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    • 5. 发明授权
    • Projection optical system adjustment method, prediction method, evaluation method, adjustment method, exposure method and exposure apparatus, program, and device manufacturing method
    • 投影光学系统调整方法,预测方法,评价方法,调整方法,曝光方法和曝光装置,程序和装置制造方法
    • US07088426B2
    • 2006-08-08
    • US10927287
    • 2004-08-27
    • Shigeru HirukawaToshiharu NakashimaKenji Higashi
    • Shigeru HirukawaToshiharu NakashimaKenji Higashi
    • G03B27/52G03B27/42G03B27/32
    • G03F7/706G03F7/70258G03F7/70625G03F7/70883
    • When a pattern is transferred via a projection optical system, a size of an image of the pattern varies depending on a defocus amount of a transferring position from the best focus position, and a flucuation curve showing the variation (the so-called CD-focus curve) varies depending on wavefront aberration of the projection optical system. There is a close relation between a linear combination value of a plurality of terms that each have a coefficient (an aberration component) of a plurality of Zernike terms (aberration component terms) into which the wavefront aberration of the projection optical system is decomposed using a Zernike polynomial in series expansion, and the variation of the flucuation curve. Accordingly, by using the above relation, the CD-focus curve related to the pattern via a projection optical system whose aberration state is predetermined exposed under predetermined exposure conditions can be predicted within a short period of time by a simple calculation of obtaining the linear combination value of a plurality of terms that each have an aberration component.
    • 当通过投影光学系统传送图案时,图案的尺寸根据从最佳对焦位置的转印位置的散焦量而变化,并且显示变化的流感曲线(所谓的CD焦点 曲线)根据投影光学系统的波前像差而变化。 多个项目的线性组合值之间存在密切关系,每个项目的线性组合值各自具有使用以下方式分解投影光学系统的波前像差的多个泽尼克项(像差分量项)的系数(像差分量) Zernike多项式的串联膨胀,以及流变曲线的变化。 因此,通过使用上述关系,可以通过简单的计算获得线性组合,在短时间内预测通过经过预定曝光条件下曝光的像差状态的投影光学系统与图案相关的CD聚焦曲线 每个具有像差分量的多个项的值。
    • 9. 发明授权
    • Substrate processing method, photomask manufacturing method, photomask, and device manufacturing method
    • 基板加工方法,光掩模制造方法,光掩模和器件制造方法
    • US07713889B2
    • 2010-05-11
    • US11600151
    • 2006-11-16
    • Shigeru Hirukawa
    • Shigeru Hirukawa
    • H01L21/00
    • G03F7/705G03F1/36G03F7/70108
    • A device linewidth characteristic is predicted based on a sharp-edged feature of a projected image of a predetermined pattern (steps 104 to 110), and an exposure condition of the pattern is adjusted based on the device linewidth characteristic that has been predicted (step 112). Then, exposure is performed under the adjusted exposure condition. That is, patterning of a resist on a substrate is performed with the projected image of the pattern (step 114). And, by developing the substrate after patterning, a resist pattern that satisfies a desired device linewidth characteristic is formed on the substrate. Accordingly, by performing etching of the substrate with the resist pattern serving as a mask, a pattern after etching can be formed with a desired linewidth.
    • 基于预定图案的投影图像的尖锐特征预测装置线宽特性(步骤104至110),并且基于已经预测的装置线宽特性来调整图案的曝光条件(步骤112 )。 然后,在调整后的曝光条件下进行曝光。 也就是说,利用图案的投影图像来执行基板上的抗蚀剂的图案化(步骤114)。 并且,通过在图案化之后显影衬底,在衬底上形成满足所需器件线宽特性的抗蚀剂图案。 因此,通过用抗蚀剂图案作为掩模进行基板的蚀刻,可以以期望的线宽形成蚀刻后的图案。