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1. 发明授权

US07263769B2 Multi-layered flexible print circuit board and manufacturing method thereof 失效
标题翻译：多层柔性印刷电路板及其制造方法
公开(公告)号：US07263769B2
公开(公告)日：2007-09-04
申请号：US11252540
申请日：2005-10-19
申请人： Shinji Morimoto , Kouji Nakashima , Toyokazu Yoshino , Katsuya Okamoto
发明人： Shinji Morimoto , Kouji Nakashima , Toyokazu Yoshino , Katsuya Okamoto
IPC分类号： H01R3/10
CPC分类号： H05K3/4635 , H05K1/0393 , H05K3/386 , H05K3/4046 , H05K3/4084 , H05K3/4614 , H05K3/4617 , H05K3/462 , H05K3/4623 , H05K2201/0195 , H05K2201/0221 , H05K2201/0379 , H05K2201/043 , H05K2201/096 , H05K2201/10234 , H05K2201/10416 , H05K2203/0278 , H05K2203/041 , H05K2203/082 , Y10T29/49126 , Y10T29/49147 , Y10T29/49153 , Y10T29/49165
摘要： A multi-layered flexible print circuit board comprising an insulating layer, a circuit layer formed on the front and back surfaces of the insulating layer and a hole connecting between the circuit layers via the insulating layer, wherein there is provided an electrically-conductive member having a metal layer formed thereon at least on the surface thereof which is press-fitted into the hole to electrically conduct the circuit layer.
摘要翻译：一种多层柔性印刷电路板，包括绝缘层，形成在绝缘层的前表面和后表面上的电路层和经由绝缘层连接在电路层之间的孔，其中设置有导电构件，其具有至少在其表面上形成有金属层，该金属层压配合到孔中以导电电路层。

2. 发明授权

US07543376B2 Manufacturing method of flexible printed wiring board 失效
标题翻译：柔性印刷电路板的制造方法
公开(公告)号：US07543376B2
公开(公告)日：2009-06-09
申请号：US11622950
申请日：2007-01-12
申请人： Toyokazu Yoshino , Katsuya Okamoto , Shigeki Ogata , Shinji Morimoto , Kouji Nakashima
发明人： Toyokazu Yoshino , Katsuya Okamoto , Shigeki Ogata , Shinji Morimoto , Kouji Nakashima
IPC分类号： H01K3/10
CPC分类号： H05K3/4046 , H05K1/0393 , H05K3/386 , H05K3/4084 , H05K3/4614 , H05K3/4617 , H05K3/462 , H05K3/4623 , H05K3/4635 , H05K2201/0195 , H05K2201/0221 , H05K2201/0379 , H05K2201/043 , H05K2201/096 , H05K2201/10234 , H05K2201/10416 , H05K2203/0278 , H05K2203/041 , H05K2203/082 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T29/49213
摘要： Provided is an FPC, which comprises an insulating layer 2, wiring layers 3 and 4 laminated above and under the insulating layer 2, and a layer connection for connecting the wiring layers 3 and 4 electrically. The layer connection is constituted to comprise: a conductor press-fit hole 5 of a cone shape extending through the insulating layer 2 and the upper and lower wiring layers 3 and 4 and expanded to the side of one wiring layer 3; and a conductor 6 filled and press-fitted without any clearance in the conductor press-fit hole such that it is jointed to the wiring upper layer 3 deformed into the cone shape of the conductor press-fit hole 5, and is protruded from the other wiring lower layer 4 to have its surface partially coated and jointed. As a result, the contact area between the wiring layers 3 and 4 and the conductor 6 filled in the conductor press-fit hole 5 can be enlarged to retain the contact strength between the wiring layers 3 and 4 and the conductor 6 sufficiently thereby to provide a high connection reliability for the layer connection.
摘要翻译：提供一种FPC，其包括绝缘层2，层叠在绝缘层2上方和下方的布线层3和4以及用于电连接布线层3和4的层连接。层连接构成为包括：延伸穿过绝缘层2和上下布线层3和4的锥形导体压入孔5，并扩展到一个布线层3的侧面; 导体6在导体压配合孔内填充并压配合而没有任何间隙，使其接合到变形为导体压配合孔5的锥形的布线上层3，并从另一个突出布线下层4以使其表面部分涂覆和接合。结果，可以扩大布线层3和4与填充在导体压入孔5中的导体6之间的接触面积，以充分地保持布线层3和4与导体6之间的接触强度，从而提供层连接的高连接可靠性。

