)号：US20100173163A1
公开(公告)日：2010-07-08
申请号：US12303627
申请日：2007-06-01
申请人： Shinji Tsuchikawa , Masanori Akiyama , Hikari Murai
发明人： Shinji Tsuchikawa , Masanori Akiyama , Hikari Murai
IPC分类号： B32B27/38 , B32B27/00 , C07D403/02 , C08G73/02 , C08G59/14 , C08L79/02
CPC分类号： C08L79/085 , B32B27/12 , B32B27/28 , B32B27/42 , B32B2307/3065 , B32B2457/00 , C07D207/452 , C08G59/46 , C08G73/12 , C08J5/24 , C08J2363/00 , C08K3/40 , C08K5/18 , C08K5/3492 , C09D163/00 , Y10T428/31504 , Y10T428/31511
摘要： The invention provides a method for producing a curing agent having an acidic substituent and an unsaturated maleimido group, including reacting, in an organic solvent, a maleimide compound (a) having at least two N-substituted maleimido groups in a molecule thereof with an amine compound (b) having an acidic substituent (represented by formula (I)); a thermosetting resin composition containing the curing agent (A) produced through the method and a compound (B) which is cured with the curing agent, wherein a cured product of the composition has a glass transition temperature of 200° C. or higher; and a prepreg and a laminated sheet produced therefrom. The curing agent produced through the method of the present invention has good solubility in an organic solvent and can provide a thermosetting resin composition exhibiting excellent adhesion-to-metal foil property, heat resistance, moisture resistance, flame retardancy, and copper cladding heat resistance, and low dielectric properties and low dielectric loss tangent. Therefore, the thermosetting resin composition can produce a prepreg or laminated sheet exhibiting excellent performance suitable for a printed wiring board for electronic devices and similar devices.
摘要翻译：本发明提供一种具有酸性取代基和不饱和马来酰亚胺基的固化剂的制备方法，包括在有机溶剂中使分子中具有至少两个N-取代的马来酰亚胺基的马来酰亚胺化合物（a）与胺具有酸性取代基的化合物（b）（由式（I）表示））; 含有通过该方法制备的固化剂（A）和用固化剂固化的化合物（B）的热固性树脂组合物，其中组合物的固化产物的玻璃化转变温度为200℃以上; 和由其制成的预浸料和层压片。通过本发明的方法制备的固化剂在有机溶剂中具有良好的溶解性，并且可以提供表现出优异的粘合性 - 金属箔性，耐热性，耐湿性，阻燃性和铜包层耐热性的热固性树脂组合物，低介电特性和低介电损耗角正切。因此，热固性树脂组合物可以制造出适用于电子设备和类似装置的印刷线路板的表现出优异性能的预浸料或层压片。

2. 发明申请

US20120316263A1 Method for Producing Curing Agent Having Acidic Substituent and Unsaturated Maleimide Group, Thermosetting Resin Composition, Prepreg, and Laminate 有权
标题翻译：具有酸性取代基和不饱和马来酰亚胺基团的固化剂的生产方法，热固性树脂组合物，预浸料和层合物
公开(公告)号：US20120316263A1
公开(公告)日：2012-12-13
申请号：US13527995
申请日：2012-06-20
申请人： Shinji Tsuchikawa , Masanori Akiyama , Hikari Murai
发明人： Shinji Tsuchikawa , Masanori Akiyama , Hikari Murai
IPC分类号： C08L79/04 , C08L63/04 , C08K5/09
CPC分类号： C08L79/085 , B32B27/12 , B32B27/28 , B32B27/42 , B32B2307/3065 , B32B2457/00 , C07D207/452 , C08G59/46 , C08G73/12 , C08J5/24 , C08J2363/00 , C08K3/40 , C08K5/18 , C08K5/3492 , C09D163/00 , Y10T428/31504 , Y10T428/31511
摘要： A method for producing a curing agent having an acidic substituent and an unsaturated maleimido group, including reacting, in an organic solvent, a maleimide compound (a) having at least two N-substituted maleimido groups in a molecule thereof with an amine compound (b) having an acidic substituent (represented by formula (I) below); a thermosetting resin composition containing the curing agent (A) produced through the method and a compound (B) which is cured with the curing agent, wherein a cured product of the composition has a glass transition temperature of 200° C. or higher; and a prepreg and a laminated sheet produced therefrom. The thermosetting resin composition can produce a prepreg or laminated sheet exhibiting excellent performance suitable for a printed wiring board for electronic devices and similar devices.
摘要翻译：一种制备具有酸性取代基和不饱和马来酰亚胺基的固化剂的方法，包括在有机溶剂中使分子中具有至少两个N-取代的马来酰亚胺基的马来酰亚胺化合物（a）与胺化合物（b ）具有酸性取代基（由下式（I）表示）; 含有通过该方法制备的固化剂（A）和用固化剂固化的化合物（B）的热固性树脂组合物，其中组合物的固化产物的玻璃化转变温度为200℃以上; 和由其制成的预浸料和层压片。热固性树脂组合物可以制造出适合于电子设备和类似装置的印刷线路板的表现出优异性能的预浸料或层压片。

