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1. 发明授权

US09944554B2 Perforated mother sheet for partial edge chemical strengthening and method therefor 有权
公开(公告)号：US09944554B2
公开(公告)日：2018-04-17
申请号：US13233978
申请日：2011-09-15
申请人： Seung Jae Hong , Casey J. Feinstein , Lili Huang , Sunggu Kang , Kuo-Hua Sung , John Z. Zhong
发明人： Seung Jae Hong , Casey J. Feinstein , Lili Huang , Sunggu Kang , Kuo-Hua Sung , John Z. Zhong
IPC分类号： H05K1/03 , C03C21/00
CPC分类号： C03C21/002 , C03C17/002 , Y10T29/49124
摘要： Methods for chemically strengthening the edges of glass sheets are provided. Voids can be formed in a mother sheet. The edges of these voids may correspond to a portion of the new edges that would normally be created during separation and free shaping of the mother sheet. The mother sheet can then be immersed in a chemical strengthener. The edges of the voids can be chemically strengthened in addition to the front and back sides of the mother sheet. After thin film processing and separation, each of the resulting individual sheets has been chemically strengthened on both sides and on a portion of its edges.

2. 发明申请

US20110030209A1 METHOD FOR FABRICATING THIN TOUCH SENSOR PANELS 审中-公开
标题翻译：制造薄触感传感器面板的方法
公开(公告)号：US20110030209A1
公开(公告)日：2011-02-10
申请号：US12908763
申请日：2010-10-20
申请人： Shih Chang CHANG , John Z. Zhong , Lili Huang , Seung Jae Hong , Lynn Youngs
发明人： Shih Chang CHANG , John Z. Zhong , Lili Huang , Seung Jae Hong , Lynn Youngs
IPC分类号： H05K3/10
CPC分类号： G06F3/0416 , G06F3/044 , H05K1/0306 , H05K3/0097 , H05K2201/0317 , H05K2201/0326 , H05K2203/1536 , Y10T29/49126 , Y10T29/49128 , Y10T29/49147 , Y10T29/49155 , Y10T29/49156
摘要： A method for fabricating thin DITO or SITO touch sensor panels with a thickness less than a minimum thickness tolerance of existing manufacturing equipment. In one embodiment, a sandwich of two thin glass sheets is formed such that the combined thickness of the glass sheets does not drop below the minimum thickness tolerance of existing manufacturing equipment when thin film process is performed on the surfaces of the sandwich during fabrication. The sandwich may eventually be separated to form two thin SITO/DITO panels. In another embodiment, the fabrication process involves laminating two patterned thick substrates, each having at least the minimum thickness tolerance of existing manufacturing equipment. One or both of the sides of the laminated substrates are then thinned so that when the substrates are separated, each is a thin DITO/SITO panel having a thickness less than the minimum thickness tolerance of existing manufacturing equipment.
摘要翻译：用于制造厚度小于现有制造设备的最小厚度公差的薄DITO或SITO触摸传感器面板的方法。在一个实施例中，形成两个薄玻璃板的夹层，使得当在制造期间在夹层的表面上执行薄膜处理时，玻璃板的组合厚度不会下降到现有制造设备的最小厚度公差之下。三明治可能最终分开形成两个薄的SITO / DITO面板。在另一个实施例中，制造工艺包括层压两个图案化的厚基板，每个基板至少具有现有制造设备的最小厚度公差。然后层压基板的一个或两个侧面变薄，使得当基板分离时，每个是具有小于现有制造设备的最小厚度公差的厚度的薄DITO / SITO面板。

3. 发明授权

US08603574B2 Curved touch sensor 有权
标题翻译：弯曲触摸传感器
公开(公告)号：US08603574B2
公开(公告)日：2013-12-10
申请号：US12940544
申请日：2010-11-05
申请人： Lili Huang , Seung Jae Hong , John Z. Zhong
发明人： Lili Huang , Seung Jae Hong , John Z. Zhong
IPC分类号： H05K3/00
CPC分类号： G06F3/044 , G06F2203/04103 , H05K1/028 , H05K3/0014 , H05K2201/057
摘要： A method of forming a curved touch surface is disclosed. The method can include depositing and patterning a conductive thin film on a flexible substrate to form at least one touch sensor pattern, while the flexible substrate is in a flat state. According to certain embodiments, the method can include supporting the flexible substrate in the flat state on at least one curved forming substrate having a predetermined curvature; and performing an anneal process, or an anneal-like high-heat process, on the conductive thin film, wherein the anneal process can cause the flexible substrate to conform to the predetermined curvature of the at least one curved forming substrate. According to an embodiment, the curved forming substrate can include a first forming substrate having a first predetermined curvature and a second forming substrate having a second predetermined curvature complementing the first predetermined curvature.
摘要翻译：公开了一种形成弯曲的触摸表面的方法。该方法可以包括在柔性基板上沉积和图案化导电薄膜以形成至少一个触摸传感器图案，同时柔性基板处于平坦状态。根据某些实施例，该方法可以包括在至少一个具有预定曲率的弯曲成形衬底上支撑处于平坦状态的柔性衬底; 以及对所述导电薄膜进行退火处理或类似于退火的高热处理，其中所述退火工艺可使所述柔性衬底符合所述至少一个弯曲成形衬底的预定曲率。根据实施例，弯曲成形基板可以包括具有第一预定曲率的第一成形基板和具有补充第一预定曲率的第二预定曲率的第二成形基板。

