专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06943445B2 Semiconductor device having bridge-connected wiring structure 有权
标题翻译：具有桥接布线结构的半导体器件
公开(公告)号：US06943445B2
公开(公告)日：2005-09-13
申请号：US10468038
申请日：2002-03-29
申请人： Shinji Shirakawa , Akira Mishima , Keiichi Mashino , Toshiyuki Innami , Shinichi Fujino , Hiromichi Anan , Yoshitaka Ochiai
发明人： Shinji Shirakawa , Akira Mishima , Keiichi Mashino , Toshiyuki Innami , Shinichi Fujino , Hiromichi Anan , Yoshitaka Ochiai
IPC分类号： H01L23/538 , H01L25/07 , H02M7/00 , H01L23/34
CPC分类号： H02M7/003 , H01L23/5383 , H01L23/645 , H01L24/48 , H01L24/49 , H01L25/072 , H01L25/18 , H01L2224/32225 , H01L2224/40225 , H01L2224/48091 , H01L2224/48111 , H01L2224/48227 , H01L2224/48472 , H01L2224/49111 , H01L2224/49175 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01029 , H01L2924/01074 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/19041 , H01L2924/19043 , H01L2924/19107 , H01L2924/30105 , H01L2924/30107 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： The present invention provides a semiconductor device which reduces an inductance of wiring for bridge-connecting semiconductor switches and realizes a reduction in size. Within the semiconductor device formed are two controllable bridge-connected semiconductor switches 13a and 13b, an output terminal, positive/negative polarity DC terminals 2 and 3, and an insulating substrate 15a in which conductor layers 12, 17 and 19 having a conductor section and in an inner layer for bridge-connecting the semiconductor switches to the DC terminals on a surface thereof and insulating layers 16 and 18 are alternately laminated. The surface and inner-layer conductor layers 12 and 17 which interpose the insulating layer 16 therebetween are electrically connected by a conductor 20 passing through the insulating layer 16 interposed between the conductor layers 12 and 17. A current path (dotted line) is so provided as to allow current flowing through a bridge circuit for mounting the two semiconductor switches on the insulating substrate to flow in opposite directions between the conductor layers 12 and 17 which interpose the insulating layer 16 therebetween.
摘要翻译：本发明提供一种降低用于桥接半导体开关的布线的电感的半导体器件，并且实现了尺寸的减小。在形成的半导体器件内部有两个可控制的桥接半导体开关13a和13b，一个输出端子，正/负极性DC端子2和3以及绝缘基板15a，其中导体层12,17和19具有导体部分和用于将半导体开关桥接到其表面上的DC端子的内层中，并且绝缘层16和18交替层叠。其间插入绝缘层16的表面和内层导体层12和17通过插在导体层12和17之间的绝缘层16的导体20电连接。提供电流路径（虚线），以允许电流流过用于将绝缘基板上的两个半导体开关安装在绝缘基板上的电桥流动，以在导体层12和17之间的相反方向流动，其间插入绝缘层16。

2. 发明授权

US06843335B2 Power conversion apparatus and mobile object incorporating thereof 有权
标题翻译：电力转换装置及其结合的移动体
公开(公告)号：US06843335B2
公开(公告)日：2005-01-18
申请号：US10024338
申请日：2001-12-21
申请人： Shinji Shirakawa , Akira Mishima , Keiichi Mashino , Toshiyuki Innami , Shinichi Fujino , Hiromichi Anan , Yoshitaka Ochiai
发明人： Shinji Shirakawa , Akira Mishima , Keiichi Mashino , Toshiyuki Innami , Shinichi Fujino , Hiromichi Anan , Yoshitaka Ochiai
IPC分类号： H02M7/04 , B60L11/14 , B60L11/18 , H01L23/50 , H01L25/16 , H02M7/00 , H02M7/5387 , H02P27/06 , H05K7/14 , B60K1/00
CPC分类号： B60L15/007 , B60L11/1803 , H01L23/50 , H01L24/48 , H01L24/49 , H01L25/162 , H01L25/165 , H01L2224/0603 , H01L2224/48091 , H01L2224/48472 , H01L2224/4903 , H01L2224/49051 , H01L2224/49111 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01074 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H02M7/003 , H05K7/1432 , Y02T10/645 , Y02T10/7005 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A positive side conductor and a negative side conductor of an input terminal electrically connected to semiconductor elements, are electrically insulated from each other, and are laminated with each other, and the input terminal having such a laminated structure, an output terminal and substrates mounted thereon the semiconductor elements are arranged in a checkered pattern in a container. Further, the semiconductor elements mounted on the substrates, the input terminal and the output terminal are electrically connected to one another so as to obtain a loop-like electric path on a conductive member, thereby it is possible to aim at miniaturizing the power conversion apparatus and lowering the inductance thereof.
摘要翻译：与半导体元件电连接的输入端子的正侧导体和负极导体彼此电绝缘，并且彼此层叠，并且具有这种层叠结构的输入端子，安装在其上的输出端子和基板半导体元件以容器中的方格布置。此外，安装在基板，输入端子和输出端子上的半导体元件彼此电连接，以便在导电构件上获得环状电路，从而可以将电力转换装置并降低其电感。

