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    • 8. 发明授权
    • Polyetherimide or polysulphone with polyepoxide partially reacted with aromatic polyamine
    • 聚醚酰亚胺或聚砜与聚环氧化物与芳族多胺部分反应
    • US06239232B1
    • 2001-05-29
    • US09235336
    • 1999-01-22
    • Yves CamberlinJacky GrenierJacques ValletAnthony BonnetJean-Pierre PascaultMohamed Taha
    • Yves CamberlinJacky GrenierJacques ValletAnthony BonnetJean-Pierre PascaultMohamed Taha
    • C08L6302
    • C08L63/00C08G59/5033Y10T428/24994C08L81/00C08L79/08
    • A polymer composition comprises at least one thermoplastic polymer selected from the group formed by polyetherimides and polysulphones and at least one epoxy resin modified by at least one aromatic polyamine. The epoxy resin is formed from at least one polyepoxide containing at least 2 epoxy groups in its molecule and the aromatic polyamine contains at least two primary amine groups in its molecule and preferably at least one alkyl substituent containing 1 to 12 carbon atoms located alpha to one of the amino groups. The molar ratio of the polyamine to the epoxy is such that, each amino group corresponds to 1.6 to 2.6 epoxy groups. The thermoplastic polymer content is preferably about 15% to 98% by weight with respect to the total weight of the polymer composition; the amount of epoxy resin modified by at least one aromatic polyamine is about 2% to 85% by weight with respect to the total weight of the polymer composition. These polymer compositions can be prepared in the molten state, without a solvent, at a temperature of about 100° C. to 250° C.
    • 聚合物组合物包含至少一种选自由聚醚酰亚胺和聚砜形成的基团的热塑性聚合物和至少一种由至少一种芳族多胺改性的环氧树脂。 环氧树脂由其分子中至少含有至少2个环氧基的聚环氧化物形成,芳族多胺在其分子中含有至少两个伯胺基团,优选至少一个含1至12个碳原子的烷基取代基位于一个 的氨基。 多胺与环氧的摩尔比使得每个氨基相当于1.6-2.6个环氧基。 相对于聚合物组合物的总重量,热塑性聚合物含量优选为约15%至98%重量; 由至少一种芳族多胺改性的环氧树脂的量相对于聚合物组合物的总重量为约2重量%至85重量%。 这些聚合物组合物可以在没有溶剂的情况下在约100℃至250℃的温度下以熔融状态制备。
    • 9. 发明授权
    • Polyetherimide and/or polysulphone, aromatic polyamine-modified epoxy resin and thermoplastic
    • 聚醚酰亚胺和/或聚砜,芳族聚胺改性环氧树脂和热塑性塑料
    • US06548608B2
    • 2003-04-15
    • US09838264
    • 2001-04-20
    • Yves CamberlinJacky GrenierJacques ValletAnthony BonnetJean-Pierre PascaultMohamed Taha
    • Yves CamberlinJacky GrenierJacques ValletAnthony BonnetJean-Pierre PascaultMohamed Taha
    • B32B1704
    • C08L63/00C08G59/5033Y10T428/24994C08L81/00C08L79/08
    • A polymer composition comprises at least one thermoplastic polymer selected from the group formed by polyetherimides and polysulphones, at least one epoxy resin modified by at least one aromatic polyamine, and at least one other thermoplastic selected from the group consisting of a polyphenylene ether, a polyphenylene sulfide and an aromatic polyether. The epoxy resin is formed from at least one polyepoxide containing at least 2 epoxy groups in its molecule and the aromatic polyamine contains at least two primary amine groups in its molecule and preferably at least one alkyl substituent containing 1 to 12 carbon atoms located alpha to one of the amino groups. The molar ratio of the polyamine to the epoxy is such that, each amino group corresponds to 1.6 to 2.6 epoxy groups. The thermoplastic polymer content is preferably about 15% to 98% by weight with respect to the total weight of the polymer composition; the amount of epoxy resin modified by at least one aromatic polyamine is about 2% to 85% by weight with respect to the total weight of the polymer composition.
    • 聚合物组合物包含至少一种选自由聚醚酰亚胺和聚砜形成的基团的热塑性聚合物,至少一种由至少一种芳族多胺改性的环氧树脂和至少一种选自聚苯醚,聚亚苯基 硫化物和芳香族聚醚。 环氧树脂由其分子中至少含有至少2个环氧基的聚环氧化物形成,并且芳族多胺在其分子中含有至少两个伯胺基团,优选至少一个含有1至12个碳原子的烷基取代基位于一个 的氨基。 多胺与环氧的摩尔比使得每个氨基相当于1.6-2.6个环氧基。 相对于聚合物组合物的总重量,热塑性聚合物含量优选为约15%至98%重量; 由至少一种芳族多胺改性的环氧树脂的量相对于聚合物组合物的总重量为约2重量%至85重量%。