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1. 发明授权

US09181464B2 Adhesive resin compositions, and laminates and flexible printed wiring boards using same 有权
标题翻译：粘合树脂组合物，以及使用其的层压材料和柔性印刷线路板
公开(公告)号：US09181464B2
公开(公告)日：2015-11-10
申请号：US13203216
申请日：2010-01-18
申请人： Shingo Kaimori , Jun Sugawara , Akira Mizoguchi , Syougo Asai , Takuma Yoshisaka , Naota Uenishi
发明人： Shingo Kaimori , Jun Sugawara , Akira Mizoguchi , Syougo Asai , Takuma Yoshisaka , Naota Uenishi
IPC分类号： B32B3/10 , B32B7/12 , C09J7/02 , C09J167/02 , C09J163/04 , C09J171/10 , C09J163/02 , C09J177/00 , C09J161/14 , C09J167/00 , C08G59/30 , C08G59/32 , C09J163/00 , C09J171/00 , H05K3/38 , C08K5/3437 , C08L67/00 , C08L77/00 , C08L79/04 , H05K1/03
CPC分类号： C09J167/00 , C08G59/304 , C08G59/3272 , C08G2650/56 , C08K5/3437 , C08L67/00 , C08L77/00 , C08L79/04 , C08L2666/14 , C09J7/22 , C09J7/35 , C09J163/00 , C09J171/00 , C09J2203/326 , C09J2205/102 , C09J2461/00 , C09J2463/00 , C09J2467/00 , C09J2477/00 , H01L2924/00013 , H05K1/0393 , H05K3/386 , H05K2201/012 , H05K2201/0145 , Y10T428/24802 , Y10T428/287 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599
摘要： Provided are an adhesive resin composition that is halogen-free, has good adhesiveness, solder heat resistance, and flame retardancy, and has good flow characteristics, and a laminate and a flexible printed wiring board using the same. The adhesive resin composition contains a phosphorus-containing epoxy resin and/or a phosphorus-containing phenoxy resin, a phosphorus-containing polyester resin having a weight-average molecular weight of more than 20,000 and 150,000 or less, another thermoplastic resin, and a curing agent. The adhesive resin composition preferably further contains a benzoxazine compound. Preferably, substantially no inorganic filler is mixed in the adhesive resin composition.
摘要翻译：本发明提供无卤素，粘合性，焊料耐热性，阻燃性，流动特性良好的粘合性树脂组合物，以及使用该树脂组合物的层叠体和柔性印刷线路板。粘合剂树脂组合物含有含磷环氧树脂和/或含磷苯氧树脂，重均分子量大于20,000和150,000以下的含磷聚酯树脂，另一种热塑性树脂和固化代理商粘合性树脂组合物优选还含有苯并恶嗪化合物。优选地，在粘合剂树脂组合物中基本上不混合无机填料。

2. 发明申请

US20110305883A1 ADHESIVE RESIN COMPOSITIONS, AND LAMINATES AND FLEXIBLE PRINTED WIRING BOARDS USING SAME 有权
标题翻译：粘合树脂组合物，以及使用其的层压板和柔性印刷线
公开(公告)号：US20110305883A1
公开(公告)日：2011-12-15
申请号：US13203216
申请日：2010-01-18
申请人： Shingo Kaimori , Jun Sugawara , Akira Mizoguchi , Syougo Asai , Takuma Yoshisaka , Naota Uenishi
发明人： Shingo Kaimori , Jun Sugawara , Akira Mizoguchi , Syougo Asai , Takuma Yoshisaka , Naota Uenishi
IPC分类号： B32B3/10 , C09J7/02 , C09J167/02 , C09J163/04 , C09J171/10 , C09J163/02 , C09J177/00 , B32B7/12 , C09J161/14
CPC分类号： C09J167/00 , C08G59/304 , C08G59/3272 , C08G2650/56 , C08K5/3437 , C08L67/00 , C08L77/00 , C08L79/04 , C08L2666/14 , C09J7/22 , C09J7/35 , C09J163/00 , C09J171/00 , C09J2203/326 , C09J2205/102 , C09J2461/00 , C09J2463/00 , C09J2467/00 , C09J2477/00 , H01L2924/00013 , H05K1/0393 , H05K3/386 , H05K2201/012 , H05K2201/0145 , Y10T428/24802 , Y10T428/287 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599
摘要： Provided are an adhesive resin composition that is halogen-free, has good adhesiveness, solder heat resistance, and flame retardancy, and has good flow characteristics, and a laminate and a flexible printed wiring board using the same. The adhesive resin composition contains a phosphorus-containing epoxy resin and/or a phosphorus-containing phenoxy resin, a phosphorus-containing polyester resin having a weight-average molecular weight of more than 20,000 and 150,000 or less, another thermoplastic resin, and a curing agent. The adhesive resin composition preferably further contains a benzoxazine compound. Preferably, substantially no inorganic filler is mixed in the adhesive resin composition.
摘要翻译：本发明提供无卤素，粘合性，焊料耐热性，阻燃性，流动特性良好的粘合性树脂组合物，以及使用该树脂组合物的层叠体和柔性印刷线路板。粘合剂树脂组合物含有含磷环氧树脂和/或含磷苯氧树脂，重均分子量大于20,000和150,000以下的含磷聚酯树脂，另一种热塑性树脂和固化代理商粘合性树脂组合物优选还含有苯并恶嗪化合物。优选地，在粘合剂树脂组合物中基本上不混合无机填料。