3. 发明授权

US06618278B2 Electric power conversion/inversion apparatus 有权
公开(公告)号：US06618278B2
公开(公告)日：2003-09-09
申请号：US09810259
申请日：2001-03-19
申请人： Osamu Suzuki , Shinji Shirakawa , Akira Mishima , Toshiyuki Innami , Shinichi Fujino , Hideaki Mori , Kenji Takahashi , Keiichi Mashino , Hiromichi Anan
发明人： Osamu Suzuki , Shinji Shirakawa , Akira Mishima , Toshiyuki Innami , Shinichi Fujino , Hideaki Mori , Kenji Takahashi , Keiichi Mashino , Hiromichi Anan
IPC分类号： H01L2340
CPC分类号： H02M7/003 , H01L2224/32245 , H01L2224/33181 , H01L2924/13055 , H01L2924/13091 , H01L2924/00
摘要： In an electric power conversion/inversion apparatus, including, such as an inverter therein, for obtaining reduction in circuit inductance and wiring resistance therein by bringing small as a whole, having good installability and high reliability and efficiency of electric power conversion, as well, semiconductor chips 1 are disposed, being put between a positive input bus bar 14p and a negative input bus bar 14n and plural output bus bars 18 at crossing positions thereof, and are connected electrically and thermally, to the positive input bus bar 14p in a pole direction consistent therewith while to the negative input bus bar 14n in a pole direction consistent therewith, and further to the common output bus bars 18 in pole directions being different from side by side.

4. 发明授权

US06525950B1 Semiconductor device and electric power conversion device 失效
标题翻译：半导体装置及电力转换装置
公开(公告)号：US06525950B1
公开(公告)日：2003-02-25
申请号：US09653164
申请日：2000-09-01
申请人： Shinji Shirakawa , Hideshi Fukumoto , Akira Mishima , Keiichi Mashino , Toshiyuki Innami
发明人： Shinji Shirakawa , Hideshi Fukumoto , Akira Mishima , Keiichi Mashino , Toshiyuki Innami
IPC分类号： H02M100
CPC分类号： H02M7/003 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor power conversion device includes two bridge-connected semiconductor switches, an output terminal, and first and second pairs of positive and negative direct current terminals. First conductors connect the negative direct current terminals of the first and second pairs with the output terminal through one of the two bridge-connected semiconductor switches, while second conductors connect the positive direct current terminals of the first and second pairs with the other of the two bridge-connected semiconductor switches. A housing is provided, which includes the two bridge-connected semiconductor switches, and at least a portion of the first conductor and of the second conductor as a multilayer structure formed by sandwiching an insulator between the first and second conductors inside the housing. The first and second pairs of direct current terminals are arranged on one side of one plane of the housing.
摘要翻译：半导体功率转换装置包括两个桥接的半导体开关，输出端以及第一和第二对正和负直流端子。第一导体将第一和第二对的负直流端子与输出端子通过两个桥接的半导体开关中的一个连接，而第二导体将第一和第二对的正直流端子与两个桥接的半导体开关中的另一个连接桥接半导体开关。提供壳体，其包括两个桥连接的半导体开关，以及第一导体和第二导体的至少一部分，作为通过在壳体内的第一和第二导体之间夹住绝缘体而形成的多层结构。第一和第二对直流端子布置在壳体的一个平面的一侧上。