3. 发明授权

US08796473B2 Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminate 有权
标题翻译：具有酸性取代基和不饱和马来酰亚胺基团的固化剂的生产方法，热固性树脂组合物，预浸料和层压材料
公开(公告)号：US08796473B2
公开(公告)日：2014-08-05
申请号：US12303627
申请日：2007-06-01
申请人： Shinji Tsuchikawa , Masanori Akiyama , Hikari Murai
发明人： Shinji Tsuchikawa , Masanori Akiyama , Hikari Murai
IPC分类号： C07D403/06 , C07D403/12
CPC分类号： C08L79/085 , B32B27/12 , B32B27/28 , B32B27/42 , B32B2307/3065 , B32B2457/00 , C07D207/452 , C08G59/46 , C08G73/12 , C08J5/24 , C08J2363/00 , C08K3/40 , C08K5/18 , C08K5/3492 , C09D163/00 , Y10T428/31504 , Y10T428/31511
摘要： The invention provides a method for producing a curing agent having an acidic substituent and an unsaturated maleimido group, including reacting, in an organic solvent, a maleimide compound (a) having at least two N-substituted maleimido groups in a molecule thereof with an amine compound (b) having an acidic substituent (represented by formula (I)); a thermosetting resin composition containing the curing agent (A) produced through the method and a compound (B) which is cured with the curing agent, wherein a cured product of the composition has a glass transition temperature of 200° C. or higher; and a prepreg and a laminated sheet produced therefrom. The curing agent produced through the method of the present invention has good solubility in an organic solvent and can provide a thermosetting resin composition exhibiting excellent adhesion-to-metal foil property, heat resistance, moisture resistance, flame retardancy, and copper cladding heat resistance, and low dielectric properties and low dielectric loss tangent. Therefore, the thermosetting resin composition can produce a prepreg or laminated sheet exhibiting excellent performance suitable for a printed wiring board for electronic devices and similar devices.
摘要翻译：本发明提供一种具有酸性取代基和不饱和马来酰亚胺基的固化剂的制备方法，包括在有机溶剂中使分子中具有至少两个N-取代的马来酰亚胺基的马来酰亚胺化合物（a）与胺具有酸性取代基的化合物（b）（由式（I）表示））; 含有通过该方法制备的固化剂（A）和用固化剂固化的化合物（B）的热固性树脂组合物，其中组合物的固化产物的玻璃化转变温度为200℃以上; 和由其制成的预浸料和层压片。通过本发明的方法制备的固化剂在有机溶剂中具有良好的溶解性，并且可以提供表现出优异的粘合性 - 金属箔性，耐热性，耐湿性，阻燃性和铜包层耐热性的热固性树脂组合物，低介电特性和低介电损耗角正切。因此，热固性树脂组合物可以制造出适用于电子设备和类似装置的印刷线路板的表现出优异性能的预浸料或层压片。