3. 发明申请

US20120048598A1 ADHESIVE RESIN COMPOSITION, AND LAMINATE AND FLEXIBLE PRINTED WIRING BOARD USING THE SAME 审中-公开
标题翻译：粘合树脂组合物和使用它的层压板和柔性印刷线路板
公开(公告)号：US20120048598A1
公开(公告)日：2012-03-01
申请号：US13318304
申请日：2010-03-26
申请人： Shingo Kaimori , Jun Sugawara , Akira Mizoguchi , Syougo Asai , Takuma Yoshisaka , Naota Uenishi
发明人： Shingo Kaimori , Jun Sugawara , Akira Mizoguchi , Syougo Asai , Takuma Yoshisaka , Naota Uenishi
IPC分类号： H05K1/00 , C09J133/14 , C09J171/10 , C09J11/02 , B32B27/38 , C09J163/00
CPC分类号： H05K3/386 , C08G2650/56 , C08L33/068 , C08L63/00 , C08L71/00 , C08L2666/02 , C08L2666/04 , C09J7/35 , C09J163/00 , C09J171/00 , C09J171/02 , C09J2203/326 , C09J2463/00 , C09J2471/00 , C09J2477/00 , H05K1/0393 , Y10T428/287
摘要： Provided is an adhesive resin composition containing an epoxy resin and/or a phenoxy resin; an epoxy-containing copolymer obtained by copolymerizing a monomer having an epoxy group and an ethylenically unsaturated monomer that is copolymerizable with the monomer having an epoxy group; a thermoplastic resin; and a curing agent, wherein a copolymer having a weight-average molecular weight of 5,000 to less than 100,000 and a weight per epoxy equivalent of 3,500 g/eq or less is used as the epoxy-containing copolymer. The adhesive resin composition is capable of providing a one-part type adhesive solution that has a good compatibility of the polymer components, that has good flame retardancy and is halogen-free, and that has good storage stability. Also provided are a laminate and a flexible printed wiring board that use the adhesive resin composition.
摘要翻译：提供含有环氧树脂和/或苯氧基树脂的粘合性树脂组合物; 通过使具有环氧基的单体和可与具有环氧基的单体共聚的烯键式不饱和单体共聚得到的含环氧基共聚物; 热塑性树脂; 和固化剂，其中使用重均分子量为5,000至小于100,000且每环氧当量重量为3,500g / eq或更低的共聚物作为含环氧基的共聚物。粘合性树脂组合物能够提供具有良好的聚合物成分的相容性，阻燃性好，为无卤素，且具有良好的储存稳定性的一部分型粘合剂溶液。还提供了使用粘合剂树脂组合物的层压体和柔性印刷线路板。

