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    • 6. 发明授权
    • Exposure apparatus and device manufacturing method
    • 曝光装置和装置制造方法
    • US08330934B2
    • 2012-12-11
    • US12659066
    • 2010-02-24
    • Hiroyuki NagasakaTaro YamamotoOsamu Hirakawa
    • Hiroyuki NagasakaTaro YamamotoOsamu Hirakawa
    • G03B27/52G03B27/42
    • G03F7/70341G03F7/70891
    • An exposure apparatus for emitting exposure light onto a substrate via a projection optical system and a liquid to expose the substrate includes a supply pipe which supplies the liquid; a recovery pipe which recovers the liquid; a connection pipe which connects the supply pipe and the recovery pipe; and a switching device which switches a flow path of the liquid so that when liquid supply is stopped, the liquid that has flowed into the supply pipe flows to the recovery pipe via the connection pipe. The apparatus may further include a temperature regulation apparatus connected to the supply pipe, which performs temperature regulation of the liquid supplied to the supply pipe, and has a rough temperature regulator which roughly regulates the temperature of the liquid, and a fine temperature regulator which is arranged between the rough temperature regulator and the supply pipe and performs fine regulation of this temperature.
    • 用于经由投影光学系统和液体将曝光光发射到基板上以暴露基板的曝光装置包括:供给液体的供给管; 一种回收液体的回收管; 连接供给管和回收管的连接管; 以及切换装置,其切换液体的流路,使得当液体供应停止时,流入供给管的液体经由连接管流向回收管。 该装置还可以包括连接到供应管的温度调节装置,其对供应管供给的液体进行温度调节,并且具有大致调节液体的温度的粗略温度调节器,以及微调温度调节器, 布置在粗调温器和供水管之间,并对该温度进行微调。
    • 8. 发明授权
    • Heating apparatus, heating method, coating apparatus, and storage medium
    • 加热装置,加热方法,涂布装置和存储介质
    • US07838801B2
    • 2010-11-23
    • US11707061
    • 2007-02-16
    • Osamu HirakawaMasami AkimotoShinichi Hayashi
    • Osamu HirakawaMasami AkimotoShinichi Hayashi
    • H01L21/68B65G15/10B65H5/02F27B5/06F27B5/12
    • H01L21/67109H01L21/67748Y10S198/952
    • A heating apparatus cooling a substrate heated by a hot plate at a cooling position adjacent to the hot plate, capable of achieving a smaller height and reducing an operation time in the apparatus, in which contamination of the substrate by particles or the like is less likely, and the like, are provided. The heating apparatus includes a hot plate for heating a wafer representing a substrate from below, in a heating chamber having a wafer load/unload port. In addition, a wire for transferring the wafer between a cooling position of the substrate adjacent to the load/unload port of the heating chamber (position above a cooling plate) and a position above the hot plate is provided and extends. The wafer is mounted on a gap forming member provided on the wire, and thereafter loaded into the heating chamber.
    • 一种加热装置,用于在与热板相邻的冷却位置处冷却由热板加热的基板,能够实现较小的高度,并且减少了由于颗粒等引起的基板污染的装置中的操作时间。 ,等等。 加热装置包括用于在具有晶片装载/卸载端口的加热室中从下方加热表示基板的晶片的热板。 此外,提供并延伸用于将晶片在与加热室的加载/卸载端口相邻的冷却位置(位于冷却板的上方)之间传送晶片的导线和热板上方的位置。 将晶片安装在设置在线材上的间隙形成部件上,然后装入加热室。