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1. 发明申请

US20070096761A1 Semiconductor apparatus testing arrangement and semiconductor apparatus testing method 有权
标题翻译：半导体装置测试装置和半导体装置测试方法
公开(公告)号：US20070096761A1
公开(公告)日：2007-05-03
申请号：US11339826
申请日：2006-01-26
申请人： Shigeyuki Maruyama , Yoshikazu Arisaka , Kazuhiro Tashiro , Takayuki Katayama , Tetsu Ozawa , Yuushin Kimura
发明人： Shigeyuki Maruyama , Yoshikazu Arisaka , Kazuhiro Tashiro , Takayuki Katayama , Tetsu Ozawa , Yuushin Kimura
IPC分类号： G01R31/26
CPC分类号： G01R1/0433
摘要： A semiconductor apparatus testing arrangement for testing a plurality of semiconductor devices produced on a semiconductor substrate, has a substrate on which a plurality of testing units are arranged, each unit comprising a probe needles corresponding to electrode terminals of the semiconductor device and electric conductor parts connected with the probe needles.
摘要翻译：一种用于测试在半导体衬底上制造的多个半导体器件的半导体器件测试装置，具有布置有多个测试单元的衬底，每个单元包括与半导体器件的电极端子相对应的探针和连接的导体部件用探针。

2. 发明授权

US07355421B2 Semiconductor apparatus testing arrangement and semiconductor apparatus testing method 有权
标题翻译：半导体装置测试装置和半导体装置测试方法
公开(公告)号：US07355421B2
公开(公告)日：2008-04-08
申请号：US11339826
申请日：2006-01-26
申请人： Shigeyuki Maruyama , Yoshikazu Arisaka , Kazuhiro Tashiro , Takayuki Katayama , Tetsu Ozawa , Yuushin Kimura
发明人： Shigeyuki Maruyama , Yoshikazu Arisaka , Kazuhiro Tashiro , Takayuki Katayama , Tetsu Ozawa , Yuushin Kimura
IPC分类号： G01R31/02 , G01R31/26 , G06K5/04
CPC分类号： G01R1/0433
摘要： A semiconductor apparatus testing arrangement for testing a plurality of semiconductor devices produced on a semiconductor substrate, has a substrate on which a plurality of testing units are arranged, each unit comprising a probe needles corresponding to electrode terminals of the semiconductor device and electric conductor parts connected with the probe needles.
摘要翻译：一种用于测试在半导体衬底上制造的多个半导体器件的半导体器件测试装置，具有布置有多个测试单元的衬底，每个单元包括与半导体器件的电极端子相对应的探针和连接的导体部件用探针。

3. 发明申请

US20080227226A1 Semiconductor substrate, manufacturing method of a semiconductor device and testing method of a semiconductor device 审中-公开
标题翻译：半导体衬底，半导体器件的制造方法和半导体器件的测试方法
公开(公告)号：US20080227226A1
公开(公告)日：2008-09-18
申请号：US12153481
申请日：2008-05-20
申请人： Shigeru Fujii , Yoshikazu Arisaka , Hitoshi Izuru , Kazuhiro Tashiro , Shigeyuki Maruyama
发明人： Shigeru Fujii , Yoshikazu Arisaka , Hitoshi Izuru , Kazuhiro Tashiro , Shigeyuki Maruyama
IPC分类号： H01L21/66 , H01L21/304
CPC分类号： H01L21/78 , H01L23/544 , H01L2223/54453 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor substrate eliminates a restriction caused by a width of scribe lines so as to increase a number of semiconductor elements formed on the semiconductor substrate. A plurality of semiconductor element areas are formed by forming a plurality of unit exposed and printed areas, each of which contains the semiconductor element areas. A first scribe line extends between the semiconductor element areas formed within the unit exposed and printed area. A second scribe line extends between the unit exposed and printed areas. A width of the first scribe line is different from a width of the second scribe line.
摘要翻译：半导体衬底消除了由划线的宽度引起的限制，从而增加形成在半导体衬底上的半导体元件的数量。多个半导体元件区域通过形成多个单位曝光和印刷区域而形成，每个单元暴露和印刷区域都包含半导体元件区域。第一刻划线在形成在单元曝光和印刷区域内的半导体元件区域之间延伸。第二划线在单元曝光和打印区域之间延伸。第一划线的宽度与第二划线的宽度不同。