4. 发明授权

US08461332B2 Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminate 有权
标题翻译：具有酸性取代基和不饱和马来酰亚胺基团的固化剂的生产方法，热固性树脂组合物，预浸料和层压材料
公开(公告)号：US08461332B2
公开(公告)日：2013-06-11
申请号：US13527995
申请日：2012-06-20
申请人： Shinji Tsuchikawa , Masanori Akiyama , Hikari Murai
发明人： Shinji Tsuchikawa , Masanori Akiyama , Hikari Murai
IPC分类号： C07D251/48 , C07D207/452
CPC分类号： C08L79/085 , B32B27/12 , B32B27/28 , B32B27/42 , B32B2307/3065 , B32B2457/00 , C07D207/452 , C08G59/46 , C08G73/12 , C08J5/24 , C08J2363/00 , C08K3/40 , C08K5/18 , C08K5/3492 , C09D163/00 , Y10T428/31504 , Y10T428/31511
摘要： A method for producing a curing agent having an acidic substituent and an unsaturated maleimido group, including reacting, in an organic solvent, a maleimide compound (a) having at least two N-substituted maleimido groups in a molecule thereof with an amine compound (b) having an acidic substituent (represented by formula (I) below); a thermosetting resin composition containing the curing agent (A) produced through the method and a compound (B) which is cured with the curing agent, wherein a cured product of the composition has a glass transition temperature of 200° C. or higher; and a prepreg and a laminated sheet produced therefrom. The thermosetting resin composition can produce a prepreg or laminated sheet exhibiting excellent performance suitable for a printed wiring board for electronic devices and similar devices.
摘要翻译：一种制备具有酸性取代基和不饱和马来酰亚胺基的固化剂的方法，包括在有机溶剂中使分子中具有至少两个N-取代的马来酰亚胺基的马来酰亚胺化合物（a）与胺化合物（b ）具有酸性取代基（由下式（I）表示）; 含有通过该方法制备的固化剂（A）和用固化剂固化的化合物（B）的热固性树脂组合物，其中组合物的固化产物的玻璃化转变温度为200℃以上; 和由其制成的预浸料和层压片。热固性树脂组合物可以制造出适合于电子设备和类似装置的印刷线路板的表现出优异性能的预浸料或层压片。

5. 发明申请

US20120276392A1 THERMOSETTING RESIN COMPOSITION, METHOD FOR PRODUCING RESIN COMPOSITION VARNISH, PREPREG AND LAMINATE 审中-公开
标题翻译：热固性树脂组合物，用于生产树脂组合物变性的方法，PREPREG和层压体
公开(公告)号：US20120276392A1
公开(公告)日：2012-11-01
申请号：US13518578
申请日：2010-12-24
申请人： Yoshihiro Takahashi , Yasuo Kamigata , Hikari Murai , Masahiro Aoshima , Shinji Tsuchikawa , Masato Miyatake , Tomohiko Kotake , Hiroyuki Izumi
发明人： Yoshihiro Takahashi , Yasuo Kamigata , Hikari Murai , Masahiro Aoshima , Shinji Tsuchikawa , Masato Miyatake , Tomohiko Kotake , Hiroyuki Izumi
IPC分类号： C08K5/3415 , C09D163/00 , B32B15/092 , B05D5/00 , B32B15/08 , C08L63/00 , B32B37/14
CPC分类号： C09D163/04 , B32B15/08 , B32B27/04 , B32B27/18 , C08J5/24 , C08J2300/24 , C08J2363/00 , C08K3/013 , C08K3/22 , C08K3/34 , C08K3/36 , C08K5/3415 , C08K13/02 , C08K2003/2206 , C08K2003/2227 , C08K2003/2255 , C08K2003/2296 , C08L63/00 , C09D7/61 , C09D7/63 , C09D163/00 , H05K1/0306 , H05K1/0366 , H05K1/0373 , H05K3/0047 , H05K2201/0129 , H05K2201/0209 , Y10T156/10 , Y10T428/31529 , Y10T428/31678
摘要： Discloses are a thermosetting resin composition containing a maleimide compound including an unsaturated maleimide compound having a specified chemical structure, a thermosetting resin, an inorganic filler, and a molybdenum compound; a laminate plate for wiring boards obtained by coating a base material with a thermosetting resin composition containing a thermosetting resin, silica, and a specified molybdenum compound and then performing semi-curing to form a prepreg, and laminating and molding the prepreg; and a method for manufacturing a resin composition varnish including specified steps. According to the present invention, electronic components having low thermal expansion properties and excellent drilling processability and heat resistance, for example, a prepreg, a laminate plate, an interposer, etc., can be provided.
摘要翻译：公开了含有包含具有特定化学结构的不饱和马来酰亚胺化合物，热固性树脂，无机填料和钼化合物的马来酰亚胺化合物的热固性树脂组合物; 通过用含有热固性树脂，二氧化硅和特定的钼化合物的热固性树脂组合物涂覆基底材料然后进行半固化以形成预浸料而获得的布线板层叠板，并且对预浸料进行层压和模塑; 以及包括特定步骤的树脂组合物清漆的制造方法。根据本发明，可以提供具有低热膨胀性能和优异的钻孔加工性和耐热性的电子部件，例如预浸料，层压板，插入件等。