3. 发明申请

US20060102386A1 Multi-layered flexible print circuit board and manufacturing method thereof 失效
标题翻译：多层柔性印刷电路板及其制造方法
公开(公告)号：US20060102386A1
公开(公告)日：2006-05-18
申请号：US11252540
申请日：2005-10-19
申请人： Shinji Morimoto , Kouji Nakashima , Toyokazu Yoshino , Katsuya Okamoto
发明人： Shinji Morimoto , Kouji Nakashima , Toyokazu Yoshino , Katsuya Okamoto
IPC分类号： H05K1/16
CPC分类号： H05K3/4635 , H05K1/0393 , H05K3/386 , H05K3/4046 , H05K3/4084 , H05K3/4614 , H05K3/4617 , H05K3/462 , H05K3/4623 , H05K2201/0195 , H05K2201/0221 , H05K2201/0379 , H05K2201/043 , H05K2201/096 , H05K2201/10234 , H05K2201/10416 , H05K2203/0278 , H05K2203/041 , H05K2203/082 , Y10T29/49126 , Y10T29/49147 , Y10T29/49153 , Y10T29/49165
摘要： A multi-layered flexible print circuit board comprising an insulating layer, a circuit layer formed on the front and back surfaces of the insulating layer and a hole connecting between the circuit layers via the insulating layer, wherein there is provided an electrically-conductive member having a metal layer formed thereon at least on the surface thereof which is press-fitted into the hole to electrically conduct the circuit layer.
摘要翻译：一种多层柔性印刷电路板，包括绝缘层，形成在绝缘层的前表面和后表面上的电路层和经由绝缘层连接在电路层之间的孔，其中设置有导电构件，其具有至少在其表面上形成有金属层，该金属层压配合到孔中以导电电路层。

4. 发明授权

US07427717B2 Flexible printed wiring board and manufacturing method thereof 失效
标题翻译：柔性印刷电路板及其制造方法
公开(公告)号：US07427717B2
公开(公告)日：2008-09-23
申请号：US11131341
申请日：2005-05-18
申请人： Shinji Morimoto , Koji Nakashima , Toyokazu Yoshino , Katsuya Okamoto
发明人： Shinji Morimoto , Koji Nakashima , Toyokazu Yoshino , Katsuya Okamoto
IPC分类号： H05K1/00
CPC分类号： H05K3/363 , H05K3/281 , H05K3/3452 , H05K3/386 , H05K3/4038 , H05K2201/0215 , H05K2201/0305 , H05K2201/096 , H05K2201/0969 , H05K2201/09909 , H05K2203/0278 , H05K2203/058
摘要： A flexible printed wiring board has a configuration which is equipped with a solder resist portion formed by coating through the use of a screen printing method on a region including a component mounting portion of a conductor pattern, and a cover lay film pasted in such a manner that an outer circumference portion of an opening portion overlaps an upper portion of a circumference portion of the solder resist portion. A manufacturing method of a flexible printed wiring board of the invention has a configuration which is equipped with a conductor pattern forming process, a solder resist forming process, and a cover lay film pasting process.
摘要翻译：柔性印刷布线板具有这样的构造，该构造配备有通过使用丝网印刷法在包括导体图案的部件安装部分的区域上涂覆而形成的阻焊部分和以这种方式粘贴的覆盖膜开口部分的外周部分与阻焊部分的圆周部分的上部重叠。本发明的柔性印刷电路板的制造方法具有配置有导体图案形成工序，阻焊剂形成工序以及覆盖膜贴合工序的结构。

