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    • 2. 发明授权
    • Connector, electronic component fixing device, and tester
    • 连接器,电子部件固定装置和测试仪
    • US07033196B2
    • 2006-04-25
    • US11009261
    • 2004-12-09
    • Shigeru MurayamaMasanori KanekoFumio KurotoriShigeru Matsumura
    • Shigeru MurayamaMasanori KanekoFumio KurotoriShigeru Matsumura
    • H01R13/62
    • G01R1/0408H01R13/62916
    • A connector including a plug and a socket and a driving section for fitting the plug and the socket by moving the driving section in a first direction substantially perpendicular to the fitting direction of the socket and the plug. The driving section has a first groove part provided in the first direction, and a second groove part provided substantially perpendicular to the first direction. The plug has a first protruding portion engaging with the first groove part, and the socket has a second protruding portion engaging with the first groove part. When the driving section moves in the first direction, the driving section depresses the second protruding portion in the fitting direction at the second groove part to move the socket in the fitting direction, thus fitting the plug in the socket.
    • 一种包括插头和插座的连接器,以及用于通过沿与插座和插头的嵌合方向大致垂直的第一方向移动驱动部分来装配插头和插座的驱动部分。 驱动部具有沿第一方向设置的第一槽部和与第一方向大致垂直地设置的第二槽部。 插头具有与第一槽部接合的第一突出部,插座具有与第一槽部接合的第二突出部。 当驱动部沿第一方向移动时,驱动部在第二槽部处按照嵌合方向按压第二突出部,以使插座沿嵌合方向移动,将插头嵌入插座。
    • 3. 发明授权
    • Probe card and the production method
    • 探针卡和生产方法
    • US07482821B2
    • 2009-01-27
    • US11151664
    • 2005-06-14
    • Takaji IshikawaFumio KurotoriTadao Saito
    • Takaji IshikawaFumio KurotoriTadao Saito
    • G01R31/02
    • G01R1/06722G01R31/2886
    • A probe card 1 is composed of a plurality of probe pins 50 having wafer-side plungers51 at one end portion and substrate-side plungers52 on the other end side; two probe guides 30 and 40 one above the other for supporting the plurality of probe pins 50, so that the plurality of probe pins 50 are arranged to be corresponding to an arrangement of external terminals of a semiconductor wafer and the wafer-side plungers 51 of the probe pins 50 protrude; a print substrate 10 having pads 13 for the substrate-side plungers 52 of the probe pins 50 supported by the probe guides 30 and 40 to contact; and a stiffener 20 provided on the back surface of the print substrate 10.
    • 探针卡1由在一端部具有晶片侧柱塞51和另一端侧的基板侧柱塞52的多个探针50构成。 两个探针引导件30和40彼此重叠以支撑多个探针50,使得多个探针50被布置成对应于半导体晶片的外部端子和晶片侧柱塞51的布置 探针50突出; 印刷基板10,其具有用于由探针引导件30和40支撑的探针30的基板侧柱塞52的垫13接触; 以及设置在印刷基板10的背面上的加强件20。
    • 4. 发明授权
    • Mounting structure and fastener for heat sink
    • 用于散热器的安装结构和紧固件
    • US5561325A
    • 1996-10-01
    • US426894
    • 1995-04-20
    • Mitsuhiro UenoToshihiro KusagayaFumio Kurotori
    • Mitsuhiro UenoToshihiro KusagayaFumio Kurotori
    • H01L23/40H01L23/467H01L23/34
    • H01L23/467H01L23/4093H01L2924/0002
    • A heat sink mounting structure which can increase a cooling efficiency and easily mount a heat sink. The heat sink mounting structure includes an integrated circuit package, a heat sink mounted on the integrated circuit package, and a fastener for fastening the heat sink to the integrated circuit package so that a lower surface of the heat sink comes into close contact with an upper surface of the integrated circuit package. The fastener includes a strip member, a pair of forked members integrally connected to opposite ends of the strip member, and a pair of engaging members integrally connected to the pair of forked members. The engaging members are adapted to engage diagonal corner portions of the integrated circuit package, and the forked members are adapted to come into pressure contact with side surfaces of the heat sink.
    • 一种散热器安装结构,可以提高冷却效率并轻松安装散热片。 散热器安装结构包括集成电路封装,安装在集成电路封装上的散热器和用于将散热器紧固到集成电路封装的紧固件,使得散热器的下表面与上部 集成电路封装的表面。 紧固件包括带状构件,一体地连接到带状构件的相对端部的一对叉形构件,以及与该对叉形构件一体地连接的一对接合构件。 接合构件适于与集成电路封装的对角线部分接合,并且叉形构件适于与散热器的侧表面进行压力接触。
    • 5. 发明申请
    • Contact Pin Probe Card and Electronic Device Test Apparatus Using Same
    • 接触针探针卡和电子设备测试仪器使用相同
    • US20080143366A1
    • 2008-06-19
    • US10566463
    • 2004-12-14
    • Fumio KurotoriTakaji IshikawaTadao Saito
    • Fumio KurotoriTakaji IshikawaTadao Saito
    • G01R31/02
    • G01R1/07371G01R1/06722G01R1/06727G01R1/06738G01R1/06761
    • A contact pin (50) for contacting a terminal of a wafer and supplying a signal to that wafer is provided with a first conductive layer (51b) composed of a first conductive material having a relatively higher hardness than the oxide film formed on the terminal of the wafer, a second conductive layer (51c) composed of a second conductive material having a relatively lower hardness than the oxide film, and a base material (51a) with the first conductive layer (51b) and second conductive layer (51c) formed at the outside, the first conductive layer (51b) being formed so as to closely contact the outside of the second conductive layer (51c), the first conductive layer (51b) and second conductive layer (51c) both being exposed at the front end face (50a) of the contact pin (50).