4. 发明授权

US07129726B2 Testing device and testing method of a semiconductor device 有权
标题翻译：半导体器件的测试装置和测试方法
公开(公告)号：US07129726B2
公开(公告)日：2006-10-31
申请号：US11211094
申请日：2005-08-25
申请人： Kazuhiro Tashiro , Yasuyuki Itou , Shigeyuki Maruyama , Yoshikazu Arisaka
发明人： Kazuhiro Tashiro , Yasuyuki Itou , Shigeyuki Maruyama , Yoshikazu Arisaka
IPC分类号： G01R31/02
CPC分类号： G01R31/2887
摘要： A testing device can perform a test on an arbitrary one of a plurality of semiconductor devices by pressing the semiconductor devices onto a contactor from a back side of the semiconductor device. A test circuit board has a contactor provided with contact pieces corresponding to external connection terminals of semiconductor devices to be tested. A support board is capable of mounting the semiconductor devices thereon in an aligned state. A stage supports the support board. A press head presses the semiconductor devices to be tested mounted on the support board so as to cause external connection terminals of the semiconductor devices to be tested to contact with the contact pieces of the contactor. The stage is movable to a position at which at least one of the semiconductor devices to be tested, which are mounted on the support board, faces the contactor.
摘要翻译：测试装置可以通过将半导体器件从半导体器件的背面按压到接触器上来对多个半导体器件中的任意一个进行测试。测试电路板具有接触器，该接触器具有与待测试的半导体器件的外部连接端子相对应的接触片。支撑板能够以对准状态将半导体器件安装在其上。舞台支持支持板。压头按压待安装在支撑板上的待测试的半导体器件，以便使半导体器件的外部连接端子被测试以与接触器的接触片接触。舞台可移动到安装在支撑板上的要测试的半导体器件中的至少一个面向接触器的位置。

5. 发明申请

US20060097356A1 Semiconductor substrate, manufacturing method of a semiconductor device and testing method of a semiconductor device 审中-公开
标题翻译：半导体衬底，半导体器件的制造方法和半导体器件的测试方法
公开(公告)号：US20060097356A1
公开(公告)日：2006-05-11
申请号：US11062488
申请日：2005-02-23
申请人： Shigeru Fujii , Yoshikazu Arisaka , Hitoshi Izuru , Kazuhiro Tashiro , Shigeyuki Maruyama
发明人： Shigeru Fujii , Yoshikazu Arisaka , Hitoshi Izuru , Kazuhiro Tashiro , Shigeyuki Maruyama
IPC分类号： H01L23/544
CPC分类号： H01L21/78 , H01L23/544 , H01L2223/54453 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor substrate eliminates a restriction caused by a width of scribe lines so as to increase a number of semiconductor elements formed on the semiconductor substrate. A plurality of semiconductor element areas are formed by forming a plurality of unit exposed and printed areas, each of which contains the semiconductor element areas. A first scribe line extends between the semiconductor element areas formed within the unit exposed and printed area. A second scribe line extends between the unit exposed and printed areas. A width of the first scribe line is different from a width of the second scribe line.
摘要翻译：半导体衬底消除了由划线的宽度引起的限制，从而增加形成在半导体衬底上的半导体元件的数量。多个半导体元件区域通过形成多个单位曝光和印刷区域而形成，每个单元暴露和印刷区域都包含半导体元件区域。第一刻划线在形成在单元曝光和印刷区域内的半导体元件区域之间延伸。第二划线在单元曝光和打印区域之间延伸。第一划线的宽度与第二划线的宽度不同。

