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    • 2. 发明申请
    • ADAPTIVE ERASE AND SOFT PROGRAMMING FOR MEMORY
    • 自适应删除和软件编程存储器
    • US20110019483A1
    • 2011-01-27
    • US12899403
    • 2010-10-06
    • Shih-Chung LeeGerrit Jan Hemink
    • Shih-Chung LeeGerrit Jan Hemink
    • G11C16/04
    • G11C16/0483G11C11/5635G11C16/16G11C16/3404
    • An erase sequence of a non-volatile storage device includes an erase operation followed by a soft programming operation. The erase operation applies one or more erase pulses to the storage elements, e.g., via a substrate, until an erase verify level is satisfied. The number of erase pulses is tracked and recorded as an indicia of the number of programming-erase cycles which the storage device has experienced. The soft programming operation applies soft programming pulses to the storage elements until a soft programming verify level is satisfied. Based on the number of erase pulses, the soft programming operation time is shortened by skipping verify operations for a specific number of initial soft programming pulses which is a function of the number of erase pulses. Also, a characteristic of the soft programming operation can be optimized, such as starting amplitude, step size or pulse duration.
    • 非易失性存储设备的擦除序列包括随后进行软编程操作的擦除操作。 擦除操作例如经由衬底将一个或多个擦除脉冲施加到存储元件,直到满足擦除验证电平。 跟踪和记录擦除脉冲的数量作为存储设备经历的编程擦除周期数的标记。 软编程操作将软编程脉冲应用于存储元件,直到满足软编程验证电平。 基于擦除脉冲的数量,通过跳过针对擦除脉冲数的函数的特定数量的初始软编程脉冲的验证操作来缩短软编程操作时间。 此外,可以优化软编程操作的特性,例如起始幅度,步长或脉冲持续时间。
    • 3. 发明授权
    • Adaptive erase and soft programming for memory
    • 存储器的自适应擦除和软编程
    • US07839690B2
    • 2010-11-23
    • US12332646
    • 2008-12-11
    • Shih-Chung LeeGerrit Jan Hemink
    • Shih-Chung LeeGerrit Jan Hemink
    • G11C16/04
    • G11C16/0483G11C11/5635G11C16/16G11C16/3404
    • An erase sequence of a non-volatile storage device includes an erase operation followed by a soft programming operation. The erase operation applies one or more erase pulses to the storage elements, e.g., via a substrate, until an erase verify level is satisfied. The number of erase pulses is tracked and recorded as an indicia of the number of programming-erase cycles which the storage device has experienced. The soft programming operation applies soft programming pulses to the storage elements until a soft programming verify level is satisfied. Based on the number of erase pulses, the soft programming operation time is shortened by skipping verify operations for a specific number of initial soft programming pulses which is a function of the number of erase pulses. Also, a characteristic of the soft programming operation can be optimized, such as starting amplitude, step size or pulse duration.
    • 非易失性存储设备的擦除序列包括随后进行软编程操作的擦除操作。 擦除操作例如经由衬底将一个或多个擦除脉冲施加到存储元件,直到满足擦除验证电平。 跟踪和记录擦除脉冲的数量作为存储设备经历的编程擦除周期数的标记。 软编程操作将软编程脉冲应用于存储元件,直到满足软编程验证电平。 基于擦除脉冲的数量,通过跳过针对擦除脉冲数的函数的特定数量的初始软编程脉冲的验证操作来缩短软编程操作时间。 此外,可以优化软编程操作的特性,例如起始幅度,步长或脉冲持续时间。
    • 4. 发明授权
    • Boosting for non-volatile storage using channel isolation switching
    • 使用通道隔离切换提升非易失性存储
    • US07460404B1
    • 2008-12-02
    • US11745082
    • 2007-05-07
    • Yingda DongJeffrey W. LutzeShih-Chung LeeGerrit Jan HeminkKen Oowada
    • Yingda DongJeffrey W. LutzeShih-Chung LeeGerrit Jan HeminkKen Oowada
    • G11C16/00
    • G11C16/12G11C16/0483
    • Program disturb is reduced in non-volatile storage by preventing source side boosting in selected NAND strings. A self-boosting mode which includes an isolation word line is used. A channel area of an inhibited NAND string is boosted on a source side of the isolation word line before the channel is boosted on a drain side of the isolation word line. Further, storage elements near the isolation word line are kept in a conducting state during the source side boosting so that the source side channel is connected to the drain side channel. In this way, in selected NAND strings, source side boosting can not occur and thus program disturb due to source side boosting can be prevented. After the source side boosting, the source side channel is isolated from the drain side channel, and drain side boosting is performed.