4. 发明申请

US20110303439A1 ADHESIVE RESIN COMPOSITIONS, AND LAMINATES AND FLEXIBLE PRINTED WIRING BOARDS USING SAME 审中-公开
标题翻译：粘合树脂组合物，以及使用其的层压板和柔性印刷线
公开(公告)号：US20110303439A1
公开(公告)日：2011-12-15
申请号：US13203209
申请日：2010-01-18
申请人： Shingo Kaimori , Jun Sugawara , Akira Mizoguchi , Syougo Asai , Takuma Yoshisaka , Naota Uenishi
发明人： Shingo Kaimori , Jun Sugawara , Akira Mizoguchi , Syougo Asai , Takuma Yoshisaka , Naota Uenishi
IPC分类号： H05K1/02 , C09J163/02 , C09J11/06 , C09J167/00 , C09J177/00 , B32B7/12 , C09J185/02
CPC分类号： C09J177/00 , C08G59/304 , C08G59/3272 , C08K5/0066 , C08K5/3437 , C08K5/353 , C08K5/5399 , C08L63/00 , C08L67/00 , C08L77/00 , C08L2666/22 , C09J7/35 , C09J163/00 , C09J167/00 , C09J2203/326 , C09J2205/102 , C09J2463/00 , C09J2477/00 , H05K1/0393 , H05K3/386 , H05K2201/012 , H05K2201/0129 , Y10T428/287
摘要： Provided are an adhesive composition that is halogen-free and that can satisfy flame retardancy without impairing adhesiveness or solder heat resistance, and a laminate and a flexible printed wiring board using the same. The adhesive resin composition contains an epoxy resin; a thermoplastic resin; a benzoxazine compound; a halogen-free flame retardant; and a curing agent, in which at least one of the epoxy resin and the thermoplastic resin contains a phosphorus-containing resin, and the phosphorus content in the solid portion of the adhesive resin composition is 2.5% by mass or more. Preferably, a phosphorus-containing epoxy resin is used as the epoxy resin, a thermoplastic resin containing 10% to 70% by mass of a phosphorus-containing polyester is used as the thermoplastic resin, and the amount of benzoxazine is 5 to 25 parts by mass and the amount of halogen-free flame retardant is 1 to 30 parts by mass per 100 parts of the resins.
摘要翻译：提供一种无卤素的粘合剂组合物，并且可以在不损害粘合性或焊料耐热性的情况下满足阻燃性，以及层压体和使用其的柔性印刷线路板。粘合剂树脂组合物含有环氧树脂; 热塑性树脂; 苯并恶嗪化合物; 无卤阻燃剂; 以及固化剂，其中至少一种环氧树脂和热塑性树脂含有含磷树脂，并且粘合剂树脂组合物的固体部分中的磷含量为2.5质量％以上。优选使用含磷环氧树脂作为环氧树脂，使用含有10〜70质量％的含磷聚酯的热塑性树脂作为热塑性树脂，苯并恶嗪的量为5〜25重量份质量和无卤阻燃剂的量为每100份树脂1至30质量份。