6. 发明申请

US20060220667A1 Testing device and testing method of a semiconductor device 有权
公开(公告)号：US20060220667A1
公开(公告)日：2006-10-05
申请号：US11211094
申请日：2005-08-25
申请人： Kazuhiro Tashiro , Yasuyuki Itou , Shigeyuki Maruyama , Yoshikazu Arisaka
发明人： Kazuhiro Tashiro , Yasuyuki Itou , Shigeyuki Maruyama , Yoshikazu Arisaka
IPC分类号： G01R31/02
CPC分类号： G01R31/2887
摘要： A testing device can perform a test on an arbitrary one of a plurality of semiconductor devices by pressing the semiconductor devices onto a contactor from a back side of the semiconductor device. A test circuit board has a contactor provided with contact pieces corresponding to external connection terminals of semiconductor devices to be tested. A support board is capable of mounting the semiconductor devices thereon in an aligned state. A stage supports the support board. A press head presses the semiconductor devices to be tested mounted on the support board so as to cause external connection terminals of the semiconductor devices to be tested to contact with the contact pieces of the contactor. The stage is movable to a position at which at least one of the semiconductor devices to be tested, which are mounted on the support board, faces the contactor.

7. 发明申请

US20060186905A1 Contactor for electronic parts and a contact method 有权
标题翻译：电子零件接触器和接触方式
公开(公告)号：US20060186905A1
公开(公告)日：2006-08-24
申请号：US11339836
申请日：2006-01-26
申请人： Naohito Kohashi , Shigeyuki Maruyama , Yoshikazu Arisaka , Hiroyuki Murotani , Katsuhiko Ono
发明人： Naohito Kohashi , Shigeyuki Maruyama , Yoshikazu Arisaka , Hiroyuki Murotani , Katsuhiko Ono
IPC分类号： G01R31/02
CPC分类号： G01R1/0466 , G01R1/0483
摘要： A contactor for electronic parts can provide an appropriate and uniform contact with respect to a plurality of electrode terminals in an electronic part such as an IC. Each of a plurality of contact members has a first contact portion on one end thereof and a second contact portion on the other end thereof, the first contract portion having a recessed portion that receives one of the electrode terminals of the electronic part. A base accommodates and supports the plurality of the contact members. The first contact portion is movable in a horizontal direction.
摘要翻译：用于电子部件的接触器可以提供相对于诸如IC的电子部件中的多个电极端子的适当且均匀的接触。多个接触构件中的每一个在其一端具有第一接触部分和另一端的第二接触部分，第一接合部分具有容纳电子部件的电极端子之一的凹部。基座容纳并支撑多个接触构件。第一接触部分可沿水平方向移动。

8. 发明授权

US07471096B2 Contactor for electronic parts and a contact method 有权
标题翻译：电子零件接触器和接触方式
公开(公告)号：US07471096B2
公开(公告)日：2008-12-30
申请号：US11339836
申请日：2006-01-26
申请人： Naohito Kohashi , Shigeyuki Maruyama , Yoshikazu Arisaka , Hiroyuki Murotani , Katsuhiko Ono
发明人： Naohito Kohashi , Shigeyuki Maruyama , Yoshikazu Arisaka , Hiroyuki Murotani , Katsuhiko Ono
IPC分类号： G01R31/02
CPC分类号： G01R1/0466 , G01R1/0483
摘要： A contactor for electronic parts can provide an appropriate and uniform contact with respect to a plurality of electrode terminals in an electronic part such as an IC. Each of a plurality of contact members has a first contact portion on one end thereof and a second contact portion on the other end thereof, the first contract portion having a recessed portion that receives one of the electrode terminals of the electronic part. A base accommodates and supports the plurality of the contact members. The first contact portion is movable in a horizontal direction.
摘要翻译：用于电子部件的接触器可以提供相对于诸如IC的电子部件中的多个电极端子的适当且均匀的接触。多个接触构件中的每一个在其一端具有第一接触部分和另一端的第二接触部分，第一接合部分具有容纳电子部件的电极端子之一的凹部。基座容纳并支撑多个接触构件。第一接触部分可沿水平方向移动。

