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1. 发明申请

US20050259858A1 Money checking apparatus 审中-公开
标题翻译：货币检查装置
公开(公告)号：US20050259858A1
公开(公告)日：2005-11-24
申请号：US10851109
申请日：2004-05-24
申请人： Sheng-Pin Su , Chun-Kun Yu , Daniel Jih Wu
发明人： Sheng-Pin Su , Chun-Kun Yu , Daniel Jih Wu
IPC分类号： G06K9/00 , G07D7/00 , G07D7/12
CPC分类号： G07D7/12 , G07D7/121 , G07D7/128
摘要： A money checking apparatus has a U-shaped with having a cavity with a receiving space for receiving an object to be tested, an LCD monitor arranged atop the cavity for viewing a status of the object, and a first switch and a second switch being placed beside the receiving space and operated to turn on/off at least one infrared lamp and ultraviolet lamp. A CMOS sensor is arranged on an inner face beside the cavity and connected to the second switch and the LCD monitor, the CMOS sensor fetching the image reflected from the optical object and displaying the image on the LCD monitor. A processor is arranged in the base and connected to a power supply, the receiver, the first switch and the second switch. The money checking apparatus can be used to examine US dollars, euro bills, Chinese RMB bills and credit cards.
摘要翻译：货币检查装置具有U形，具有具有用于接收待测试物体的接收空间的空腔，布置在空腔顶部以观察物体的状态的LCD监视器，以及放置第一开关和第二开关在接收空间旁边，操作至少打开一个红外灯和紫外线灯。 CMOS传感器布置在腔体旁边的内表面，并连接到第二开关和LCD监视器，CMOS传感器从光学对象上取出反射的图像，并将图像显示在LCD监视器上。处理器布置在基座中并连接到电源，接收器，第一开关和第二开关。货币检查机构可用于检查美元，欧元，中国人民币账单和信用卡。

2. 发明申请

US20050258523A1 Heat dissipation module for an electronic device 审中-公开
标题翻译：电子设备散热模块
公开(公告)号：US20050258523A1
公开(公告)日：2005-11-24
申请号：US10846498
申请日：2004-05-17
申请人： Sheng-Pin Su , Chun-Kun Yu
发明人： Sheng-Pin Su , Chun-Kun Yu
IPC分类号： H01L23/495 , H05K7/20
CPC分类号： H05K7/20918 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation module is used for a high-power semiconductor laser device with an operation current below 2 amperes and has a housing, a plurality of air holes in side panels of the housing, an air outlet on a rear panel of the housing, and a heat dissipation module in the housing. The heat dissipation module has a heat-dissipating plate and a base placed beside the heat-dissipating plate. The base has a plurality of holes corresponding to a current controller, the current controller is arranged on one face of the heat-dissipating plate and near the air outlet, and the current controller has pins connected to holes on the base through insulating unit and wire. Therefore, the high-power semiconductor laser device can be operated at a stable temperature.
摘要翻译：散热模块用于工作电流低于2安培的大功率半导体激光器件，并具有壳体，壳体侧面板上的多个气孔，壳体后面板上的出风口，以及壳体中的散热模块。散热模块具有散热板和放置在散热板旁边的基座。基座具有对应于电流控制器的多个孔，电流控制器布置在散热板的一个面上且靠近出风口处，并且电流控制器具有通过绝缘单元和线连接到基座上的孔的销。因此，高功率半导体激光器件可以在稳定的温度下工作。

3. 发明申请

US20050254211A1 Heat dissipation module for electronic device 审中-公开
标题翻译：电子设备散热模块
公开(公告)号：US20050254211A1
公开(公告)日：2005-11-17
申请号：US10846499
申请日：2004-05-17
申请人： Sheng-Pin Su , Chun-Kun Yu
发明人： Sheng-Pin Su , Chun-Kun Yu
IPC分类号： H05K7/20
CPC分类号： H05K7/209
摘要： A heat dissipation module is used for high-power semiconductor laser device with operation current below 3.5 amperes and has a housing with a plurality of air holes in side panels of the housing, an air outlet on a rear panel of the housing and a heat dissipation module in the housing. The heat dissipation module has a heat-dissipating plate and a base placed beside the heat-dissipating plate, the base has a plurality of holes corresponding to at least one current controller, the current controller is arranged on one face of the heat-dissipating plate and near the air outlet, and the current controller has pins connected to holes on the base through insulating unit and wire. Therefore, the high-power semiconductor laser device can be operated at a stable temperature.
摘要翻译：散热模块用于工作电流低于3.5安培的大功率半导体激光器件，并具有外壳，壳体侧面板上有多个气孔，壳体后面板上的出风口和散热模块在房屋。散热模块具有散热板和放置在散热板旁边的基座，基座具有与至少一个电流控制器对应的多个孔，电流控制器设置在散热板的一个面上并且在出风口附近，电流控制器具有通过绝缘单元和电线连接到基座上的孔的销。因此，高功率半导体激光器件可以在稳定的温度下工作。

