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1. 发明申请

US20170354042A1 Solder Transfer Sheet, Solder Bump, and Solder Precoating Method Using Solder Transfer Sheet 审中-公开
公开(公告)号：US20170354042A1
公开(公告)日：2017-12-07
申请号：US15539341
申请日：2015-12-21
申请人： Senju Metal Industry Co., Ltd. , NITTA CORPORATION
发明人： Kaichi Tsuruta , Takeo Saitoh , Manabu Muraoka , Hiroki Oshima , Koji Yamashita , Shinichiro Kawahara
IPC分类号： H05K3/34 , H01L23/492 , H01L21/60 , C09J201/02 , C09J11/04 , C09J7/02
CPC分类号： H05K3/3457 , C08K3/10 , C09J7/30 , C09J11/04 , C09J201/02 , C09J2201/36 , C09J2201/602 , C09J2203/326 , C09J2205/102 , C09J2433/00 , C09J2467/006 , H01L23/4928 , H01L2021/60015 , H05K3/321 , H05K3/34 , H05K3/341 , H05K3/3478
摘要： Provided is a solder transfer sheet which is capable of increasing the amount of solder to be transferred without the occurrence of bridging. A solder transfer sheet 1A includes a base material 5, an adhesive layer 4 formed on the surface of the base material 5, a solder powder-containing adhesive layer 3 formed on the surface of the adhesive layer 4, and a solder powder layer 2 formed on the surface of the solder powder-containing adhesive layer 3. In the solder powder layer 2, particles of solder powder 20 are arranged in a one-layer sheet form. In the solder powder-containing adhesive layer 3, solder powder 30 and an adhesive component 31 are mixed so as to have such a thickness that two or more layers of the solder powder 30 are stacked.

2. 发明授权

US10111342B2 Solder transfer sheet, solder bump, and solder precoating method using solder transfer sheet 有权
公开(公告)号：US10111342B2
公开(公告)日：2018-10-23
申请号：US15539341
申请日：2015-12-21
申请人： Senju Metal Industry Co., Ltd. , NITTA CORPORATION
发明人： Kaichi Tsuruta , Takeo Saitoh , Manabu Muraoka , Hiroki Oshima , Koji Yamashita , Shinichiro Kawahara
IPC分类号： H05K3/34 , H01L23/492 , H01L21/60 , C09J201/02 , C09J11/04 , H05K3/32 , C09J7/02
摘要： Provided is a solder transfer sheet which is capable of increasing the amount of solder to be transferred without the occurrence of bridging. A solder transfer sheet 1A includes a base material 5, an adhesive layer 4 formed on the surface of the base material 5, a solder powder-containing adhesive layer 3 formed on the surface of the adhesive layer 4, and a solder powder layer 2 formed on the surface of the solder powder-containing adhesive layer 3. In the solder powder layer 2, particles of solder powder 20 are arranged in a one-layer sheet form. In the solder powder-containing adhesive layer 3, solder powder 30 and an adhesive component 31 are mixed so as to have such a thickness that two or more layers of the solder powder 30 are stacked.