5. 发明授权

US06493249B2 Semiconductor apparatus, power converter and automobile 有权
标题翻译：半导体装置，电力转换器和汽车
公开(公告)号：US06493249B2
公开(公告)日：2002-12-10
申请号：US09791731
申请日：2001-02-26
申请人： Shinji Shirakawa , Akira Mishima , Hideshi Fukumoto , Keiichi Mashino , Toshiyuki Innami
发明人： Shinji Shirakawa , Akira Mishima , Hideshi Fukumoto , Keiichi Mashino , Toshiyuki Innami
IPC分类号： H02M100
CPC分类号： H02M7/003 , H01L2224/48091 , H01L2224/49111 , H01L2924/19107 , H01L2924/00014
摘要： A semiconductor apparatus includes positive and negative side conductors for bridge-connecting semiconductor switches, constituted to a wide conductor, and laminated by sandwiching an insulator between them. A semiconductor apparatus includes positive and negative side conductors extended from its case, and an electrolytic capacitor connected to the extension portion of the positive and negative side conductors. A power converter uses the semiconductor apparatus.
摘要翻译：半导体装置包括用于桥接半导体开关的正侧和负侧导体，构成为宽导体，并且通过在它们之间夹着绝缘体层叠。半导体装置包括从其壳体延伸的正极和负极侧导体，以及连接到正极和负极侧导体的延伸部分的电解电容器。功率转换器使用半导体装置。

6. 发明授权

US06791854B2 Semiconductor apparatus, power converter and automobile 有权
标题翻译：半导体装置，电力转换器和汽车
公开(公告)号：US06791854B2
公开(公告)日：2004-09-14
申请号：US10277139
申请日：2002-10-22
申请人： Shinji Shirakawa , Akira Mishima , Hideshi Fukumoto , Keiichi Mashino , Toshiyuki Innami
发明人： Shinji Shirakawa , Akira Mishima , Hideshi Fukumoto , Keiichi Mashino , Toshiyuki Innami
IPC分类号： H02M100
CPC分类号： H02M7/003 , H01L2224/48091 , H01L2224/49111 , H01L2924/19107 , H01L2924/00014
摘要： A semiconductor apparatus includes positive and negative side conductors for bridge-connecting semiconductor switches, constituted to a wide conductor, and laminated by sandwiching an insulator between them. A semiconductor apparatus includes positive and negative side conductors extended from its case, and an electrolytic capacitor connected to the extension portion of the positive and negative side conductors. A power converter uses the semiconductor apparatus.
摘要翻译：半导体装置包括用于桥接半导体开关的正侧和负侧导体，构成为宽导体，并且通过在它们之间夹着绝缘体层叠。半导体装置包括从其壳体延伸的正极和负极侧导体，以及连接到正极和负极侧导体的延伸部分的电解电容器。功率转换器使用半导体装置。

7. 发明申请

US20140337402A1 Analysis Computation Method, Analysis Computation Program and Recording Medium 审中-公开
标题翻译：分析计算方法，分析计算程序和记录介质
公开(公告)号：US20140337402A1
公开(公告)日：2014-11-13
申请号：US14357945
申请日：2011-11-14
申请人： Kazutami Tago , Nobuhiro Kusuno , Kiyomi Yoshinari , Akira Mishima
发明人： Kazutami Tago , Nobuhiro Kusuno , Kiyomi Yoshinari , Akira Mishima
IPC分类号： G06F17/15
CPC分类号： G06F17/153 , G06F17/5018 , G06F17/5036
摘要： A method for efficiently carrying out an analysis and computation using mesh structures is disclosed. When an insulator is brought into contact with two conductors, the mesh structures are generated and a displacement current is analyzed. In the generated structures, the insulator is considered a three-dimensional mesh structure and at least a portion of the conductor brought into contact with the insulator is considered a three-dimensional structure whereas the other portions are taken as a one- or two-dimensional structures. In an alternative, the insulator is considered a three-dimensional structure and at least a portion of the conductor brought into contact with the insulator is considered a three-dimensional structure whereas the other portions are considered three- to one-dimensional structures. In the conductor, a short-circuit section with no mesh elements is provided between at least a portion brought into contact with the insulator and the other portions.
摘要翻译：公开了一种使用网格结构有效地执行分析和计算的方法。当绝缘体与两个导体接触时，产生网状结构，分析位移电流。在所生成的结构中，绝缘体被认为是三维网格结构，并且与绝缘体接触的导体的至少一部分被认为是三维结构，而其它部分被认为是一维或二维结构。替代地，绝缘体被认为是三维结构，并且与绝缘体接触的导体的至少一部分被认为是三维结构，而其它部分被认为是三维结构。在导体中，在与绝缘体和其它部分接触的至少一部分之间设置没有网眼元件的短路部分。

