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    • 2. 发明申请
    • INKJET HEAD
    • US20090284571A1
    • 2009-11-19
    • US12436932
    • 2009-05-07
    • Shinichi KAWAGUCHIHideo Watanabe
    • Shinichi KAWAGUCHIHideo Watanabe
    • B41J2/045
    • B41J2/14209B41J2/1609B41J2/1623B41J2/1628B41J2/1631B41J2/1632B41J2/1634B41J2/1642B41J2/1646B41J2002/14491
    • On the back surface of a head chip having a plurality of rows of channels (row A, row B), the connection electrodes for row A that are electrically connected to the drive electrodes of the channels of row A are arranged, a first connection electrodes for row B that are electrically connected to the drive electrodes of the channels of row B are arranged between the rows of channels of row A and the rows of channels of row B, and also, between neighboring connection electrodes for row A, a second connection electrodes for row B are separately placed from the first connection electrodes for row B, the first connection electrodes and the second connection electrodes are connected electrically by drawing out interconnections, and the drawing out interconnections are in contact only with the first connection electrodes, the second connection electrodes, and the back surface of the head chip.
    • 在具有多行通道(行A,行B)的头芯片的背面设置有与行A的通道的驱动电极电连接的行A的连接电极,第一连接电极 对于与行B的通道的驱动电极电连接的行B布置在行A的通道行和行B的通道行之间,并且还布置在用于行A的相邻连接电极之间,第二连接 行B的电极与行B的第一连接电极分开放置,第一连接电极和第二连接电极通过拔出互连而电连接,并且拔出互连仅与第一连接电极接触,第二连接电极 连接电极和头芯片的背面。