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1. 发明授权

US10722965B2 Solder ball supplying method, solder ball supplying device, and solder bump forming method 有权
公开(公告)号：US10722965B2
公开(公告)日：2020-07-28
申请号：US14392168
申请日：2013-06-26
申请人： Senju Metal Industry Co., Ltd.
发明人： Kaichi Tsuruta , Takeo Saito , Manabu Muraoka , Hiroki Oshima
IPC分类号： B23K3/06 , B23K1/00
摘要： A solder-ball-supplying method, a solder-ball-supplying device and a solder-bump-forming method, which are flux-less and capable of being also applied to electrodes having a fine pitch. A substrate on which a resist with openings is positioned on electrode(s), which has a diameter of 10 through 30 μm, of the substrate is prepared. Next, plural solder balls SBL each having a grain diameter of 1 through 10 μm are shaken down to the opening(s) of the resist from a hopper and filled therein. Next, by sliding and moving a squeegee on an upper surface of the resist along X-Y direction, the solder balls SBL shaken down to the resist other than the openings are scrapped and removed and the solder balls SBL in the openings and around them are pushed into the openings by the squeegee.

2. 发明申请

US20160271715A1 Solder Ball Supplying Method, Solder Ball Supplying Device, and Solder Bump Forming Method 审中-公开
标题翻译：焊球供料方式，焊球供料装置和焊接凸块成型方法
公开(公告)号：US20160271715A1
公开(公告)日：2016-09-22
申请号：US14392168
申请日：2013-06-26
申请人： SENJU METAL INDUSTRY CO., LTD.
发明人： Kaichi Tsuruta , Takeo Saito , Manabu Muraoka , Hiroki Oshima
IPC分类号： B23K3/06 , B23K1/00
摘要： A solder-ball-supplying method, a solder-ball-supplying device and a solder-bump-forming method, which are flux-less and capable of being also applied to electrodes having a fine pitch. A substrate on which a resist with openings is positioned on electrode(s), which has a diameter of 10 through 30 μm, of the substrate is prepared. Next, plural solder balls SBL each having a grain diameter of 1 through 10 μm are shaken down to the opening(s) of the resist from a hopper and filled therein. Next, by sliding and moving a squeegee on an upper surface of the resist along X-Y direction, the solder balls SBL shaken down to the resist other than the openings are scrapped and removed and the solder balls SBL in the openings and around them are pushed into the openings by the squeegee.
摘要翻译：焊球提供方法，焊球供给装置和焊料凸块形成方法，其无磁通，并且也可以应用于具有细间距的电极。制备其上具有开口的抗蚀剂位于基板的直径为10至30μm的电极上的基板。接下来，将具有1〜10μm的粒径的多个焊球SBL从料斗中摇动到抗蚀剂的开口部并填充。接下来，通过沿着XY方向滑动并移动抗蚀剂的上表面上的刮板，将焊球SBL摇动到除了开口之外的抗蚀剂被废弃和去除，并且将开口周围的焊球SBL推入橡皮刮板的开口。

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