6. 发明申请

US20130172459A1 PROCESS FOR PRODUCING COMPATIBILIZED RESIN, THERMOSETTING RESIN COMPOSITION, PREPREG, AND LAMINATE 审中-公开
标题翻译：生产混合树脂，热固性树脂组合物，PREPREG和层压板的方法
公开(公告)号：US20130172459A1
公开(公告)日：2013-07-04
申请号：US13814350
申请日：2011-08-05
申请人： Shinji Tsuchikawa , Hiroyuki Izumi , Kumiko Ishikura , Hikari Murai
发明人： Shinji Tsuchikawa , Hiroyuki Izumi , Kumiko Ishikura , Hikari Murai
IPC分类号： C08L83/06
CPC分类号： C08L83/06 , B32B5/022 , B32B5/024 , B32B5/08 , B32B7/06 , B32B15/14 , B32B15/20 , B32B2260/023 , B32B2260/046 , B32B2262/0276 , B32B2262/101 , B32B2307/306 , B32B2307/3065 , B32B2307/51 , B32B2307/714 , B32B2307/734 , B32B2307/748 , B32B2457/00 , C08G73/0644 , C08G73/0655 , C08G77/16 , C08G77/452 , C08J5/24 , C08J2383/10 , C08K9/06 , H05K1/0326 , H05K1/0366 , H05K1/0373 , H05K2201/0209 , H05K2201/029 , C08L83/10
摘要： Provided are a process for producing a compatibilized resin including reacting a cyanate compound, a siloxane resin having a hydroxyl group at an end thereof, and an epoxy resin at a specified rate of reaction; a thermosetting resin composition containing (A1) a compatibilized resin produced by the foregoing process or (A2) a thermosetting resin obtained by reacting a cyanate compound and a siloxane resin having a hydroxyl group at an end thereof at a specified rate of reaction, and (B) fused silica having been subjected to a surface treatment with a trimethoxysilane compound; and a prepreg, a laminate, and a wiring board each using the same. The foregoing thermosetting resin composition is excellent in terms of all of low thermal expansion, adhesiveness to copper foil, heat resistance, flame retardancy, copper-clad heat resistance (T-300), dielectric characteristics, and drillability, achieves the high density and high reliability of wiring boards required at present, and can be widely used for production of electronic appliances and the like.
摘要翻译：提供一种生产相容化树脂的方法，包括使氰酸酯化合物，其末端具有羟基的硅氧烷树脂和环氧树脂以规定的反应速率反应; 含有（A1）通过上述方法制造的相容化树脂的热固性树脂组合物或（A2）通过使氰酸酯化合物和其末端具有羟基的硅氧烷树脂以规定的反应速率反应得到的热固性树脂和（ B）已经用三甲氧基硅烷化合物进行表面处理的熔融二氧化硅; 以及各自使用的预浸料坯，层叠体和配线基板。上述热固性树脂组合物在低热膨胀，与铜箔的粘合性，耐热性，阻燃性，包铜耐热性（T-300），介电特性和可钻性方面都是优异的，实现了高密度和高目前所需的接线板的可靠性，并且可广泛用于电子设备等的生产。

7. 发明申请

US20120237751A1 PREPREG, LAMINATE OBTAINED WITH THE SAME AND PRINTED-WIRING BOARD 有权
标题翻译： PREPREG，与其相同的印刷板和印刷线路板
公开(公告)号：US20120237751A1
公开(公告)日：2012-09-20
申请号：US13352783
申请日：2012-01-18
申请人： Tomohiko KOTAKE , Masato Miyatake , Shunsuke Nagai , Hiroyuki Izumi , Shinji Tsuchikawa , Shin Takanezawa , Hikari Murai
发明人： Tomohiko KOTAKE , Masato Miyatake , Shunsuke Nagai , Hiroyuki Izumi , Shinji Tsuchikawa , Shin Takanezawa , Hikari Murai
IPC分类号： B32B17/06 , B32B27/38
CPC分类号： B32B5/26 , B32B5/28 , B32B15/14 , B32B15/20 , B32B2250/04 , B32B2250/40 , B32B2260/023 , B32B2260/046 , B32B2262/101 , B32B2307/206 , B32B2307/734 , B32B2457/08 , C08J5/24 , C08J2300/24 , Y10T428/249921 , Y10T428/31525 , Y10T428/31612
摘要： Disclosed is a prepreg including a fiber substrate and a layer made of a thermosetting resin composition, wherein the layer made of a thermosetting resin composition contains a modified silicone oil or a compound having a skeleton derived from a modified silicone oil, and the layer made of a thermosetting resin composition has a phase separation structure.A prepreg having excellent low thermal expansion properties and warpage characteristics which are difficult to be realized by using only a conventional resin which is effective for highly filling an inorganic filler or has a low coefficient of thermal expansion, and a laminate using the same, and a printed wiring board can be provided.
摘要翻译：公开了一种预浸料，其包括纤维基材和由热固性树脂组合物制成的层，其中由热固性树脂组合物制成的层包含改性硅油或具有衍生自改性硅油的骨架的化合物，并且由热固性树脂组合物具有相分离结构。具有优异的低热膨胀特性和翘曲特性的预浸料，其难以通过仅使用有效用于高填充无机填料或具有低热膨胀系数的常规树脂和使用其的层压体而实现，可以提供印刷电路板。