    • 用于接触晶片的端子并向该晶片提供信号的接触引脚(50)设置有第一导电层(51b),该导电层由具有比形成在端子上的氧化物膜的硬度更高的硬度的第一导电材料构成 由具有比氧化物膜低的硬度的第二导电材料构成的第二导电层(51c)以及具有第一导电层(51b)和第二导电层(51b)的基底材料(51a) 51c)形成,第一导电层(51b)形成为紧密接触第二导电层(51c)的外部,第一导电层(51b)和第二导电层(51c) )都暴露在接触销(50)的前端面(50a)处。
    • 8. 发明授权
    • Contact pin probe card and electronic device test apparatus using same
    • 接触针探针卡和电子设备测试仪使用相同
    • US07667471B2
    • 2010-02-23
    • US10566463
    • 2004-12-14
    • Fumio KurotoriTakaji IshikawaTadao Saito
    • Fumio KurotoriTakaji IshikawaTadao Saito
    • G01R31/02
    • G01R1/07371G01R1/06722G01R1/06727G01R1/06738G01R1/06761
    • A contact pin (50) for contacting a terminal of a wafer and supplying a signal to that wafer is provided with a first conductive layer (51b) composed of a first conductive material having a relatively higher hardness than the oxide film formed on the terminal of the wafer, a second conductive layer (51c) composed of a second conductive material having a relatively lower hardness than the oxide film, and a base material (51a) with the first conductive layer (51b) and second conductive layer (51c) formed at the outside, the first conductive layer (51b) being formed so as to closely contact the outside of the second conductive layer (51c), the first conductive layer (51b) and second conductive layer (51c) both being exposed at the front end face (50a) of the contact pin (50).
    • 用于接触晶片的端子并向该晶片提供信号的接触引脚(50)设置有第一导电层(51b),第一导电层(51b)由具有比形成在晶片的端子上的氧化物膜的相对较高的硬度的第一导电材料 晶片,具有比氧化膜低的硬度的第二导电材料构成的第二导电层(51c)和形成有第一导电层(51b)的基材(51a)和第二导电层 外部,第一导电层(51b)形成为紧密接触第二导电层(51c)的外部,第一导电层(51b)和第二导电层(51c)都在前端面 (50)的(50a)。
    • 9. 发明申请
    • Probe card and the production method
    • 探针卡和生产方法
    • US20050280428A1
    • 2005-12-22
    • US11151664
    • 2005-06-14
    • Takaji IshikawaFumio KurotoriTadao Saito
    • Takaji IshikawaFumio KurotoriTadao Saito
    • G01R1/067G01R31/02G01R31/28H01L21/66
    • G01R1/06722G01R31/2886
    • A probe card 1 is composed of a plurality of probe pins 50 having wafer-side plungers 51 at one end portion and substrate-side plungers 52 on the other end side; two probe guides 30 and 40 one above the other for supporting the plurality of probe pins 50, so that the plurality of probe pins 50 are arranged to be corresponding to an arrangement of external terminals of a semiconductor wafer and the wafer-side plungers 51 of the probe pins 50 protrude; a print substrate 10 having pads 13 for the substrate-side plungers 52 of the probe pins 50 supported by the probe guides 30 and 40 to contact; and a stiffener 20 provided on the back surface of the print substrate 10. The probe guides 30 and 40 are produced by a material having substantially the same thermal expansion coefficient as that of the semiconductor wafer, and fixed to the print substrate 10 and the stiffener 20 at the circumferential portion and the center portion. The probe card 1 configured as above is capable of maintaining high precision in needle positions of the probe pins 50 with respect to the external terminals of the semiconductor wafer and the pads 13 of the print substrate 10.
    • 探针卡1由在一端部具有晶片侧柱塞51和另一端侧的基板侧柱塞52的多个探针50构成。 两个探针引导件30和40彼此重叠以支撑多个探针50,使得多个探针50被布置成对应于半导体晶片的外部端子和晶片侧柱塞51的布置 探针50突出; 印刷基板10,其具有用于由探针引导件30和40支撑的探针30的基板侧柱塞52的垫13接触; 以及设置在印刷基板10的后表面上的加强件20.探针引导件30和40由具有与半导体晶片基本相同的热膨胀系数的材料制成,并且固定到印刷基板10和加强件 20在圆周部分和中心部分。 如上构造的探针卡1能够相对于半导体晶片的外部端子和印刷基板10的焊盘13保持探针30的针位置的高精度。