4. 发明申请

US20050252228A1 Vacuum laser constant temperature device 失效
标题翻译：真空激光恒温装置
公开(公告)号：US20050252228A1
公开(公告)日：2005-11-17
申请号：US10846501
申请日：2004-05-17
申请人： Sheng-Pin Su , Chun-Kun Yu
发明人： Sheng-Pin Su , Chun-Kun Yu
IPC分类号： F25B21/02 , F25D23/12 , H01S5/022 , H01S5/024 , H01S5/0683
CPC分类号： H01S5/02 , F25B21/02 , F25B2321/0251 , H01S5/02407 , H01S5/02415 , H01S5/06837
摘要： A vacuum laser constant temperature device is adopted for a housing that has a heat dissipation module arranged therein. The device has a metallic partition adjacent to the heat dissipation module to enclose a airtight vacancy formed with the housing, a thermoelectric cooling chip with a heating portion connecting to a side of the metallic partition and a cooling portion, a semiconductor laser lighting module arranged in the airtight vacancy and connecting to the cooling portion of the thermoelectric cooling chip, and a heat insulation layer arranged both on an opposite side of the metallic partition and in the airtight vacancy. Heat generated by the semiconductor laser lighting module can be transferred to the heat dissipation module via the thermoelectric cooling chip and the metallic partition. The thermoelectric cooling chip makes an output power of the semiconductor laser lighting module keep constant within various environments without the condensation thereon.
摘要翻译：在其中布置有散热模块的壳体中采用真空激光恒温装置。该装置具有与散热模块相邻的金属隔板，以封闭与壳体形成的气密空位;热电冷却芯片，具有连接到金属隔板侧面的加热部分和冷却部分;半导体激光照明模块，密封空间并连接到热电冷却芯片的冷却部分，以及隔热层，其布置在金属隔板的相对侧并且处于气密空缺中。半导体激光照明模块产生的热量可以通过热电冷却芯片和金属隔板传递到散热模块。热电冷却芯片使得半导体激光照明模块的输出功率在各种环境中保持恒定，而不会在其上冷凝。

5. 发明申请

US20050254212A1 Heat dissipation module for electronic device 审中-公开
标题翻译：电子设备散热模块
公开(公告)号：US20050254212A1
公开(公告)日：2005-11-17
申请号：US10846500
申请日：2004-05-17
申请人： Sheng-Pin Su , Chun-Kun Yu
发明人： Sheng-Pin Su , Chun-Kun Yu
IPC分类号： H05K7/20
CPC分类号： H05K7/20918
摘要： A heat dissipation module is used for a high-power semiconductor laser device with an operation current below 8 amperes. The heat dissipation module has a housing, a plurality of air holes on in panels of the housing, an air outlet in a rear panel of the housing, a heat dissipation module in the housing, the heat dissipation module having a heat-dissipating plate and a base placed beside the heat-dissipating plate, the base having a plurality of holes corresponding to at least one high-power element, the high-power element being arranged on one face of the heat-dissipating plate and near the air outlet, and the high-power element having pins connected to holes on the base through insulating unit and wire. Therefore, the high-power semiconductor laser device can be operated at a stable temperature.
摘要翻译：散热模块用于工作电流低于8安培的大功率半导体激光器件。所述散热模块具有壳体，所述壳体的面板中的多个气孔，所述壳体的后面板中的空气出口，所述壳体中的散热模块，所述散热模块具有散热板和位于所述散热板旁边的基座，所述基座具有与至少一个高功率元件相对应的多个孔，所述高功率元件布置在所述散热板的一个面上且靠近所述出风口，以及高功率元件具有通过绝缘单元和线连接到基座上的孔的销。因此，高功率半导体激光器件可以在稳定的温度下工作。