5. 发明申请

US20050257952A1 Flexible printed wiring board and manufacturing method thereof 失效
标题翻译：柔性印刷电路板及其制造方法
公开(公告)号：US20050257952A1
公开(公告)日：2005-11-24
申请号：US11131341
申请日：2005-05-18
申请人： Shinji Morimoto , Koji Nakashima , Toyokazu Yoshino , Katsuya Okamoto
发明人： Shinji Morimoto , Koji Nakashima , Toyokazu Yoshino , Katsuya Okamoto
IPC分类号： H05K1/03 , H05K3/28 , H05K3/34 , H05K3/36 , H05K3/38 , H05K3/40
CPC分类号： H05K3/363 , H05K3/281 , H05K3/3452 , H05K3/386 , H05K3/4038 , H05K2201/0215 , H05K2201/0305 , H05K2201/096 , H05K2201/0969 , H05K2201/09909 , H05K2203/0278 , H05K2203/058
摘要： A flexible printed wiring board has a configuration which is equipped with a solder resist portion formed by coating through the use of a screen printing method on a region including a component mounting portion of a conductor pattern, and a cover lay film pasted in such a manner that an outer circumference portion of an opening portion overlaps an upper portion of a circumference portion of the solder resist portion A manufacturing method of a flexible printed wiring board of the invention has a configuration which is equipped with a conductor pattern forming process, a solder resist forming process, and a cover lay film pasting process.
摘要翻译：柔性印刷布线板具有这样的构造，该构造配备有通过使用丝网印刷法在包括导体图案的部件安装部分的区域上涂覆而形成的阻焊部分和以这种方式粘贴的覆盖膜开口部分的外周部分与阻焊部分的周边部分的上部重叠。本发明的柔性印刷电路板的制造方法具有配置有导体图案形成工艺，阻焊剂成型工艺和覆盖薄膜粘贴工艺。

6. 发明申请

US20050011677A1 Multi-layer flexible printed circuit board, and method for fabricating it 失效
标题翻译：多层柔性印刷电路板及其制造方法
公开(公告)号：US20050011677A1
公开(公告)日：2005-01-20
申请号：US10891190
申请日：2004-07-15
申请人： Toyokazu Yoshino , Kouji Nakashima
发明人： Toyokazu Yoshino , Kouji Nakashima
IPC分类号： H05K3/40 , H05K3/46 , H05K1/11
CPC分类号： H05K3/4038 , H05K3/4046 , H05K3/4614 , H05K3/4623 , H05K2201/0215 , H05K2201/0305 , H05K2201/096 , H05K2201/10234 , Y10T29/49126 , Y10T29/49149 , Y10T29/49153
摘要： To provide an interlayer-connected, multi-layer flexible printed circuit board having high bonding reliability and most suitable for micropatterning the circuit layers in the device; and to provide a high-productivity method for fabricating the device. A multi-layer flexible printed circuit board, wherein a conductor is filled in the through-holes formed in the insulating layer in the direction of the thickness thereof so as to electrically interconnect the circuit layers formed on both faces of the insulating layer, and wherein the conductor contains inside it, a copper-core solder ball having a copper ball as a core thereof.
摘要翻译：提供层间连接的多层柔性印刷电路板，其具有高结合可靠性并且最适合于将装置中的电路层微图案化; 并且提供用于制造该器件的高生产率方法。一种多层柔性印刷电路板，其中导电体在其厚度方向上填充在形成在绝缘层中的通孔中，以使形成在绝缘层的两个面上的电路层电连接，并且其中导体内部含有以铜球为核心的铜芯焊球。