8. 发明申请

US20110084359A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20110084359A1
公开(公告)日：2011-04-14
申请号：US12968534
申请日：2010-12-15
申请人： Kentaro OCHI , Akira Mishima , Takuro Kanazawa , Tetsuo Iijima , Katsuo Ishizaka , Norio Kido
发明人： Kentaro OCHI , Akira Mishima , Takuro Kanazawa , Tetsuo Iijima , Katsuo Ishizaka , Norio Kido
IPC分类号： H01L23/495
CPC分类号： H01L23/3107 , H01L23/49568 , H01L23/49575 , H01L24/33 , H01L25/115 , H01L2224/32245 , H01L2924/1301 , H01L2924/181 , H01L2924/19041 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device formed by using semiconductor packages is provided. The semiconductor device includes two semiconductor packages adjacently arranged in opposite directions on an inductive conductor. Terminals of the two semiconductor packages are joined by a third lead. the third lead is arranged substantially in parallel to the inductive conductor. Leads at the joint portions have, for example, a bent structure, and the third lead is arranged to be close to the inductive conductor.
摘要翻译：提供了通过使用半导体封装形成的半导体器件。半导体器件包括在感应导体上相邻布置的两个半导体封装。两个半导体封装的端子由第三引线连接。第三引线被布置成基本上平行于感应导体。接头部分处的引线例如具有弯曲结构，并且第三引线布置成靠近感应导体。

9. 发明授权

US07317626B2 Power converter 失效
标题翻译：电源转换器
公开(公告)号：US07317626B2
公开(公告)日：2008-01-08
申请号：US10894049
申请日：2004-07-20
申请人： Katsunori Azuma , Akira Mishima , Takashi Kaneko , Masaomi Konishide
发明人： Katsunori Azuma , Akira Mishima , Takashi Kaneko , Masaomi Konishide
IPC分类号： H02M1/00
CPC分类号： H02M7/003
摘要： A power converter of the present invention is connected between a direct current power source and controls power to a load by switching equipment. The converter is equipped with a first conductor for connecting a negative pole of the power converter and the switching equipment, and a second conductor for connecting a housing of the power converter and the negative pole of the power converter to the first conductor through a resistor.
摘要翻译：本发明的电力转换器连接在直流电源之间，并通过开关设备对负载进行电力控制。转换器配备有用于连接功率转换器的负极和开关设备的第一导体，以及用于通过电阻器将功率转换器的壳体和功率转换器的负极连接到第一导体的第二导体。

10. 发明授权

US5600680A High frequency receiving apparatus 失效
标题翻译：高频接收装置
公开(公告)号：US5600680A
公开(公告)日：1997-02-04
申请号：US525247
申请日：1995-09-08
申请人： Akira Mishima , Hiroshi Nagai , Akio Iwase
发明人： Akira Mishima , Hiroshi Nagai , Akio Iwase
IPC分类号： H03D1/22 , H03D7/16 , H03D9/00 , H03J7/08 , H04N7/10 , H04N21/426 , H03D5/00
CPC分类号： H03D1/2254 , H03J7/08 , H03D7/163
摘要： A high frequency television signal receiving apparatus providing excellent linear detection of output characteristics by improving the phase characteristic of the picture synchronous detector. A variable capacitive element is equivalently connected in parallel to a reference solid-state oscillation element. The reference solid-state oscillation element controls the frequency of a local oscillation device including a PLL circuit for feeding a local oscillation signal to a mixer for converting a high frequency signal into an intermediate frequency signal. A first low pass filter is connected between a phase comparator for detecting a phase difference of the intermediate frequency signal and the output of a detection oscillator for generating a detection oscillation signal with a specific phase difference. A second low pass filter having a larger time constant than the first low pass filter is connected to the variable capacitive element. The capacitance of the variable capacitive element is varied by the output voltage of the phase comparator. The signal frequency of the local oscillation device is shifted, and is controlled to converge the frequency of the intermediate frequency signal within the frequency range of the detection oscillation signal.
摘要翻译：一种高频电视信号接收装置，通过提高图像同步检波器的相位特性，提供优异的输出特性线性检测。可变电容元件与参考固态振荡元件并联连接。参考固态振荡元件控制包括用于将本地振荡信号馈送到用于将高频信号转换为中频信号的混频器的PLL电路的本地振荡器件的频率。第一低通滤波器连接在用于检测中频信号的相位差的相位比较器和用于产生具有特定相位差的检测振荡信号的检测振荡器的输出之间。具有比第一低通滤波器更大的时间常数的第二低通滤波器连接到可变电容元件。可变电容元件的电容由相位比较器的输出电压变化。本地振荡装置的信号频率偏移，并被控制以使中频信号的频率在检测振荡信号的频率范围内收敛。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式