6. 发明授权

US07047757B2 Vacuum laser constant temperature device 失效
标题翻译：真空激光恒温装置
公开(公告)号：US07047757B2
公开(公告)日：2006-05-23
申请号：US10846501
申请日：2004-05-17
申请人： Sheng-Pin Su , Chun-Kun Yu
发明人： Sheng-Pin Su , Chun-Kun Yu
IPC分类号： F25D23/12 , F25B21/02 , H01S3/04
CPC分类号： H01S5/02 , F25B21/02 , F25B2321/0251 , H01S5/02407 , H01S5/02415 , H01S5/06837
摘要： A vacuum laser constant temperature device is adopted for a housing that has a heat dissipation module arranged therein. The device has a metallic partition adjacent to the heat dissipation module to enclose a airtight vacancy formed with the housing, a thermoelectric cooling chip with a heating portion connecting to a side of the metallic partition and a cooling portion, a semiconductor laser lighting module arranged in the airtight vacancy and connecting to the cooling portion of the thermoelectric cooling chip, and a heat insulation layer arranged both on an opposite side of the metallic partition and in the airtight vacancy. Heat generated by the semiconductor laser lighting module can be transferred to the heat dissipation module via the thermoelectric cooling chip and the metallic partition. The thermoelectric cooling chip makes an output power of the semiconductor laser lighting module keep constant within various environments without the condensation thereon.
摘要翻译：在其中布置有散热模块的壳体中采用真空激光恒温装置。该装置具有与散热模块相邻的金属隔板，以封闭与壳体形成的气密空位;热电冷却芯片，具有连接到金属隔板侧面的加热部分和冷却部分;半导体激光照明模块，密封空间并连接到热电冷却芯片的冷却部分，以及隔热层，其布置在金属隔板的相对侧并且处于气密空缺中。半导体激光照明模块产生的热量可以通过热电冷却芯片和金属隔板传递到散热模块。热电冷却芯片使得半导体激光照明模块的输出功率在各种环境中保持恒定，而不会在其上冷凝。

7. 发明申请

US20050254537A1 High power semiconductor laser lighting device 审中-公开
标题翻译：大功率半导体激光照明装置
公开(公告)号：US20050254537A1
公开(公告)日：2005-11-17
申请号：US10846525
申请日：2004-05-17
申请人： Sheng-Pin Su , Chun-Kun Yu , Daniel Wu
发明人： Sheng-Pin Su , Chun-Kun Yu , Daniel Wu
IPC分类号： H01S3/04 , H01S5/022 , H01S5/024
CPC分类号： H01S5/02415 , H01S5/02 , H01S5/02407 , H01S5/06837
摘要： A high power semiconductor laser lighting device has a housing, a fan module arranged in an exhaust hole in the housing, a base connected to the bottom wall of the housing and disposed on a side of the fan module, and a semiconductor laser constant-temperature module. The base has a driving unit with at least one high power electronic component connected to fins of the fan module. The semiconductor laser constant-temperature module has a metallic partition to enclose a vacuum formed in a front portion of the housing, and a heat insulation layer arranged in the vacuum. The metallic partition has a side connecting the heat dissipation plate and an opposite side connecting a heating portion of a thermoelectric cooling chip, which includes a cooling portion connecting to a semiconductor laser lighting module. The high power semiconductor laser lighting device to keep an output power thereof constant within various environments.
摘要翻译：大功率半导体激光照明装置具有壳体，布置在壳体中的排气孔中的风扇模块，连接到壳体的底壁并设置在风扇模块的一侧的基座，以及半导体激光器恒温模块。基座具有驱动单元，其具有连接到风扇模块的翅片的至少一个高功率电子部件。半导体激光恒温模块具有用于封闭形成在壳体的前部中的真空的金属分隔件和布置在真空中的绝热层。金属隔板具有连接散热板和连接热电冷却芯片的加热部分的相对侧，该热电冷却芯片包括连接到半导体激光照明模块的冷却部分。大功率半导体激光照明装置，其输出功率在各种环境中保持恒定。

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