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    • 9. 发明授权
    • Wafer surface observing method and apparatus
    • 晶圆表面观察方法及装置
    • US08577119B2
    • 2013-11-05
    • US11698987
    • 2007-01-29
    • Hiroshi HigashiTetsuya WatanabeKenji Aiko
    • Hiroshi HigashiTetsuya WatanabeKenji Aiko
    • G06K9/00G01N21/00
    • G01N21/9501G01N21/9503
    • A wafer surface observing apparatus for inspecting a peripheral portion of an object has (A) a lens system and a CCD camera for taking images of the peripheral portion of the object, (B) storage for storing image data about the taken images, and (C) display for displaying the image data stored in the storage device. In particular, the present apparatus can have functions of rotating the object placed on a prealignment portion, recording images of one full outer periphery of an end portion of the object by the lens system and CCD camera into the location where the orientation flat portions or notched portions of the object are placed in position, accepting the images into the storage device, and displaying the images on a CRT.
    • 用于检查物体的周边部分的晶片表面观察装置具有(A)用于拍摄物体的周边部分的图像的透镜系统和CCD照相机,(B)用于存储关于拍摄图像的图像数据的存储器和( C)显示用于显示存储在存储装置中的图像数据。 具体地说,本装置具有使放置在预对准部上的物体旋转的功能,通过透镜系统和CCD照相机将物体的端部的一个完整外周的图像记录到定位平面部分或切口的位置 将物体的部分放置在适当位置,将图像接收到存储装置中,并将图像显示在CRT上。