7. 发明授权

US07367116B2 Multi-layer printed circuit board, and method for fabricating the same 失效
标题翻译：多层印刷电路板及其制造方法
公开(公告)号：US07367116B2
公开(公告)日：2008-05-06
申请号：US10891190
申请日：2004-07-15
申请人： Toyokazu Yoshino , Kouji Nakashima
发明人： Toyokazu Yoshino , Kouji Nakashima
IPC分类号： H05K3/36 , H05K3/00 , H01R9/00
CPC分类号： H05K3/4038 , H05K3/4046 , H05K3/4614 , H05K3/4623 , H05K2201/0215 , H05K2201/0305 , H05K2201/096 , H05K2201/10234 , Y10T29/49126 , Y10T29/49149 , Y10T29/49153
摘要： To provide an interlayer-connected, multi-layer flexible printed circuit board having high bonding reliability and most suitable for micropatterning the circuit layers in the device; and to provide a high-productivity method for fabricating the device.A multi-layer flexible printed circuit board, wherein a conductor is filled in the through-holes formed in the insulating layer in the direction of the thickness thereof so as to electrically interconnect the circuit layers formed on both faces of the insulating layer, and wherein the conductor contains inside it, a copper-core solder ball having a copper ball as a core thereof.
摘要翻译：提供层间连接的多层柔性印刷电路板，其具有高结合可靠性并且最适合于将装置中的电路层微图案化; 并且提供用于制造该器件的高生产率方法。一种多层柔性印刷电路板，其中导电体在其厚度方向上填充在形成在绝缘层中的通孔中，以使形成在绝缘层的两个面上的电路层电连接，并且其中导体内部含有以铜球为核心的铜芯焊球。

8. 发明授权

US06383720B1 Method of manufacturing fine pattern and printed circuit board manufactured with this method 失效
标题翻译：使用该方法制造精细图案和印刷电路板的方法
公开(公告)号：US06383720B1
公开(公告)日：2002-05-07
申请号：US09376357
申请日：1999-08-18
申请人： Koji Nakashima , Toyokazu Yoshino , Shinobu Kamizuru
发明人： Koji Nakashima , Toyokazu Yoshino , Shinobu Kamizuru
IPC分类号： C25D906
CPC分类号： H05K3/205
摘要： A method of manufacturing fine pattern of the invention comprises (a) a step of manufacturing a master substrate having a film of precious metal or an alloy thereof formed as an insoluble electrode on the electrode, (b) a step of forming a fine pattern film on the insoluble electrode with anion type electro-deposition, and (c) a step of exfoliating and transferring the fine pattern film onto another substrate. Another method of manufacturing fine pattern further includes a step of manufacturing a master substrate, of which a surface is provided with at least a repeatedly reproducible sacrificial electrode. Still another method of manufacturing fine pattern includes a step of forming a pattern electrode on a conductive substrate by electro-forming, and transferring the electrode onto another substrate. Yet another method of manufacturing fine pattern includes a structure wherein a transparent section is provided in a portion of a master substrate in order to facilitate a positional alignment. The invention provides reliable and accurate mass production of fine-line and high-density films of fine pattern having good transfer ability and durability at low cost. A fine-line and high-density printed circuit board can be made at low cost with the methods of manufacturing fine pattern as disclosed above.
摘要翻译：制造本发明的精细图案的方法包括（a）制造具有在电极上形成为不溶性电极的贵金属或其合金膜的母基板的工序，（b）形成精细图案膜的工序在具有阴离子型电沉积的不溶性电极上，和（c）将精细图案膜剥离并转印到另一个基底上的步骤。制造精细图案的另一种方法还包括制造母基板的步骤，其中表面设置有至少一个可重复再现的牺牲电极。制造精细图案的另一种方法包括通过电成型在导电衬底上形成图案电极并将电极转移到另一衬底上的步骤。制造精细图案的另一种方法包括其中在主基板的一部分中设置透明部分以便于进行位置对准的结构。本发明提供了以低成本具有良好的转印能力和耐久性的精细图案的细线和高密度薄膜的可靠和准确的批量生产。通过上述制造精细图案的方法，可以以低成本制造细线和高密度印刷电路板。

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