3. 发明申请

US20160250719A1 SOLDER TRANSFER SHEET 审中-公开
标题翻译：卖方转让表
公开(公告)号：US20160250719A1
公开(公告)日：2016-09-01
申请号：US15033963
申请日：2014-11-05
申请人： SENJU METAL INDUSTRY CO., LTD. , NITTA CORPORATION
发明人： Kaichi Tsuruta , Takeo Saitoh , Manabu Muraoka , Hiroki Oshima , Koji Yamashita , Tomohiro Nishio , Shinichiro Kawahara
IPC分类号： B23K35/02 , B23K35/36 , B23K35/26 , H05K3/34 , H01L23/00
摘要： The present solder transfer sheet addresses the issue of providing a solder transfer sheet having both solder powder holding properties and sheet releasing properties and having excellent solder transfer properties. This solder transfer sheet is for soldering in a section to be soldered in a circuit substrate and has: a support base material; an adhesive layer provided on at least one surface of the support base material; and at least one solder layer including solder particles, provided upon the adhesive layer. The adhesive layer contains a side-chain crystalline polymer, exhibits viscosity by having fluidity at at least the melting point of the side-chain crystalline polymer, and decreases viscosity by crystalizing at temperatures less than the melting point of the side-chain crystalline polymer.
摘要翻译：本发明的焊料转印片解决了提供具有焊料粉末保持性和剥离性能以及焊料转移性优异的焊料转印片的问题。该焊料转移片用于在要焊接在电路基板中的部分中进行焊接，并具有：支撑基材; 设置在所述支撑基材的至少一个表面上的粘合层; 以及设置在粘合剂层上的包括焊料颗粒的至少一个焊料层。粘合剂层包含侧链结晶聚合物，通过在侧链结晶聚合物的至少熔点具有流动性而显示粘度，并且通过在低于侧链结晶聚合物的熔点的温度下结晶而降低粘度。

4. 发明申请

US20160271715A1 Solder Ball Supplying Method, Solder Ball Supplying Device, and Solder Bump Forming Method 审中-公开
标题翻译：焊球供料方式，焊球供料装置和焊接凸块成型方法
公开(公告)号：US20160271715A1
公开(公告)日：2016-09-22
申请号：US14392168
申请日：2013-06-26
申请人： SENJU METAL INDUSTRY CO., LTD.
发明人： Kaichi Tsuruta , Takeo Saito , Manabu Muraoka , Hiroki Oshima
IPC分类号： B23K3/06 , B23K1/00
摘要： A solder-ball-supplying method, a solder-ball-supplying device and a solder-bump-forming method, which are flux-less and capable of being also applied to electrodes having a fine pitch. A substrate on which a resist with openings is positioned on electrode(s), which has a diameter of 10 through 30 μm, of the substrate is prepared. Next, plural solder balls SBL each having a grain diameter of 1 through 10 μm are shaken down to the opening(s) of the resist from a hopper and filled therein. Next, by sliding and moving a squeegee on an upper surface of the resist along X-Y direction, the solder balls SBL shaken down to the resist other than the openings are scrapped and removed and the solder balls SBL in the openings and around them are pushed into the openings by the squeegee.
摘要翻译：焊球提供方法，焊球供给装置和焊料凸块形成方法，其无磁通，并且也可以应用于具有细间距的电极。制备其上具有开口的抗蚀剂位于基板的直径为10至30μm的电极上的基板。接下来，将具有1〜10μm的粒径的多个焊球SBL从料斗中摇动到抗蚀剂的开口部并填充。接下来，通过沿着XY方向滑动并移动抗蚀剂的上表面上的刮板，将焊球SBL摇动到除了开口之外的抗蚀剂被废弃和去除，并且将开口周围的焊球SBL推入橡皮刮板的开口。