5. 发明申请

US20120043118A1 ADHESIVE RESIN COMPOSITION, AND LAMINATE AND FLEXIBLE PRINTED WIRING BOARD USING THE SAME 审中-公开
标题翻译：粘合树脂组合物和使用它的层压板和柔性印刷线路板
公开(公告)号：US20120043118A1
公开(公告)日：2012-02-23
申请号：US13318300
申请日：2010-03-26
申请人： Shingo Kaimori , Jun Sugawara , Akira Mizoguchi , Syoung Asai , Takuma Yoshisaka , Naota Uenishi
发明人： Shingo Kaimori , Jun Sugawara , Akira Mizoguchi , Syoung Asai , Takuma Yoshisaka , Naota Uenishi
IPC分类号： H05K1/02 , C09J163/00 , C08K5/5399 , B32B7/12
CPC分类号： H05K3/386 , B32B7/12 , B32B15/08 , B32B27/281 , B32B27/288 , B32B27/302 , B32B27/36 , B32B27/38 , B32B2307/306 , B32B2307/3065 , B32B2307/50 , B32B2307/546 , B32B2307/714 , B32B2457/08 , C08G2650/56 , C08K5/0066 , C08L25/04 , C08L33/066 , C08L63/00 , C08L77/00 , C08L2666/04 , C08L2666/14 , C09J7/35 , C09J125/14 , C09J163/00 , C09J171/00 , C09J2203/326 , C09J2463/00 , C09J2477/00 , H05K1/0393 , Y10T428/287
摘要： Provided is an adhesive resin composition containing (A) an epoxy resin and/or a phenoxy resin; (B) an epoxy-containing styrene copolymer containing a monomer unit having an epoxy group and a styrene monomer unit; (C) a thermoplastic resin; and (D) a curing agent, in which the content percentage of the epoxy-containing styrene copolymer (B) relative to the total amount of the resin components contained in the adhesive resin composition is 3% to 25% by mass. The adhesive resin composition is a halogen-free adhesive composition having good flame retardancy and a high peel strength. Also provided are a laminate and a flexible printed wiring board that use the adhesive resin composition.
摘要翻译：提供含有（A）环氧树脂和/或苯氧基树脂的粘合剂树脂组合物; （B）含有具有环氧基的单体单元和苯乙烯单体单元的含环氧基苯乙烯共聚物; （C）热塑性树脂; 和（D）固化剂，其中含有环氧基的苯乙烯共聚物（B）相对于粘合性树脂组合物中含有的树脂成分的总量的含有率为3质量％〜25质量％。粘合剂树脂组合物是具有良好阻燃性和高剥离强度的无卤素粘合剂组合物。还提供了使用粘合剂树脂组合物的层压体和柔性印刷线路板。

6. 发明申请

US20070235887A1 Bonding Wire and Integrated Circuit Device Using the Same 审中-公开
标题翻译：接合线和使用其的集成电路器件
公开(公告)号：US20070235887A1
公开(公告)日：2007-10-11
申请号：US10550548
申请日：2004-10-13
申请人： Shingo Kaimori , Tsuyoshi Nonaka , Masanori Ioka
发明人： Shingo Kaimori , Tsuyoshi Nonaka , Masanori Ioka
IPC分类号： H01L23/52 , H01B5/00
CPC分类号： H01L24/85 , B23K20/007 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/4312 , H01L2224/4321 , H01L2224/43825 , H01L2224/43848 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45572 , H01L2224/456 , H01L2224/45611 , H01L2224/45618 , H01L2224/45623 , H01L2224/45624 , H01L2224/45639 , H01L2224/45644 , H01L2224/45647 , H01L2224/45649 , H01L2224/45655 , H01L2224/45657 , H01L2224/4566 , H01L2224/45663 , H01L2224/45664 , H01L2224/45666 , H01L2224/45669 , H01L2224/4567 , H01L2224/45671 , H01L2224/45673 , H01L2224/45676 , H01L2224/45678 , H01L2224/45683 , H01L2224/48091 , H01L2224/48247 , H01L2224/48463 , H01L2224/48639 , H01L2224/48839 , H01L2224/78301 , H01L2224/85205 , H01L2224/85439 , H01L2924/00011 , H01L2924/01204 , H01L2924/01206 , H01L2924/14 , H01L2924/15747 , H01L2924/20752 , H01L2924/00014 , H01L2924/01004 , H01L2924/0105 , H01L2924/0103 , H01L2924/0104 , H01L2924/01047 , H01L2924/01024 , H01L2924/01026 , H01L2924/01008 , H01L2924/01016 , H01L2924/01001 , H01L2924/01029 , H01L2924/00 , H01L2924/013 , H01L2924/20751 , H01L2924/20753 , H01L2924/20754 , H01L2924/00015 , H01L2924/01076 , H01L2924/01006
摘要： A bonding wire comprising a core and a coating layer formed on the core, wherein the coating layer is formed from a metal having a higher melting point than the core, and further has at least one of the following characteristics; 1. the wet contact angle with the coating layer when the core is melted is not smaller than 20 degrees; 2. when the bonding wire is hung down with its end touching a horizontal surface, and is cut at a point 15 cm above the end and thus let drop onto the horizontal surface, the curvature radius of the formed arc is 35 mm or larger; 3. the 0.2% yield strength is not smaller than 0.115 mN/μm2 but not greater than 0.165 mN/μm2; or 4. the Vickers hardness of the coating layer is 300 or lower.
摘要翻译：一种接合线，其包括芯和形成在所述芯上的涂层，其中所述涂层由具有比所述芯更高的熔点的金属形成，并且还具有以下特征中的至少一个; 当芯熔化时与涂层的湿接触角不小于20度; 2.当接合线悬挂时，其端部接触水平表面，并在端部上方15厘米处切割，因此落在水平面上，所形成的弧的曲率半径为35毫米或更大; 0.2％的屈服强度不小于0.115mN / m 2，但不大于0.165mN / m 2。或4.涂层的维氏硬度为300以下。