8. 发明申请

US20120077401A1 RESIN COMPOSITION FOR PRODUCTION OF CLAD LAYER, RESIN FILM FOR PRODUCTION OF CLAD LAYER UTILIZING THE RESIN COMPOSITION, AND OPTICAL WAVEGUIDE AND OPTICAL MODULE EACH UTILIZING THE RESIN COMPOSITION OR THE RESIN FILM 审中-公开
标题翻译：用于生产层状树脂的树脂组合物，用于生产使用树脂组合物的层状树脂的树脂膜，以及使用树脂组合物或树脂膜的光学波长和光学模块
公开(公告)号：US20120077401A1
公开(公告)日：2012-03-29
申请号：US13258763
申请日：2010-03-26
申请人： Tomohiko Kotake , Shinji Tsuchikawa , Hiroyuki Izumi , Masato Miyatake , Shin Takanezawa , Hikari Murai , Tetsurou Irino
发明人： Tomohiko Kotake , Shinji Tsuchikawa , Hiroyuki Izumi , Masato Miyatake , Shin Takanezawa , Hikari Murai , Tetsurou Irino
IPC分类号： B32B27/42 , C08K5/3492 , B32B5/02 , C08L63/00 , C08L61/14 , B32B27/38 , C08K5/3445 , C08K13/02
CPC分类号： C09D179/085 , B32B5/02 , B32B5/24 , B32B15/14 , B32B27/06 , B32B27/18 , B32B27/20 , B32B27/281 , B32B27/283 , B32B27/325 , B32B27/36 , B32B27/38 , B32B27/42 , B32B2260/021 , B32B2260/023 , B32B2260/046 , B32B2264/102 , B32B2307/306 , B32B2307/50 , B32B2307/536 , B32B2307/714 , B32B2307/7265 , B32B2457/08 , C08G59/5073 , C08J5/24 , C08L63/00 , C08L79/085 , C09D163/00 , H05K1/0353 , Y10T428/24802 , Y10T428/249921 , Y10T428/31721 , Y10T442/2721 , C08L79/08
摘要： A thermosetting resin composition containing: (A) a resin composition having an unsaturated maleimide group, produced by reacting (a) a maleimide compound having at least two N-substituted maleimide groups per one molecule and (b) an amine compound having at least two primary amino groups per one molecule, in an organic solvent; (B) a thermosetting resin; and (C) a modified imidazole compound, such as an isocyanate-masked imidazole and an epoxy-masked imidazole, and a prepreg, an insulating film with a support, a laminate plate and a printed wiring board, each containing the same.
摘要翻译：一种热固性树脂组合物，其含有：（A）具有不饱和马来酰亚胺基团的树脂组合物，其通过（a）每分子具有至少两个N-取代马来酰亚胺基团的马来酰亚胺化合物与（b）具有至少两个每个分子中的伯氨基，在有机溶剂中; （B）热固性树脂; 和（C）改性的咪唑化合物，例如异氰酸酯掩蔽的咪唑和环氧屏蔽的咪唑，以及预浸料，具有载体的绝缘膜，层压板和印刷线路板，各自含有它们。