5. 发明申请

US20160254103A1 METHOD OF MANUFACTURING AN ELECTRODE FOR AN ENERGY STORAGE DEVICE 审中-公开
标题翻译：制造能量储存装置的电极的方法
公开(公告)号：US20160254103A1
公开(公告)日：2016-09-01
申请号：US15151088
申请日：2016-05-10
申请人： SENJU METAL INDUSTRY CO., LTD.
发明人： Katsuji Nakamura , Kaichi Tsuruta , Yuji Ozaki , Shigeaki Watarai , Hidenori Takagi , Yutaka Ohori
IPC分类号： H01G11/50 , H01M2/26 , C25D3/22 , C25D3/30 , C25D3/56 , H01G11/30 , C25D3/12 , C23C18/16 , C23C18/31 , C23C18/32 , C23C18/48 , H01G11/06 , C25D5/12 , C25D3/60
CPC分类号： H01G11/50 , C23C18/1651 , C23C18/1653 , C23C18/1827 , C23C18/31 , C23C18/32 , C23C18/36 , C23C18/48 , C23C18/52 , C23C18/54 , C25D3/12 , C25D3/22 , C25D3/30 , C25D3/565 , C25D3/60 , C25D5/12 , C25D5/44 , H01B1/023 , H01B13/32 , H01G11/06 , H01G11/24 , H01G11/30 , H01G11/66 , H01M2/202 , H01M2/26 , H01M2/30 , H01M2004/028 , Y02E60/13 , Y10T29/49147
摘要： An electrode for an energy storage device including a Zn layer or Zn alloy layer, a Ni layer, and a Sn layer or Sn alloy layer formed by plating on a connecting terminal part of a positive electrode composed of Al so that the resistance value at the contacting point is reduced and the voltage of the energy storage device can be effectively supplied without any drop. Accordingly, this electrode can be soldered to a Cu negative electrode, which is composed of metal that is different species from Al, through a Sn layer or a Sn alloy layer so that jointing strength of the Al positive electrode and the Cu negative electrode can be enhanced. The contacting area is increased in comparison with the conventional jointing by spot-welding or conventional fastening by a bolt so that the resistance value at the contacting point is reduced.
摘要翻译： 1.一种蓄电装置用电极，其特征在于，包括Zn层或Zn合金层，Ni层以及通过电镀在由Al构成的正极的连接端子部分上形成的Sn层或Sn合金层，接触点减小，并且可以有效地提供能量存储装置的电压而没有任何下落。因此，该电极可以通过Sn层或Sn合金层焊接到由与Al不同的金属构成的Cu负极上，使得Al正极和Cu负极的接合强度可以增强。与通过点焊的常规接合或通过螺栓的常规紧固相比，接触面积增加，使得接触点处的电阻值降低。

6. 发明授权

US10780531B2 Solder ball, solder joint, and joining method 有权
公开(公告)号：US10780531B2
公开(公告)日：2020-09-22
申请号：US16677011
申请日：2019-11-07
申请人： Senju Metal Industry Co., Ltd.
发明人： Hiroyoshi Kawasaki , Yuri Nakamura , Osamu Munekata , Kaichi Tsuruta
IPC分类号： B23K35/00 , B23K35/26 , C22C13/00 , B23K35/02 , B23K101/42 , H01L23/00
摘要： A solder ball includes 0.1% by mass or more and 10% by mass or less of In and a remainder of Sn. The ball has a yellowness (b*) in an L*a*b* color system of 2.8 or more and 15.0 or less and a lightness (L*) of 60 or more and 100 or less. The ball further includes at least one element selected from a group of 0% by mass or more and 4% by mass or less of Ag, 0% by mass or more and 1.0% by mass or less of Cu, 0% to 3% by mass in total of Bi and/or Sb, and 0% to 0.1% by mass in total of an element selected from a group of Ni, Co, Fe, Ge, and P, excluding a solder ball including 3% by mass of Ag, 0.5% by mass of Cu, 0.2% by mass of In and a remainder of Sn.

7. 发明授权

US10391589B2 Flux applying device 有权
公开(公告)号：US10391589B2
公开(公告)日：2019-08-27
申请号：US15563017
申请日：2015-03-30
申请人： Senju Metal Industry Co., Ltd.
发明人： Manabu Muraoka , Takeo Saitoh , Shigeyuki Sekine , Takashi Obayashi , Kaichi Tsuruta , Takashi Hagiwara , Hiroyuki Yamasaki , Kota Kikuchi , Naoto Kameda
IPC分类号： B23K3/00 , B23K35/02 , B23K35/40 , B23K3/08 , B05C3/12 , B05C9/14 , B05C9/12
摘要： A flux applying device for applying flux to a surface of solder, wherein the flux applying device includes: a dipping means that applies the flux to the surface of the solder by dipping the solder into the flux; a load applying means that applies a predetermined load to the solder, the load applying means being provided at a upstream side of the dipping means; a constant speed conveying means that conveys the solder at a predetermined speed with being under load by the load applying means; a drying means that dries the solder to which the flux is applied; a cooling means that cools the dried solder; a conveying speed measurement means that measures a conveying speed of the solder; and a control means that controls the conveying speed of the solder.