7. 发明授权

US06783921B2 Method for etching laminated assembly including polyimide layer 有权
标题翻译：用于蚀刻包括聚酰亚胺层的层压组件的方法
公开(公告)号：US06783921B2
公开(公告)日：2004-08-31
申请号：US10059107
申请日：2002-01-31
申请人： Shingo Kaimori , Tsuyoshi Nonaka , Satoshi Koshimuta , Masato Tsurugasaki
发明人： Shingo Kaimori , Tsuyoshi Nonaka , Satoshi Koshimuta , Masato Tsurugasaki
IPC分类号： G03C176
CPC分类号： H05K3/002 , Y10T428/24917 , Y10T428/31681 , Y10T428/31721
摘要： Disclosed is an etching method of a laminated assembly having a metal layer and a non-thermoplastic polyimide layer bonded together via thermoplastic polyimide, which comprises using an etchant at least containing an alkali metal hydroxide, water and oxyalkylamine, wherein the concentrations of the alkali metal hydroxide (X weight %) and of the water (Y weight %) have relationships represented by coordinate points present within a region (inclusive of boundary lines) defined by the following expressions [1] and [2]: Y=(½)X (provided that 7≦X≦45) [1] Y=({fraction (5/20)})X+17.5 (provided that 7≦X≦45) [2] provided that X and Y are defined based on the total weight of the alkali metal hydroxide, water and oxyalkylamine expressed as 100.
摘要翻译：公开了一种层压组件的蚀刻方法，其具有通过热塑性聚酰亚胺粘合在一起的金属层和非热塑性聚酰亚胺层，其包括使用至少含有碱金属氢氧化物，水和氧烷基胺的蚀刻剂，其中碱金属氢氧化物（X重量％）和水（Y重量％）具有由以下表达式[1]和[2]限定的区域（包括边界线）内存在的坐标点表示的关系：X和Y为基于表示为100的碱金属氢氧化物，水和氧化烷基胺的总重量定义。

8. 发明授权

US08012321B2 Biosensor chip, biosensor system and measuring instrument thereof 有权
标题翻译：生物传感器芯片，生物传感器系统及其测量仪器
公开(公告)号：US08012321B2
公开(公告)日：2011-09-06
申请号：US12280721
申请日：2007-02-27
申请人： Moriyasu Ichino , Toshifumi Hosoya , Shingo Kaimori , Takahiko Kitamura
发明人： Moriyasu Ichino , Toshifumi Hosoya , Shingo Kaimori , Takahiko Kitamura
IPC分类号： G01N27/327
CPC分类号： G01N33/48785
摘要： In a biosensor system and its measuring instrument which determine that a biosensor chip has been inserted and measure biological information on a biological material supplied to the biosensor chip, the size of the biosensor chip is made small, the reliability of the measuring instrument is improved, and the product life becomes long. In addition, a measurement error of the biological information is suppressed in measuring the biological information by inserting a biosensor chip, which has a sensor electrode formed of an electrode member with an electric resistance value higher than a conductive metal, into the measuring instrument.
摘要翻译：在生物传感器系统及其测量仪器中，确定生物传感器芯片已被插入，并且测量生物传感器芯片上提供的生物材料上的生物信息，生物传感器芯片的尺寸变小，测量仪器的可靠性得到改善，产品寿命长。此外，通过将具有电阻值高于导电金属的电极部件形成的传感器电极的生物传感器芯片插入到测量仪器中来测量生物信息，抑制了生物信息的测量误差。

