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    • 2. 发明授权
    • Linear-reciprocating device
    • 线性往复式装置
    • US09074624B2
    • 2015-07-07
    • US14365291
    • 2012-07-13
    • Katsuyuki HorieShinichi Saito
    • Katsuyuki HorieShinichi Saito
    • F16C29/06F16C29/00F16C29/02F16C29/04
    • F16C29/06F16C29/007F16C29/008F16C29/02F16C29/043F16C29/045F16C29/0602F16C29/0685
    • A linear-reciprocating device 10 has a moving block 13 which is attached to a guide rail 12 provided to a support base 11 so as to freely reciprocate, ball rolling grooves 23a and 23b which form ball rolling paths 24a and 24b together with ball rolling grooves 21a and 21b are provided to a base end of the moving block 13, and ball circulation holes 25a and 25b which are communicated to the ball rolling paths 24a and 24b are provided to a base end. In a longitudinal-directional middle area of the moving block 13, return blocks 32a and 32b which communicate between the ball rolling paths 24a and 24b and the ball circulation holes 25a and 25b are provided. The moving block 13 moves to a position at which the moving block 13 is moved to a position at which the moving block is protruded from a distal end of the guide rail 12.
    • 线性往复运动装置10具有移动块13,该移动块13附接到设置在支撑基座11上以便自由往复运动的导轨12,与滚珠滚动槽一起形成滚珠滚动路径24a和24b的滚珠滚动槽23a和23b 21a和21b设置在移动块13的基端,并且连通到滚珠滚动路径24a和24b的滚珠循环孔25a和25b设置在基端。 在移动块13的纵向中间区域中,设置有滚珠滚动路径24a和24b与滚珠循环孔25a和25b连通的返回块32a和32b。 移动块13移动到移动块13移动到从导轨12的远端突出移动块的位置的位置。
    • 7. 发明授权
    • Semiconductor device
    • 半导体器件
    • US08089067B2
    • 2012-01-03
    • US12318452
    • 2008-12-30
    • Shinichi SaitoHiroyuki UchiyamaToshiyuki Mine
    • Shinichi SaitoHiroyuki UchiyamaToshiyuki Mine
    • H01L33/00
    • H01L27/156H01L33/16H01L33/34
    • A self emission silicon emission display is provided at a low price, which contains silicon and oxygen which exist in abundance on the earth as the main component and which can be easily formed by conventional silicon process. A light emission element includes a first electrode for injecting electrons, a second electrode for injecting holes, and a light emission part electrically connected to the first electrode and the second electrode, where the light emission part includes amorphous or polycrystalline silicon consisting of a single layer or plural layers and where the dimension of the silicon in at least one direction is controlled to be several nanometers.
    • 以低价格提供自发射硅发射显示器,其包含以地球上丰富地存在的硅和氧作为主要成分,并且可以通过常规硅工艺容易地形成。 发光元件包括用于注入电子的第一电极,用于注入空穴的第二电极和与第一电极和第二电极电连接的发光部分,其中发光部分包括由单层组成的非晶或多晶硅 或多个层,并且其中至少一个方向上的硅的尺寸被控制为几纳米。
    • 8. 发明授权
    • Semiconductor LED, opto-electronic integrated circuits (OEIC), and method of fabricating OEIC
    • 半导体LED,光电集成电路(OEIC)以及制造OEIC的方法
    • US08030668B2
    • 2011-10-04
    • US11935904
    • 2007-11-06
    • Digh HisamotoShinichi SaitoShinichiro Kimura
    • Digh HisamotoShinichi SaitoShinichiro Kimura
    • H01L27/15
    • H01L27/15G02B6/13G02B6/43H01L33/02H01L33/34
    • A light emitting diode demonstrating high luminescence efficiency and comprising a Group IV semiconductor such as silicon or germanium equivalent thereto as a basic component formed on a silicon substrate by a prior art silicon process, and a fabricating method of waveguide thereof are provided. The light emitting diode of the invention comprises a first electrode for implanting electrons, a second electrode for implanting holes, and a light emitting section electrically connected to the first and the second electrode, wherein the light emitting section is made out of single crystalline silicon and has a first surface and a second surface facing the first surface, wherein with respect to plane orientation (100) of the first and second surfaces, the light emitting section crossing at right angles to the first and second surfaces is made thinner, and wherein a material having a high refractive index is arranged around the thin film section.