8. 发明申请

US20180185967A1 Flux Applying Device and Solder 审中-公开
公开(公告)号：US20180185967A1
公开(公告)日：2018-07-05
申请号：US15563017
申请日：2015-03-30
申请人： Senju Metal Industry Co., Ltd.
发明人： Manabu Muraoka , Takeo Saitoh , Shigeyuki Sekine , Takashi Obayashi , Kaichi Tsuruta , Takashi Hagiwara , Hiroyuki Yamasaki , Kota Kikuchi , Naoto Kameda
IPC分类号： B23K35/02 , B23K35/40 , B23K3/08
CPC分类号： B23K35/0238 , B05C3/125 , B05C9/12 , B05C9/14 , B23K3/082 , B23K3/085 , B23K35/0233 , B23K35/40 , B23K35/404
摘要： A flux applying device for applying flux to a surface of solder, wherein the flux applying device includes: a dipping means that applies the flux to the surface of the solder by dipping the solder into the flux; a load applying means that applies a predetermined load to the solder, the load applying means being provided at a upstream side of the dipping means; a constant speed conveying means that conveys the solder at a predetermined speed with being under load by the load applying means; a drying means that dries the solder to which the flux is applied; a cooling means that cools the dried solder; a conveying speed measurement means that measures a conveying speed of the solder; and a control means that controls the conveying speed of the solder.

9. 发明授权

US11712760B2 Layered bonding material, semiconductor package, and power module 有权
公开(公告)号：US11712760B2
公开(公告)日：2023-08-01
申请号：US17793866
申请日：2021-03-19
申请人： SENJU METAL INDUSTRY CO., LTD.
发明人： Naoto Kameda , Masato Tsuchiya , Katsuji Nakamura , Osamu Munekata , Kaichi Tsuruta
IPC分类号： B23K35/02 , B23K35/26 , B32B15/01 , H01L23/367 , H01L23/00 , B23K101/40
CPC分类号： B23K35/0238 , B23K35/262 , B32B15/01 , H01L23/3672 , H01L24/29 , H01L24/32 , B23K2101/40 , B32B2307/732 , H01L2224/2908 , H01L2224/2918 , H01L2224/29111 , H01L2224/29147 , H01L2224/29155 , H01L2224/29184 , H01L2224/32225
摘要： In a layered bonding material 10, a coefficient of linear expansion of a base material 11 is 5.5 to 15.5 ppm/K and a first surface and a second surface of the base material 11 are coated with pieces of lead-free solder 12a and 12b.

10. 发明授权

US10722965B2 Solder ball supplying method, solder ball supplying device, and solder bump forming method 有权
公开(公告)号：US10722965B2
公开(公告)日：2020-07-28
申请号：US14392168
申请日：2013-06-26
申请人： Senju Metal Industry Co., Ltd.
发明人： Kaichi Tsuruta , Takeo Saito , Manabu Muraoka , Hiroki Oshima
IPC分类号： B23K3/06 , B23K1/00
摘要： A solder-ball-supplying method, a solder-ball-supplying device and a solder-bump-forming method, which are flux-less and capable of being also applied to electrodes having a fine pitch. A substrate on which a resist with openings is positioned on electrode(s), which has a diameter of 10 through 30 μm, of the substrate is prepared. Next, plural solder balls SBL each having a grain diameter of 1 through 10 μm are shaken down to the opening(s) of the resist from a hopper and filled therein. Next, by sliding and moving a squeegee on an upper surface of the resist along X-Y direction, the solder balls SBL shaken down to the resist other than the openings are scrapped and removed and the solder balls SBL in the openings and around them are pushed into the openings by the squeegee.

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