4. 发明申请

US20110298730A1 Thin Sheet Glass Processing 有权
标题翻译：薄板玻璃加工
公开(公告)号：US20110298730A1
公开(公告)日：2011-12-08
申请号：US12895825
申请日：2010-09-30
申请人： Seung Jae Hong , Lili Huang , John Z. Zhong
发明人： Seung Jae Hong , Lili Huang , John Z. Zhong
IPC分类号： G06F3/041 , G03B27/32 , H01H11/00
CPC分类号： G03B27/32 , G06F3/044 , Y10T29/49105
摘要： Improved techniques are disclosed for fabrication of touch panels using thin sheet glass. Thin touch sensor panels each having a thickness of substantially less than approximately one-half millimeter can be produced. A thin mother glass sheet having a thickness of substantially less then approximately one half millimeter can be used. A thin film can be coupled to a surface of the thin mother glass sheet, and the thin film can be photolithographically patterned, while avoiding breakage of the thin mother glass sheet. The thin mother glass sheet can be singulated into the thin touch sensor panels.
摘要翻译：公开了使用薄板玻璃制造触摸面板的改进技术。可以制造各自具有基本上小于大约半毫米的厚度的薄触摸传感器面板。可以使用具有基本上小于约半毫米的厚度的薄母玻璃板。薄膜可以耦合到薄母玻璃板的表面，并且薄膜可以被光刻图案化，同时避免薄母玻璃板的断裂。薄的母玻璃板可以分成薄的触摸传感器面板。

5. 发明授权

US07918019B2 Method for fabricating thin touch sensor panels 有权
标题翻译：薄触摸传感器面板的制造方法
公开(公告)号：US07918019B2
公开(公告)日：2011-04-05
申请号：US12351767
申请日：2009-01-09
申请人： Shih Chang Chang , John Z. Zhong , Lili Huang , Seung Jae Hong , Lynn Youngs
发明人： Shih Chang Chang , John Z. Zhong , Lili Huang , Seung Jae Hong , Lynn Youngs
IPC分类号： H05K3/10
CPC分类号： G06F3/0416 , G06F3/044 , H05K1/0306 , H05K3/0097 , H05K2201/0317 , H05K2201/0326 , H05K2203/1536 , Y10T29/49126 , Y10T29/49128 , Y10T29/49147 , Y10T29/49155 , Y10T29/49156
摘要： A method for fabricating thin DITO or SITO touch sensor panels with a thickness less than a minimum thickness tolerance of existing manufacturing equipment. In one embodiment, a sandwich of two thin glass sheets is formed such that the combined thickness of the glass sheets does not drop below the minimum thickness tolerance of existing manufacturing equipment when thin film process is performed on the surfaces of the sandwich during fabrication. The sandwich may eventually be separated to form two thin SITO/DITO panels. In another embodiment, the fabrication process involves laminating two patterned thick substrates, each having at least the minimum thickness tolerance of existing manufacturing equipment. One or both of the sides of the laminated substrates are then thinned so that when the substrates are separated, each is a thin DITO/SITO panel having a thickness less than the minimum thickness tolerance of existing manufacturing equipment.
摘要翻译：用于制造厚度小于现有制造设备的最小厚度公差的薄DITO或SITO触摸传感器面板的方法。在一个实施例中，形成两个薄玻璃板的夹层，使得当在制造期间在夹层的表面上执行薄膜处理时，玻璃板的组合厚度不会下降到现有制造设备的最小厚度公差之下。三明治可能最终分开形成两个薄的SITO / DITO面板。在另一个实施例中，制造工艺包括层压两个图案化的厚基板，每个基板至少具有现有制造设备的最小厚度公差。然后层压基板的一个或两个侧面变薄，使得当基板分离时，每个是具有小于现有制造设备的最小厚度公差的厚度的薄DITO / SITO面板。