9. 发明申请

US20090123335A1 Sensor Chip and Sensor System 审中-公开
标题翻译：传感器芯片和传感器系统
公开(公告)号：US20090123335A1
公开(公告)日：2009-05-14
申请号：US11885945
申请日：2006-10-25
申请人： Hideaki Nakamura , Masao Gotoh , Tomoko Ishikawa , Isao Karube , Toshifumi Hosoya , Shingo Kaimori , Moriyasu Ichino
发明人： Hideaki Nakamura , Masao Gotoh , Tomoko Ishikawa , Isao Karube , Toshifumi Hosoya , Shingo Kaimori , Moriyasu Ichino
IPC分类号： G01N31/22
CPC分类号： C12Q1/001 , G01N27/3272 , G01N33/5438
摘要： It is intended to provide a sensor chip that enables detection of a deterioration state of a reagent applied on a reaction portion when measuring a concentration of a measurement object substance and a sensor system that enables a correct measurement by using the sensor chip for detecting the reagent deterioration state. A sensor chip including two substrates opposed to each other, a spacer layer sandwiched between the substrates, a multiple reaction portions provided in the spacer layer, and detection electrode units disposed on surfaces of the substrates facing to the spacer layer and exposed to the reaction portions, wherein an identical reagent A is applied on two or more of the reaction portions, and another reagent B that reacts with the reagent A is applied on at least one of the two reaction portions and a sensor system including the sensor chip and a measurement unit for comparing current values from the two or more reaction portions on which the identical reagent A is applied.
摘要翻译：本发明旨在提供一种传感器芯片，其能够检测在测量对象物质的浓度的反应部分上施加的试剂的劣化状态，以及能够通过使用用于检测试剂的传感器芯片进行正确测量的传感器系统劣化状态。一种传感器芯片，包括彼此相对的两个基板，夹在基板之间的间隔层，设置在间隔层中的多个反作用部分和设置在面向间隔层的基板的表面上并暴露于反应部分的检测电极单元其中相同的试剂A施加在两个或更多个反应部分上，另一个与试剂A反应的试剂B施加在两个反应部分中的至少一个上，以及包括传感器芯片和测量单元的传感器系统用于比较来自施加相同试剂A的两个或更多个反应部分的电流值。

10. 发明申请

US20090050986A1 Method for Fabricating Sensor Chip, and Sensor Chip 审中-公开
标题翻译：制造传感器芯片和传感器芯片的方法
公开(公告)号：US20090050986A1
公开(公告)日：2009-02-26
申请号：US11795903
申请日：2006-01-23
申请人： Shingo Kaimori , Toshifumi Hosoya , Moriyasu Ichino , Hideaki Nakamura , Masao Gotoh , Fumiyo Kurusu , Tomoko Ishikawa , Isao Karube
发明人： Shingo Kaimori , Toshifumi Hosoya , Moriyasu Ichino , Hideaki Nakamura , Masao Gotoh , Fumiyo Kurusu , Tomoko Ishikawa , Isao Karube
IPC分类号： H01L29/00 , H01L21/50
CPC分类号： B01J19/0046 , B01J2219/00518 , B01J2219/00527 , B01J2219/00533 , B01J2219/00621 , B01J2219/00657 , B01J2219/0072 , B01J2219/00725
摘要： A method for fabricating a sensor chip having a substrate, a cover layer, a spacer layer interposed between the substrate and the cover layer, and a hollow reaction section provided in the spacer layer, the method comprising the steps of: affixing two or more adhesive or bonding tapes onto a sheet where a plurality of substrates are to be formed or onto a plurality of substrates, to thus form a spacer layer; and forming a hollow reaction section from one or a plurality of gaps between the tapes, whereby volumetric variations or positional displacements of the hollow reaction section can be reduced. A sensor chip which can be fabricated by this method.
摘要翻译：一种用于制造具有衬底，覆盖层，插入在衬底和覆盖层之间的间隔层的传感器芯片的方法和设置在间隔层中的中空反应部分，该方法包括以下步骤：将两个或更多个粘合剂或将带粘合到要形成多个基底的片上或多个基底上，从而形成间隔层; 并且从带之间的一个或多个间隙形成中空反应部分，从而可以减小中空反应部分的体积变化或位置位移。可通过该方法制造的传感器芯片。

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