9. 发明授权

US08051554B2 IC socket with attached electronic component 有权
标题翻译： IC插座带有电子元件
公开(公告)号：US08051554B2
公开(公告)日：2011-11-08
申请号：US12104038
申请日：2008-04-16
申请人： Daisuke Koizumi , Shigeyuki Maruyama , Kazuhiro Tashiro , Naoyuki Watanabe
发明人： Daisuke Koizumi , Shigeyuki Maruyama , Kazuhiro Tashiro , Naoyuki Watanabe
IPC分类号： B23P19/00 , H01L21/44
CPC分类号： B25B27/14 , H05K7/1061 , Y10T29/4913 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187 , Y10T29/53191 , Y10T29/53943
摘要： An IC socket in which an electronic component is attached to a predetermined position of the IC socket, the IC socket including a fixed part including a contact pin which is connected to a terminal of the electronic component when a position of the electronic component is aligned to the predetermined position of the IC socket using an electronic component attaching tool, the contact pin including a pair of end portions on an upper surface of the fixed part; a movable part that is movable to the fixed part when the movable part is pushed down to apply a force to the contact pin of the fixed part so as to separate the pair of end portions of the contact pin from each other; and a standard part that is formed on the movable part and engages with the electronic component attaching tool to align a position of the electronic component attaching tool to the standard part when a position of the electronic component is aligned to the predetermined position of the IC socket using the electronic attaching tool, the standard part having a shape which does not substantially depend on an external shape of the electronic component.
摘要翻译：一种IC插座，其中电子部件附接到IC插座的预定位置，IC插座包括固定部分，该固定部分包括接触销，当电子部件的位置与电子部件的位置对准时，该接触销连接到电子部件的端子所述IC插座的预定位置使用电子部件安装工具，所述接触销包括在所述固定部的上表面上的一对端部; 可移动部分，当可移动部分被向下推动时，可移动到固定部分，以向固定部分的接触销施加力，以将接触销的一对端部彼此分离; 以及形成在可动部上并与电子部件安装工具接合的标准部分，当电子部件的位置与IC插座的预定位置对准时，将电子部件安装工具的位置对准标准部件使用电子连接工具，标准部件具有基本上不依赖于电子部件的外部形状的形状。

10. 发明申请

US20080136433A1 Contactor for electronic components and test method using the same 有权
标题翻译：电子元件接触器和使用相同的测试方法
公开(公告)号：US20080136433A1
公开(公告)日：2008-06-12
申请号：US11979305
申请日：2007-11-01
申请人： Kazuhiro Tashiro , Shigeyuki Maruyama , Daisuki Koizumi , Takumi Kumatabara , Keisuke Fukuda
发明人： Kazuhiro Tashiro , Shigeyuki Maruyama , Daisuki Koizumi , Takumi Kumatabara , Keisuke Fukuda
IPC分类号： G01R1/073 , G01R31/02
CPC分类号： G01R1/0483 , G01R1/0441
摘要： A contactor configured to be electrically connected to the terminals of an electronic component is disclosed. The connector includes multiple contact electrodes contacting the terminals of the electronic component and multiple elastic electrodes each composed of an electrically conductive elastic body. The elastic electrodes generate a pressing force for pressing the contact electrodes against the terminals of the electronic component. The contact electrodes are separable from the elastic electrodes.
摘要翻译：公开了一种被配置为电连接到电子部件的端子的接触器。连接器包括与电子部件的端子接触的多个接触电极和各自由导电性弹性体构成的多个弹性电极。弹性电极产生用于将接触电极压靠在电子部件的端子上的按压力。接触电极可与弹性电极分离。

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