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    • 8. 发明授权
    • Reduced voltage field emission cathode and method for manufacturing same
    • 降低电场发射阴极及其制造方法
    • US06409565B1
    • 2002-06-25
    • US09317864
    • 1999-05-25
    • Shigeo ItohJunji ItohSeigo Kanemaru
    • Shigeo ItohJunji ItohSeigo Kanemaru
    • H01J900
    • H01J9/025
    • A field emission cathode capable of emitting electrons under a low voltage. Lead-out electrodes are formed on an insulating layer and openings are formed at a lamination between the insulating layer and each of the lead-out electrodes. Emitters each are arranged in each of the openings. The insulating layer is provided on a lower surface thereof with a photoresist layer modified by heating. The modified photoresist layer is electrically connected through a resistive layer to a cathode electrode. The cathode electrode is formed in a pattern on a cathode substrate made of glass or the like. The emitters each are constituted by a distal end of each of projections of the modified photoresist layer exposed from the insulating layer. The photoresist is modified by heating, resulting in being provided with electrical conductivity and exhibiting stable electron emitting characteristics under a low voltage.
    • 能够在低电压下发射电子的场发射阴极。 引出电极形成在绝缘层上,并且在绝缘层和每个引出电极之间的叠层处形成开口。 发射器各自布置在每个开口中。 绝缘层在其下表面上设置有通过加热改性的光致抗蚀剂层。 改性光致抗蚀剂层通过电阻层电连接到阴极电极。 在由玻璃等制成的阴极基板上形成阴极电极。 发射体各自由从绝缘层露出的改性光致抗蚀剂层的每个突起的远端构成。 通过加热改性光致抗蚀剂,从而提供导电性并在低电压下表现出稳定的电子发射特性。
    • 9. 发明授权
    • Field emission device
    • 场发射装置
    • US5847408A
    • 1998-12-08
    • US824016
    • 1997-03-21
    • Seigo KanemaruJunji Itoh
    • Seigo KanemaruJunji Itoh
    • H01J3/02H01L29/06
    • H01J3/022H01J2201/319
    • A field emission device of simple structure enables stabilization and control of field emission current. Emission current is controlled by a plurality of control voltage systems. An emitter having a sharp tip is fabricated by processing a p-type semiconductor substrate, and an n-type source region is provided on the p-type semiconductor substrate surface at a position that is laterally separated from the emitter. An electrode layer having an aperture facing the apex portion of the emitter is provided on an insulating layer, the electrode layer extending to above the n-type source region. Voltage applied to the electrode layer to apply an extractor field to the apex portion of the emitter and to induce inversion layers at the emitter surface and the surface of the p-type semiconductor substrate. The electrode layer is divided into a plurality of electrodes. An extraction voltage is applied to one of these electrodes closest to the emitter, another electrode is connected to an X selection line and another to a Y selection line, thereby controlling emission current.
    • 具有简单结构的场致发射器件可实现场发射电流的稳定和控制。 发射电流由多个控制电压系统控制。 通过处理p型半导体衬底制造具有尖锐尖端的发射极,并且在与发射极横向分离的位置处在p型半导体衬底表面上设置n型源极区。 具有面向发射极顶点的孔的电极层设置在绝缘层上,电极层延伸到n型源极区域的上方。 电压施加到电极层,以将提取器场施加到发射极的顶点,并在p型半导体衬底的发射极表面和表面处诱导反转层。 电极层被分成多个电极。 将提取电压施加到最靠近发射极的这些电极之一,另一个电极连接到X选择线,而另一个电极连接到Y选择线,从而控制发射电流。
    • 10. 发明授权
    • Cold electron emitting device and method of manufacturing same
    • 冷电子发射器件及其制造方法
    • US5780318A
    • 1998-07-14
    • US701866
    • 1996-08-23
    • Takayuki HiranoJunji ItohSeigo Kanemaru
    • Takayuki HiranoJunji ItohSeigo Kanemaru
    • H01J1/30H01J1/304H01J9/02H01L21/28H01L29/06
    • H01J1/3042H01J9/025
    • A cold electron emitting device has an emitter base portion, an emitter projection portion and a source region, each of which is an n-type semiconductor, formed on a p-type silicon substrate. A metal film which serves as an extraction electrode and a gate electrode of FET is formed via an insulating layer on the region of the substrate which includes the peripheral regions of the emitter base portion and source region. This cold electron emitting device can be manufactured as follows. First, a conical emitter having an emitter projection portion and emitter base portion and a source region are formed on a p-type semiconductor substrate. Next, an insulating layer and a metal film, which becomes an extraction electrode and a gate electrode of FET, is formed on the substrate which includes peripheral regions of the emitter base portion and source region. Then, an n-type impurity is doped in the emitter and the source region to form an n-type emitter and an n-type source region. In this manner, it is possible to manufacture a cold electron emitting device, which has an excellent work precision for the sharp tip of the emitter projection portion and an excellent uniform structure and can stably emit a current.
    • 冷电子发射器件具有形成在p型硅衬底上的发射极基极部分,发射极突出部分和源极区域,每个都是n型半导体。 用作引出电极的金属膜和FET的栅极通过绝缘层在基板的包含发射极基部和源极区的外围区域的区域上形成。 该冷电子发射器件可以如下制造。 首先,在p型半导体基板上形成具有发射极投射部和发射极基部以及源极区的锥形发射体。 接下来,在包括发射极基部和源极区的周边区域的基板上形成作为FET的引出电极和栅电极的绝缘层和金属膜。 然后,在发射极和源极区域中掺杂n型杂质以形成n型发射极和n型源极区。 以这种方式,可以制造对于发射极突起部分的尖锐尖端具有优异的加工精度并且具有优异的均匀结构并且可以稳定地发射电流的冷电子发射器件。