6. 发明申请

US20100175249A1 Method for Fabricating Thin Touch Sensor Panels 有权
标题翻译：制造薄型触摸传感器面板的方法
公开(公告)号：US20100175249A1
公开(公告)日：2010-07-15
申请号：US12351767
申请日：2009-01-09
申请人： Shih Chang CHANG , John Z. Zhong , Lili Huang , Seung Jae Hong , Lynn Youngs
发明人： Shih Chang CHANG , John Z. Zhong , Lili Huang , Seung Jae Hong , Lynn Youngs
IPC分类号： H05K3/10
CPC分类号： G06F3/0416 , G06F3/044 , H05K1/0306 , H05K3/0097 , H05K2201/0317 , H05K2201/0326 , H05K2203/1536 , Y10T29/49126 , Y10T29/49128 , Y10T29/49147 , Y10T29/49155 , Y10T29/49156
摘要： A method for fabricating thin DITO or SITO touch sensor panels with a thickness less than a minimum thickness tolerance of existing manufacturing equipment. In one embodiment, a sandwich of two thin glass sheets is formed such that the combined thickness of the glass sheets does not drop below the minimum thickness tolerance of existing manufacturing equipment when thin film process is performed on the surfaces of the sandwich during fabrication. The sandwich may eventually be separated to form two thin SITO/DITO panels. In another embodiment, the fabrication process involves laminating two patterned thick substrates, each having at least the minimum thickness tolerance of existing manufacturing equipment. One or both of the sides of the laminated substrates are then thinned so that when the substrates are separated, each is a thin DITO/SITO panel having a thickness less than the minimum thickness tolerance of existing manufacturing equipment.
摘要翻译：用于制造厚度小于现有制造设备的最小厚度公差的薄DITO或SITO触摸传感器面板的方法。在一个实施例中，形成两个薄玻璃板的夹层，使得当在制造期间在夹层的表面上执行薄膜处理时，玻璃板的组合厚度不会下降到现有制造设备的最小厚度公差之下。三明治可能最终分开形成两个薄的SITO / DITO面板。在另一个实施例中，制造工艺包括层压两个图案化的厚基板，每个基板至少具有现有制造设备的最小厚度公差。然后层压基板的一个或两个侧面变薄，使得当基板分离时，每个是具有小于现有制造设备的最小厚度公差的厚度的薄DITO / SITO面板。

7. 发明授权

US09207528B2 Thin sheet glass processing 有权
标题翻译：薄板玻璃加工
公开(公告)号：US09207528B2
公开(公告)日：2015-12-08
申请号：US12895825
申请日：2010-09-30
申请人： Seung Jae Hong , Lili Huang , John Z. Zhong
发明人： Seung Jae Hong , Lili Huang , John Z. Zhong
IPC分类号： G03B27/32 , G06F3/044
CPC分类号： G03B27/32 , G06F3/044 , Y10T29/49105
摘要： Improved techniques are disclosed for fabrication of touch panels using thin sheet glass. Thin touch sensor panels each having a thickness of substantially less than approximately one-half millimeter can be produced. A thin mother glass sheet having a thickness of substantially less then approximately one half millimeter can be used. A thin film can be coupled to a surface of the thin mother glass sheet, and the thin film can be photolithographically patterned, while avoiding breakage of the thin mother glass sheet. The thin mother glass sheet can be singulated into the thin touch sensor panels.
摘要翻译：公开了使用薄板玻璃制造触摸面板的改进技术。可以制造各自具有基本上小于大约半毫米的厚度的薄触摸传感器面板。可以使用具有基本上小于约半毫米的厚度的薄母玻璃板。薄膜可以耦合到薄母玻璃板的表面，并且薄膜可以被光刻图案化，同时避免薄母玻璃板的断裂。薄的母玻璃板可以分成薄的触摸传感器面板。

8. 发明授权

US08997339B2 Method for fabricating thin touch sensor panels 有权
标题翻译：薄触摸传感器面板的制造方法
公开(公告)号：US08997339B2
公开(公告)日：2015-04-07
申请号：US12908763
申请日：2010-10-20
申请人： Shih Chang Chang , John Z. Zhong , Lili Huang , Seung Jae Hong , Lynn Youngs
发明人： Shih Chang Chang , John Z. Zhong , Lili Huang , Seung Jae Hong , Lynn Youngs
IPC分类号： H05K3/02 , G06F3/041 , G06F3/044 , H05K3/00 , H05K1/03
CPC分类号： G06F3/0416 , G06F3/044 , H05K1/0306 , H05K3/0097 , H05K2201/0317 , H05K2201/0326 , H05K2203/1536 , Y10T29/49126 , Y10T29/49128 , Y10T29/49147 , Y10T29/49155 , Y10T29/49156
摘要： A method for fabricating thin DITO or SITO touch sensor panels with a thickness less than a minimum thickness tolerance of existing manufacturing equipment. In one embodiment, a sandwich of two thin glass sheets is formed such that the combined thickness of the glass sheets does not drop below the minimum thickness tolerance of existing manufacturing equipment when thin film process is performed on the surfaces of the sandwich during fabrication. The sandwich may eventually be separated to form two thin SITO/DITO panels. In another embodiment, the fabrication process involves laminating two patterned thick substrates, each having at least the minimum thickness tolerance of existing manufacturing equipment. One or both of the sides of the laminated substrates are then thinned so that when the substrates are separated, each is a thin DITO/SITO panel having a thickness less than the minimum thickness tolerance of existing manufacturing equipment.
摘要翻译：用于制造厚度小于现有制造设备的最小厚度公差的薄DITO或SITO触摸传感器面板的方法。在一个实施例中，形成两个薄玻璃板的夹层，使得当在制造期间在夹层的表面上执行薄膜处理时，玻璃板的组合厚度不会下降到现有制造设备的最小厚度公差之下。三明治可能最终分开形成两个薄的SITO / DITO面板。在另一个实施例中，制造工艺包括层压两个图案化的厚基板，每个基板至少具有现有制造设备的最小厚度公差。然后层压基板的一个或两个侧面变薄，使得当基板分离时，每个是具有小于现有制造设备的最小厚度公差的厚度的薄DITO / SITO面板。

