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    • 1. 发明授权
    • Complementary semiconductor device having improved device isolating
region
    • 具有改进的器件隔离区域的补充半导体器件
    • US5097310A
    • 1992-03-17
    • US409379
    • 1989-09-19
    • Takahisa EimoriWataru WakamiyaHiroji OzakiYoshinori TanakaShinichi Satoh
    • Takahisa EimoriWataru WakamiyaHiroji OzakiYoshinori TanakaShinichi Satoh
    • H01L21/761H01L21/76H01L27/08H01L27/092H01L29/78
    • H01L27/0928
    • A complementary semiconductor device having an improved capability of isolating devices comprises a P well 3 and an N well 2 both formed adjacent to each other on a main surface of a substrate 1, an N type impurity layer formed in the P well 8 on the main surface of the substrate, a P type impurity layer formed in the N well 9 on the main surface of the substrate, an N type region formed at the junction of the N well and the P well 71 on the main surface of the substrate, a first shield electrode 52 formed between the N type impurity layer 8 and the N type region 71 on the main surface of the substrate through an insulating film and a second shield electrode 51 formed between the N type region 71 and the P type impurity layer 9 on the main surface of the substrate through an insulating film. The first shield electrode 52 is connected to a potential V.sub.SS and the second shield electrode 51 and the N type region 71 are connected to a potential V.sub.CC, so that an N channel MOS transistor 101 comprising the first shield electrode 52 does not turn on and a device comprising the second shield electrode does not form a field effect transistor.
    • 具有改进的隔离装置能力的互补半导体器件包括在衬底1的主表面上彼此相邻形成的P阱3和N阱2,形成在主衬底1上的P阱8中的N型杂质层 在基板的主表面上形成在N阱9中的P型杂质层,形成在基板主表面上的N阱和P阱71的接合部的N型区域, 第一屏蔽电极52,其通过绝缘膜形成在基板的主表面上的N型杂质层8和N型区域71之间,形成在N型区域71和P型杂质层9之间的第二屏蔽电极51, 基板的主表面通过绝缘膜。 第一屏蔽电极52连接到电位VSS,第二屏蔽电极51和N型区域71连接到电位VCC,使得包括第一屏蔽电极52的N沟道MOS晶体管101不导通, 包括第二屏蔽电极的装置不形成场效应晶体管。
    • 2. 发明授权
    • Field effect transistor with a shaped gate electrode
    • 具有形状栅电极的场效应晶体管
    • US5543646A
    • 1996-08-06
    • US787912
    • 1991-11-05
    • Shinichi SatohHiroji OzakiTakahisa Eimori
    • Shinichi SatohHiroji OzakiTakahisa Eimori
    • H01L21/28H01L21/336H01L29/423H01L29/43H01L29/78
    • H01L29/66598H01L21/28061H01L21/28114H01L29/42376H01L29/6659
    • A field effect transistor comprises a semiconductor substrate having a main surface and a predetermined impurity concentration of a first conductivity type, impurity layers of a second conductivity type formed spaced apart at the main surface of the semiconductor substrate, and a shaped conductive layer serving as a gate electrode. The impurity layers constitute source.multidot.drain regions, and a region between the impurity layers defines a channel region in the main surface. The shaped conductive layer is formed on the channel region with an insulating film therebetween. The shaped conductive layer has an upper portion and a lower portion wherein the upper portion is longer than the lower portion and the length of the lower portion adjacent the insulating film is substantially equal to or shorter than the length of the channel region at the main surface. Additionally, the upper and lower portions of the shaped conductive layer are formed of the same base composition.
    • 场效应晶体管包括具有第一导电类型的主表面和预定杂质浓度的半导体衬底,在半导体衬底的主表面上间隔开形成的第二导电类型的杂质层和用作 栅电极。 杂质层构成源极区域,杂质层之间的区域限定了主表面中的沟道区域。 成形导电层在沟道区域之间形成有绝缘膜。 成形导电层具有上部和下部,其中上部比下部长,并且与绝缘膜相邻的下部的长度基本上等于或短于主表面处的沟道区的长度 。 此外,成形导电层的上部和下部由相同的基底组成形成。
    • 5. 发明授权
    • Method for forming MOS device having field shield isolation
    • 用于形成具有场屏蔽隔离的MOS器件的方法
    • US5930614A
    • 1999-07-27
    • US765771
    • 1991-09-26
    • Takahisa EimoriShinichi SatohWataru WakamiyaHiroji OzakiYoshinori Tanaka
    • Takahisa EimoriShinichi SatohWataru WakamiyaHiroji OzakiYoshinori Tanaka
    • H01L21/76H01L21/765H01L29/78H01L21/8238
    • H01L21/765
    • A first conductor for a field shield and a first insulating film are sequentially formed in a predetermined shape on a major surface of a P-type semiconductor substrate through an insulating film. A third insulating film is formed over the semiconductor substrate so as to cover the first conductor and a second insulating film thereon. The third insulating film is anisotropically etched, so that a sidewall insulating film is formed on sidewalls of the first conductor. Second and third conductors respectively serving as gate electrodes of field effect transistors are formed through a fourth insulating film. n-type impurities are implanted into the major surface of the semiconductor substrate utilizing as masks the first insulating film, the sidewall oxide film, the second conductor and the third conductor and are diffused, to form impurity regions. Since the sidewall oxide film is thick, the impurity regions are not overlapped even by diffusion with a portion where the first conductor is projected on the semiconductor substrate. Thus, a threshold voltage of a field shield transistor comprising the first conductor and the impurity regions on both sides thereof is raised, so that isolation characteristics of the field shield is improved.
