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    • 6. 发明申请
    • MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
    • 半导体器件和半导体器件的制造方法
    • US20070026600A1
    • 2007-02-01
    • US11381654
    • 2006-05-04
    • Shigeki Komori
    • Shigeki Komori
    • H01L21/8238H01L21/3205H01L21/4763
    • H01L21/823814H01L21/28097H01L21/28518H01L21/823835H01L21/82385H01L29/4975H01L29/66545H01L29/6659H01L29/7833
    • The technology which can improve the performance of a MOS transistor in which all the regions of the gate electrode were silicided is offered. A gate insulating film and a gate electrode of an nMOS transistor are laminated and formed in this order on a semiconductor substrate. A source/drain region of the nMOS transistor is formed in the upper surface of the semiconductor substrate. The source/drain region is silicided after siliciding all the regions of the gate electrode. Thus, silicide does not cohere in the source/drain region by the heat treatment at the silicidation of the gate electrode by siliciding the source/drain region after the silicidation of the gate electrode. Therefore, the electric resistance of the source/drain region is reduced and junction leak can be reduced. As a result, the performance of the nMOS transistor improves.
    • 提供了可以提高栅电极的所有区域被硅化的MOS晶体管的性能的技术。 将nMOS晶体管的栅极绝缘膜和栅电极依次层叠并形成在半导体基板上。 nMOS晶体管的源极/漏极区域形成在半导体衬底的上表面中。 在硅化栅电极的所有区域之后,源极/漏极区域被硅化。 因此,通过在栅极电极的硅化后硅化硅化源极/漏极区域,通过在栅电极的硅化处理进行热处理,硅化物不会在源极/漏极区域内固定。 因此,源极/漏极区域的电阻减小,结点泄漏可以减小。 结果,提高了nMOS晶体管的性能。