9. 发明申请

US20130068505A1 PERFORATED MOTHER SHEET FOR PARTIAL EDGE CHEMICAL STRENGTHENING 有权
标题翻译：执行部分边缘化学加固的主板
公开(公告)号：US20130068505A1
公开(公告)日：2013-03-21
申请号：US13233978
申请日：2011-09-15
申请人： Seung Jae Hong , Casey J. Feinstein , Lili Huang , Sunggu Kang , Kuo-Hua Sung , John Z. Zhong
发明人： Seung Jae Hong , Casey J. Feinstein , Lili Huang , Sunggu Kang , Kuo-Hua Sung , John Z. Zhong
IPC分类号： H05K1/00 , B05D3/00 , H05K3/00 , B05D5/12
CPC分类号： C03C21/002 , C03C17/002 , Y10T29/49124
摘要： Methods for chemically strengthening the edges of glass sheets are provided. Voids can be formed in a mother sheet. The edges of these voids may correspond to a portion of the new edges that would normally be created during separation and free shaping of the mother sheet. The mother sheet can then be immersed in a chemical strengthener. The edges of the voids can be chemically strengthened in addition to the front and back sides of the mother sheet. After thin film processing and separation, each of the resulting individual sheets has been chemically strengthened on both sides and on a portion of its edges.
摘要翻译：提供了化学强化玻璃边缘的方法。可以在母片中形成空隙。这些空隙的边缘可以对应于通常在分离期间产生的新边缘的一部分，并且母板的自由成形。然后将母片浸入化学加强剂中。除了母板的正面和背面之外，空隙的边缘可以被化学强化。在薄膜加工和分离之后，每个所得到的各个片材在两侧和其一部分边缘上已被化学强化。

10. 发明申请

US20120111491A1 CURVED TOUCH SENSOR 有权
标题翻译：弯曲触摸传感器
公开(公告)号：US20120111491A1
公开(公告)日：2012-05-10
申请号：US12940544
申请日：2010-11-05
申请人： Lili HUANG , Seung Jae Hong , John Z. Zhong
发明人： Lili HUANG , Seung Jae Hong , John Z. Zhong
IPC分类号： H05K3/00
CPC分类号： G06F3/044 , G06F2203/04103 , H05K1/028 , H05K3/0014 , H05K2201/057
摘要： A method of forming a curved touch surface is disclosed. The method can include depositing and patterning a conductive thin film on a flexible substrate to form at least one touch sensor pattern, while the flexible substrate is in a flat state. According to certain embodiments, the method can include supporting the flexible substrate in the flat state on at least one curved forming substrate having a predetermined curvature; and performing an anneal process, or an anneal-like high-heat process, on the conductive thin film, wherein the anneal process can cause the flexible substrate to conform to the predetermined curvature of the at least one curved forming substrate. According to an embodiment, the curved forming substrate can include a first forming substrate having a first predetermined curvature and a second forming substrate having a second predetermined curvature complementing the first predetermined curvature.
摘要翻译：公开了一种形成弯曲的触摸表面的方法。该方法可以包括在柔性基板上沉积和图案化导电薄膜以形成至少一个触摸传感器图案，同时柔性基板处于平坦状态。根据某些实施例，该方法可以包括在至少一个具有预定曲率的弯曲成形衬底上支撑处于平坦状态的柔性衬底; 以及对所述导电薄膜进行退火处理或类似于退火的高热处理，其中所述退火工艺可使所述柔性衬底符合所述至少一个弯曲成形衬底的预定曲率。根据实施例，弯曲成形基板可以包括具有第一预定曲率的第一成形基板和具有补充第一预定曲率的第二预定曲率的第二成形基板。

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