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    • 2. 发明授权
    • Laser speckle velocity-measuring apparatus
    • 激光斑点速度测量仪
    • US4912519A
    • 1990-03-27
    • US207864
    • 1988-06-17
    • Tomio YoshidaNobuo NakatsukaHiroshi KitajimaTsukasa Yamashita
    • Tomio YoshidaNobuo NakatsukaHiroshi KitajimaTsukasa Yamashita
    • G01P3/80
    • G01P3/806
    • There is provided a laser speckle velocity-measuring apparatus comprising: a semiconductor laser to irradiate the light to a moving object; first and second photo sensing devices whose light receiving points are arranged in the moving direction of the objects at a predetermined distance so as to be away from each other; a clock signal generating and control circuit for determining a clock frequency of the clock signal so that the number of clocks of the clock signal is always set to a constant value when the delay time of the photo sensing signal of the second photo sensing device for the photo sensing signal of the first photo sensing device is measured by the clock signals; and an arithmetic operating circuit for counting the clock signals and calculating the length, moving distance, or velocity of the object on the basis of the count value. With this apparatus, the detecting time of the length or velocity of the moving object can be reduced and the measuring processes can be performed in a real-time manner.
    • 提供了一种激光散斑速度测量装置,包括:将光照射到移动物体的半导体激光器; 第一和第二感光装置,其光接收点沿物体的移动方向以预定距离布置成彼此远离; 时钟信号发生和控制电路,用于确定时钟信号的时钟频率,使得当第二感光装置的感光信号的延迟时间用于时钟信号的延迟时间时,时钟信号的时钟数总是设置为恒定值 第一感光装置的感光信号由时钟信号测量; 以及算术运算电路,用于根据计数值对时钟信号进行计数并计算物体的长度,移动距离或速度。 利用该装置,可以减少移动物体的长度或速度的检测时间,并且可以实时地进行测量处理。
    • 4. 发明授权
    • Method of removing air from liquid channel of liquid filling apparatus
    • 从液体灌装设备的液体通道中除去空气的方法
    • US6164500A
    • 2000-12-26
    • US427040
    • 1999-10-26
    • Kazuo AbeMakoto FukuiHiroshi KitajimaMichio Ueda
    • Kazuo AbeMakoto FukuiHiroshi KitajimaMichio Ueda
    • B65B3/32B67C3/20B67C3/28B67D5/40
    • B67C3/206B67C3/002B67C3/28
    • For use in a liquid filling apparatus having a liquid channel extending from a liquid tank to a filling nozzle via a metering cylinder, an upper check valve disposed upstream from the metering cylinder and a lower check valve disposed downstream from the cylinder, a method of removing air from the interior of the liquid channel comprises the liquid feeding step of closing the lower check valve, opening the upper check valve and feeding the liquid to be filled from the liquid tank to the liquid channel to an upstream side of the lower check valve; the primary air removing step of closing the upper check valve, opening the lower check valve, and causing the liquid to flow from the upstream side of the lower check valve downstream from the lower check valve while allowing air at a downstream side of the lower check valve to flow in between the valves to replace the liquid at the upstream side of the lower check valve with the air at the downstream side of the lower check valve; and the secondary air removing step of closing the lower check valve, opening the upper check valve, causing the air to flow from between the valves to an upstream side of the upper check valve and discharging the air from the interior of the liquid channel through the liquid tank.