    • 用于场屏蔽和第一绝缘膜的第一导体通过绝缘膜在P型半导体衬底的主表面上依次形成为预定形状。 在半导体衬底上形成第三绝缘膜,以覆盖第一导体和第二绝缘膜。 第三绝缘膜被各向异性地蚀刻,从而在第一导体的侧壁上形成侧壁绝缘膜。 分别用作场效晶体管的栅极的第二和第三导体通过第四绝缘膜形成。 利用第一绝缘膜,侧壁氧化物膜,第二导体和第三导体作为掩模将n型杂质注入到半导体衬底的主表面中,并扩散,形成杂质区。 由于侧壁氧化物膜厚,因此即使通过第一导体投射在半导体基板上的部分的扩散也不会使杂质区域重叠。 因此,包括第一导体和其两侧的杂质区域的场屏蔽晶体管的阈值电压升高,从而提高了场屏蔽的隔离特性。
    • 6. 发明授权
    • Method of making a field effect transistor with a T shaped polysilicon
gate electrode
    • 制造具有T形多晶硅栅电极的场效应晶体管的方法
    • US5650342A
    • 1997-07-22
    • US968941
    • 1992-10-30
    • Shinichi SatohHiroji OzakiTakahisa Eimori
    • Shinichi SatohHiroji OzakiTakahisa Eimori
    • H01L21/28H01L21/336H01L29/423H01L21/8234
    • H01L29/66598H01L21/28061H01L21/28114H01L29/42376H01L29/6659
    • A field effect transistor comprises a semiconductor substrate having a main surface and a predetermined impurity concentration of a first conductivity type, impurity layers of a second conductivity type formed spaced apart at the main surface of the semiconductor substrate, and a shaped conductive layer serving as a gate electrode. The impurity layers constitute source.drain regions, and a region between the impurity layers defines a channel region in the main surface. The shaped conductive layer is formed on the channel region with an insulating film therebetween. The shaped conductive layer has an upper portion and a lower portion wherein the upper portion is longer than the lower portion and the length of the lower portion adjacent the insulating film is substantially equal to or shorter than the length of the channel region at the main surface. Additionally, the upper and lower portions of the shaped conductive layer are formed of the same base composition.
    • 场效应晶体管包括具有第一导电类型的主表面和预定杂质浓度的半导体衬底,在半导体衬底的主表面上间隔开形成的第二导电类型的杂质层和用作 栅电极。 杂质层构成源极区域,并且杂质层之间的区域限定主表面中的沟道区域。 成形导电层在沟道区域之间形成有绝缘膜。 成形导电层具有上部和下部,其中上部比下部长,并且与绝缘膜相邻的下部的长度基本上等于或短于主表面处的沟道区的长度 。 此外,成形导电层的上部和下部由相同的基底组成形成。
    • 10. 发明授权
    • Field effect transistor substantially coplanar surface structure
    • 场效应晶体管基本上共面的表面结构
    • US4994893A
    • 1991-02-19
    • US405284
    • 1989-09-11
    • Hiroji OzakiTakahisa EimoriYoshinori TanakaWataru WakamiyaShinichi Satoh
    • Hiroji OzakiTakahisa EimoriYoshinori TanakaWataru WakamiyaShinichi Satoh
    • H01L21/3205H01L21/8242H01L27/10H01L27/108H01L29/417
    • H01L29/41775H01L27/10808
    • A semiconductor device has MOS field effect transistors isolated by a field shield. The field shield has a gate of conductor layers formed spaced apart from each other on a silicon substrate through an insulating film and with the surface thereof being covered with an insulating film. In regions isolated by the field shield, MOS field effect transistors are formed. Each of the MOS field effect transistors has a gate electrode of a conductor layer formed on the silicon substrate through an insulating film and with the surface thereof being covered with an insulating film. An impurity diffused region is formed in a region on the silicon substrate between the gate electrode and the field shield. A portion on an exposed surface of the impurity diffused region between the field shield and the gate electrode is selectively filled with a tungsten buried layer. The tungsten buried layer is formed, flattened relative to the gate electrode and the gate constituting the field shield.
    • 半导体器件具有通过场屏蔽隔离的MOS场效应晶体管。 场屏蔽具有通过绝缘膜在硅衬底上彼此隔开形成的导体层的栅极,并且其表面被绝缘膜覆盖。 在通过场屏蔽隔离的区域中,形成MOS场效应晶体管。 每个MOS场效应晶体管具有通过绝缘膜形成在硅衬底上并且其表面被绝缘膜覆盖的导体层的栅电极。 在栅电极和场屏蔽之间的硅衬底上的区域中形成杂质扩散区域。 在场屏蔽和栅电极之间的杂质扩散区域的暴露表面上的一部分选择性地填充有钨掩埋层。 形成钨掩埋层,相对于构成场屏蔽体的栅电极和栅极变平。