    • 提供了高发光效率的发光二极管,并且包括通过现有技术的硅工艺在硅衬底上形成的等价于其的硅或锗等IV族半导体作为基底部件,以及其波导管的制造方法。 本发明的发光二极管包括用于注入电子的第一电极,用于注入孔的第二电极和与第一和第二电极电连接的发光部分,其中发光部分由单晶硅制成, 具有面向第一表面的第一表面和第二表面,其中相对于第一表面和第二表面的平面取向(100),使与第一表面和第二表面成直角交叉的发光部分变薄,并且其中 具有高折射率的材料设置在薄膜部分周围。
    • 9. 发明申请
    • PARALELL-SERIAL CONVERSION CIRCUIT, AND ELECTRONIC DEVICE USING THE CIRCUIT
    • PARALELL串行转换电路和使用电路的电子设备
    • US20100149137A1
    • 2010-06-17
    • US12088143
    • 2006-09-14
    • Shinichi Saito
    • Shinichi Saito
    • G09G3/36H03M9/00
    • H03M9/00H03K3/0315H03K5/135H03L7/0995H03L7/18
    • A parallel-serial conversion circuit in which clock frequency and data width can be flexibly configured. The parallel-serial conversion circuit converts m×n bit parallel data (m and n being natural numbers), of clock frequency f, into 1-bit serial data of clock frequency f×m×n. The first converter converts m×n bit parallel data into m-bit parallel data (Dp) of clock frequency f×n. A second converter converts the m-bit parallel data (Dp) of clock frequency f×n, outputted from the first converter, into 1-bit serial data (bout) of clock frequency f×n×m. A clock signal generation circuit respectively supplies a clock signal (CK1), of frequency f×n, to the first converter, and a clock signal (CK2), of frequency f×m×n, to the second converter.
    • 并行串行转换电路,其中可以灵活地配置时钟频率和数据宽度。 并行串行转换电路将时钟频率f的m×n位并行数据(m和n为自然数)转换为时钟频率f×m×n的1位串行数据。 第一个转换器将m×n位并行数据转换为时钟频率f×n的m位并行数据(Dp)。 第二转换器将从第一转换器输出的时钟频率f×n的m位并行数据(Dp)转换为时钟频率f×n×m的1位串行数据(回合)。 时钟信号发生电路分别向第一转换器提供频率为f×n的时钟信号(CK1)和频率为f×m×n的时钟信号(CK2)给第二转换器。
    • 10. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • US20090090925A1
    • 2009-04-09
    • US12245077
    • 2008-10-03
    • Shinichi SaitoMasahiro AokiHiroyuki UchiyamaHideo ArimotoNoriyuki SakumaJiro Yamamoto
    • Shinichi SaitoMasahiro AokiHiroyuki UchiyamaHideo ArimotoNoriyuki SakumaJiro Yamamoto
    • H01L33/00
    • H01S5/12B82Y20/00H01S5/0424H01S5/0425H01S5/1237H01S5/125H01S5/18341H01S5/3004H01S5/3427H01S2301/176H01S2302/00
    • There are a silicon laser device having a IV-group semiconductor such as silicon or germanium equivalent to the silicon as a basic constituent element on a substrate made of the silicon, and the like by a method capable of easily forming the silicon laser device by using a general silicon process, and a manufacturing method thereof. The silicon laser device is an ultrathin silicon laser that includes a first electrode unit injecting electrons, a second electrode unit injecting holes, a light emitting unit electrically connected to the first electrode unit and the second electrode unit, wherein the light emitting unit is made of single-crystal silicon and has a first surface (top surface) and a second surface (bottom surface) opposed to the first surface, a waveguide made of a first dielectric, which is disposed in the vicinity of the light emitting unit, by setting surface directions of the first and second surfaces as a surface (100) and thinning a thickness of the light emitting unit in a direction perpendicular to the first and second surfaces, and a mirror formed by alternately adjoining the first dielectric and a second dielectric.
    • 存在具有诸如硅等离子体的硅组合半导体的硅激光器装置,其等同于由硅制成的衬底上作为基本构成元件的硅等,通过使用能够容易地形成硅激光器件的方法, 通用硅工艺及其制造方法。 硅激光器件是一种超薄硅激光器,其包括注入电子的第一电极单元,注入空穴的第二电极单元,与第一电极单元和第二电极单元电连接的发光单元,其中发光单元由 单晶硅,并且具有与第一表面相对的第一表面(顶表面)和第二表面(底表面),通过设置在发光单元附近的由第一电介质制成的波导 第一表面和第二表面的方向作为表面(100),并且在垂直于第一和第二表面的方向上减薄发光单元的厚度,以及通过交替地邻接第一电介质和第二电介质而形成的反射镜。