    • 在非易失性存储器中通过防止所选择的NAND串中的源极升压来减少编程干扰。 使用包括隔离字线的自增强模式。 禁止的NAND串的通道区域在隔离字线的漏极侧的通道升压之前在隔离字线的源极侧被升压。 此外,在源侧升压期间,隔离字线附近的存储元件保持导通状态,使得源极侧沟道连接到漏极侧沟道。 以这种方式,在选择的NAND串中,不能发生源侧升压,因此可以防止由于源极侧升压而导致的编程干扰。 在源侧升压之后,源侧沟道与漏极侧沟道隔离,并且进行漏极侧升压。
    • 7. 发明授权
    • Self-boosting method for flash memory cells
    • 闪存单元的自增强方法
    • US07466590B2
    • 2008-12-16
    • US11321955
    • 2005-12-28
    • Gerrit Jan HeminkHironobu NakaoShih-Chung Lee
    • Gerrit Jan HeminkHironobu NakaoShih-Chung Lee
    • G11C11/34
    • G11C16/0483G11C16/10G11C16/12G11C16/3418G11C16/3427
    • A low voltage (e.g. of the order of or one to three volts) instead of an intermediate VPASS voltage (e.g. of the order of five to ten volts) is applied to word line zero immediately adjacent to the source or drain side select gate of a flash device such as a NAND flash device and one or more additional word lines next to such word line to reduce or prevent the shifting of threshold voltage of the memory cells coupled to word line zero during the programming cycles of the different cells of the NAND strings. This may be implemented in any one of a variety of different self boosting schemes including erased areas self boosting and local self boosting schemes. In a modified erased area self boosting scheme, low voltages are applied to two or more word lines on the source side of the selected word line to reduce band-to-band tunneling and to improve the isolation between two boosted channel regions. In a modified local self boosting scheme, zero volt or low voltages are applied to two or more word lines on the source side and to two or more word lines on the drain side of the selected word line to reduce band-to-band tunneling and to improve the isolation of the channel areas coupled to the selected word line. Different intermediate boosting voltage(s) (e.g. of the order of five to ten volts) may be applied to one or more of the word lines adjacent to the selected word line (that is the word line programming the selected transistor), where the boosting voltage(s) applied to the word line(s) adjacent to the selected word line are/is different from that or those applied to other unselected word lines.
    • 代替中间VPASS电压(例如5到10伏数量级)的低电压(例如,一级或一到三伏)被施加到紧邻源极或漏极侧选择栅极的字线零点 闪存器件,例如NAND闪存器件,以及在该字线旁边的一个或多个附加字线,以在NAND串的不同单元的编程周期期间减少或防止耦合到字线零的存储器单元的阈值电压偏移 。 这可以在各种不同的自增强方案中的任何一种中实现,包括擦除区域自增强和局部自增强方案。 在修改的擦除区域自增强方案中,将低电压施加到所选字线的源极侧上的两个或更多个字线,以减少带间隧穿并改善两个增强的通道区域之间的隔离。 在修改后的局部自增强方案中,将零电压或低电压施加到源极侧的两条或更多条字线和所选择的字线的漏极侧上的两条或多条字线,以减少带间隧穿和 以改善耦合到所选字线的通道区域的隔离。 不同的中间升压电压(例如,五到十伏数量级)可以施加到与所选字线相邻的一条或多条字线(即所选择的晶体管的字线编程),其中升压 施加到与所选字线相邻的字线的电压与施加到所选字线的字线的电压不同。