    • 用于具有液体通道的液体填充装置,该液体通道经由计量筒从液体罐延伸至填充喷嘴,设置在计量气缸上游的上止回阀和设置在气缸下游的下止回阀, 来自液体通道内部的空气包括关闭下止回阀的液体供给步骤,打开上止回阀并将待填充液体从液体槽输送到液体通道到下止回阀的上游侧; 一次空气除去步骤,关闭上止回阀,打开下止回阀,并使液体从下止回阀的下游侧从下止回阀下游流动,同时允许下检查的下游侧的空气 阀门在阀门之间流动,以下单向阀下游侧的空气更换下止回阀的上游侧的液体; 以及二次空气除去步骤,其关闭下止回阀,打开上止回阀,使空气从阀之间流动到上止回阀的上游侧,并将空气从液体通道的内部排出通过 液罐
    • 6. 发明申请
    • Method of manufacturing semiconductor device
    • 制造半导体器件的方法
    • US20070161197A1
    • 2007-07-12
    • US11640892
    • 2006-12-19
    • Tomoko MatsudaHiroshi Kitajima
    • Tomoko MatsudaHiroshi Kitajima
    • H01L21/336
    • H01L29/665H01L21/28079H01L29/495H01L29/66545H01L29/6659H01L29/66636H01L29/7834
    • A junction leak current of a transistor including a silicide layer provided on a source/drain region is to be suppressed. After forming a gate electrode over a chip-side surface of a silicon substrate, an insulating layer is formed over the gate electrode. The insulating layer is etched back so as to form a sidewall that covers the sidewall of the gate electrode, and a region adjacent to the sidewall on the chip-side surface of the silicon substrate, where a source/drain region is to be formed, is etched so as to form a generally horizontal scraped section on the chip-side surface. Then a dopant is implanted to the silicon substrate around the gate electrode, to thereby form the source/drain region. On the chip-side surface of the silicon substrate where the gate electrode is provided, a Ni layer is formed, so that the Ni layer is reacted with the silicon substrate thus to form a Ni-silicide layer.
    • 要抑制设置在源/漏区上的包含硅化物层的晶体管的结漏电流。 在硅衬底的芯片侧表面上形成栅电极之后,在栅极上形成绝缘层。 蚀刻绝缘层以形成覆盖栅电极的侧壁的侧壁和与要在其上形成源极/漏极区的硅衬底的芯片侧表面上的侧壁相邻的区域, 被蚀刻以在芯片侧表面上形成大致水平的刮削部分。 然后将掺杂剂注入到围绕栅电极的硅衬底中,从而形成源/漏区。 在设置有栅电极的硅衬底的芯片侧表面上形成Ni层,使Ni层与硅衬底反应形成Ni-硅化物层。
    • 9. 发明授权
    • Semiconductor device having improved thin film transistors
    • 具有改进的薄膜晶体管的半导体器件
    • US5309010A
    • 1994-05-03
    • US888806
    • 1992-05-27
    • Hiroshi Kitajima
    • Hiroshi Kitajima
    • H01L21/8244H01L27/11H01L27/12H01L29/78H01L29/786H01L27/01H01L31/0392
    • H01L29/785H01L27/1108H01L27/1211Y10S257/904
    • A semiconductor device comprising a MOS transistor made at the surface of a p-type silicon substrate with a ridge on the surface of it and covered with an insulating film. The gate electrode of the MOS transistor has a configuration of the ridge covered with the insulating film. The semiconductor further comprises a TFT build under the utilization of the ridge. The channel region of the TFT is formed only on the side face(s) of the gate electrode. The source and drain regions extending across the ridge are disposed on the opposite sides of, and connect to, the channel region. Thus the channel region of the TFT is perpendicular to the surface of the silicon substrate, and the channel current flows parallel to the surface of the silicon substrate. The channel width of the TFT is determined substantially by the height of the gate electrode of MOS transistor, and hence becomes narrower than the minimum processible size. This TFT therefore is capable of size reduction. It has further advantages of reduced short channel effect and less leak current particularly when turned off.
    • 一种半导体器件,包括在p型硅衬底的表面上形成有在其表面上具有脊并被绝缘膜覆盖的MOS晶体管。 MOS晶体管的栅电极具有被绝缘膜覆盖的脊的构造。 半导体还包括在脊的利用下的TFT构造。 TFT的沟道区仅形成在栅电极的侧面上。 延伸穿过脊的源极和漏极区域设置在沟道区域的相对侧并且连接到沟道区域。 因此,TFT的沟道区域垂直于硅衬底的表面,并且沟道电流平行于硅衬底的表面流动。 TFT的通道宽度基本上由MOS晶体管的栅电极的高度确定,因此变得比最小可加工尺寸窄。 因此,该TFT能够减小尺寸。 具有减少短通道效应和更少泄漏电流的优点,特别是在关闭时。