9. 发明授权

US09079376B2 Prepreg, laminate obtained with the same and printed-wiring board 有权
标题翻译：预浸料，用相同和印刷电路板获得的层压板
公开(公告)号：US09079376B2
公开(公告)日：2015-07-14
申请号：US13352783
申请日：2012-01-18
申请人： Tomohiko Kotake , Masato Miyatake , Shunsuke Nagai , Hiroyuki Izumi , Shinji Tsuchikawa , Shin Takanezawa , Hikari Murai
发明人： Tomohiko Kotake , Masato Miyatake , Shunsuke Nagai , Hiroyuki Izumi , Shinji Tsuchikawa , Shin Takanezawa , Hikari Murai
IPC分类号： B32B17/00 , B32B17/02 , B32B25/20 , B32B5/26 , B32B5/28 , B32B15/14 , B32B15/20 , C08J5/24
CPC分类号： B32B5/26 , B32B5/28 , B32B15/14 , B32B15/20 , B32B2250/04 , B32B2250/40 , B32B2260/023 , B32B2260/046 , B32B2262/101 , B32B2307/206 , B32B2307/734 , B32B2457/08 , C08J5/24 , C08J2300/24 , Y10T428/249921 , Y10T428/31525 , Y10T428/31612
摘要： Disclosed is a prepreg including a fiber substrate and a layer made of a thermosetting resin composition, wherein the layer made of a thermosetting resin composition contains a modified silicone oil or a compound having a skeleton derived from a modified silicone oil, and the layer made of a thermosetting resin composition has a phase separation structure.A prepreg having excellent low thermal expansion properties and warpage characteristics which are difficult to be realized by using only a conventional resin which is effective for highly filling an inorganic filler or has a low coefficient of thermal expansion, and a laminate using the same, and a printed wiring board can be provided.
摘要翻译：公开了一种预浸料，其包括纤维基材和由热固性树脂组合物制成的层，其中由热固性树脂组合物制成的层包含改性硅油或具有衍生自改性硅油的骨架的化合物，并且由热固性树脂组合物具有相分离结构。具有优异的低热膨胀特性和翘曲特性的预浸料，其难以通过仅使用有效用于高填充无机填料或具有低热膨胀系数的常规树脂和使用其的层压体而实现，可以提供印刷电路板。

10. 发明申请

US20100279129A1 THERMOSETTING RESIN COMPOSITION AND PREPREG AND LAMINATE BOTH MADE WITH THE SAME. 审中-公开
标题翻译：热固性树脂组合物及其制备和层压体与其相同。
公开(公告)号：US20100279129A1
公开(公告)日：2010-11-04
申请号：US12810387
申请日：2008-06-19
申请人： Shinji Tsuchikawa , Masanori Akiyama , Tomohiko Kotake
发明人： Shinji Tsuchikawa , Masanori Akiyama , Tomohiko Kotake
IPC分类号： B32B15/08 , C08K5/3492
CPC分类号： C08K5/5333 , B32B5/02 , B32B15/092 , B32B15/20 , B32B2457/08 , C08G59/56 , C08J5/24 , C08J2363/00 , C08J2363/04 , C08K3/22 , C08K3/32 , C08K3/36 , C08K2003/2227 , C08L63/00 , C08L63/04 , C08L2201/02 , C09J163/00 , C09J163/04 , C09J2205/102 , H05K1/0353 , Y10T428/31678
摘要： The present invention provides a thermosetting resin composition comprising (A) a metal salt of disubstituted phosphinic acid, (B) a maleimide compound having a N-substituted maleimide group in a molecule, (C) a 6-substituted guanamine compound or dicyandiamide and (D) an epoxy resin having at least two epoxy groups in a molecule and a prepreg and a laminated plate which are prepared by using the same. The prepregs obtained by impregnating or coating a base material with the thermosetting resin compositions of the present invention and the laminated plates produced by laminating and molding the above prepregs are balanced in all of a copper foil adhesive property, a glass transition temperature, a solder heat resistance, a moisture absorption, a flame resistance, a relative dielectric constant and a dielectric loss tangent, and they are useful as a printed wiring board for electronic instruments.
摘要翻译：本发明提供一种热固性树脂组合物，其包含（A）二取代次膦酸的金属盐，（B）分子中具有N-取代的马来酰亚胺基的马来酰亚胺化合物，（C）6-取代的胍胺化合物或双氰胺和（ D）在分子中具有至少两个环氧基的环氧树脂和通过使用它们制备的预浸料和层压板。通过用本发明的热固性树脂组合物浸渍或涂覆基材获得的预浸料和通过层压和模塑上述预浸料制成的层压板均具有铜箔粘合性，玻璃化转变温度，焊料热电阻，吸湿性，阻燃性，相对介电常数和介电损耗角正切，并且它们可用作电子仪器的印刷线路板。

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