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    • 6. 发明授权
    • Method for fabricating semiconductor device
    • 制造半导体器件的方法
    • US06709939B2
    • 2004-03-23
    • US10409964
    • 2003-04-09
    • Hi Deok LeeSeong Hyung Park
    • Hi Deok LeeSeong Hyung Park
    • H01L21336
    • H01L29/6659H01L29/665H01L29/7833
    • A method for fabricating a semiconductor device is disclosed. In a high speed device structure consisting of a salicide, in order to fabricate a device having at least two gate oxide structures in the identical chip, an LDD region of a core device region is formed, and an ion implant process for forming the LDD region of an input/output device region having a thick gate oxide and a process for forming a source/drain region at the rim of a field oxide of the core device region having a thin gate oxide are performed at the same time, thereby increasing a depth of a junction region. Thus, the junction leakage current is decreased in the junction region of the peripheral circuit region, and the process is simplified. As a result, a process yield and reliability of the device are improved.
    • 公开了一种制造半导体器件的方法。 在由自对准硅化物组成的高速装置结构中,为了制造在同一芯片中具有至少两个栅极氧化物结构的器件,形成芯部器件区域的LDD区域,形成LDD区域的离子注入工艺 具有厚栅极氧化物的输入/输出器件区域和用于在具有薄栅极氧化物的芯器件区域的场氧化物的边缘处形成源极/漏极区域的工艺同时进行,从而增加深度 的连接区域。 因此,在外围电路区域的结区域中结漏电流减小,并且处理简化。 结果,改善了设备的工艺成品率和可靠性。