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1. 发明授权

US07148426B2 Lead-free solder, and connection lead and electrical component using said lead-free solder 有权
公开(公告)号：US07148426B2
公开(公告)日：2006-12-12
申请号：US09892630
申请日：2001-06-28
申请人： Seigi Aoyama , Takaaki Ichikawa , Hiromitsu Kuroda , Takashi Nemoto , Atsushi Ohtake , Hiroyoshi Hiruta
发明人： Seigi Aoyama , Takaaki Ichikawa , Hiromitsu Kuroda , Takashi Nemoto , Atsushi Ohtake , Hiroyoshi Hiruta
IPC分类号： H05K1/16 , C22C13/00
CPC分类号： B23K35/262 , H01L31/0504 , H01L31/0508 , H01L31/0512 , H05K3/3426 , H05K3/3463 , Y02E10/50
摘要： In a lead-free solder comprising an alloy composition composed mainly of tin, the alloy composition further contains 0.002 to 0.015% by mass of phosphorus. This lead-free solder can be used as a plating in a connection lead comprising: a copper strip or other strip conductor; and the plating provided on at least one side of the strip constructor, the plating having a shape such that the plating in the widthwise direction of the strip conductor has a bulge as viewed in section with the apex being located at a proper position in the widthwise direction of the strip conductor. By virtue of this constitution, the lead-free solder on its surface is less likely to be oxidized, and the connection lead has excellent bond strength owing to the property of the lead-free solder and, in addition, has the function of breaking the formed oxide layer and the function of removing included gas bubbles and can eliminate the need to form the plating in very large thickness. Further, the lead-free solder can be used as a connection element in an electrical component that is less likely to cause oxidation of the connection element on its surface and, thus, can have a strong connection structure by the connection element.

2. 发明申请

US20050161129A1 Cu alloy material, method of manufacturing Cu alloy conductor using the same, Cu alloy conductor obtained by the method, and cable or trolley wire using the Cu alloy conductor 审中-公开
标题翻译： Cu合金材料，使用其制造Cu合金导体的方法，通过该方法获得的Cu合金导体，以及使用Cu合金导体的电缆或电车线
公开(公告)号：US20050161129A1
公开(公告)日：2005-07-28
申请号：US10970717
申请日：2004-10-22
申请人： Seigi Aoyama , Takaaki Ichikawa , Hiroyoshi Hiruta , Hiromitsu Kuroda
发明人： Seigi Aoyama , Takaaki Ichikawa , Hiroyoshi Hiruta , Hiromitsu Kuroda
IPC分类号： C22C9/02
CPC分类号： C22C9/02 , C22F1/08
摘要： A method of manufacturing a Cu alloy conductor comprises the steps of: adding and dissolving In of 0.1-0.7 weight % to a Cu matrix containing oxygen of 0.001-0.1 weight % (10-1000 weight ppm) to form a molten Cu alloy, performing a continuous casting with the molten Cu alloy, rapidly quenching a casting material to a temperature by at least 15° C. or more lower than a melting point of molten Cu alloy, controlling the casting material at a temperature equal to or lower than 900° C., and performing a plurality of hot rolling processes to the casting material such that a temperature of a final hot rolling is within a range of from 500 to 600° C. to form the rolled material.
摘要翻译：制造Cu合金导体的方法包括以下步骤：将含有0.1-0.7重量％的含有0.001-0.1重量％（10-1000重量ppm）的氧的Cu基质加入并溶解，以形成熔融的Cu合金，进行与熔融的Cu合金连续铸造，将铸造材料快速淬火至熔融Cu合金的熔点至少15℃以上的温度，控制铸造材料的温度等于或低于900℃ 并且对铸造材料进行多次热轧工序，使得最终热轧的温度在500〜600℃的范围内，形成轧制材料。

3. 发明授权

US08845829B2 Cu alloy material, method of manufacturing Cu alloy conductor using the same, Cu alloy conductor obtained by the method, and cable or trolley wire using the Cu alloy conductor 有权
标题翻译： Cu合金材料，使用其制造Cu合金导体的方法，通过该方法获得的Cu合金导体，以及使用Cu合金导体的电缆或电车线
公开(公告)号：US08845829B2
公开(公告)日：2014-09-30
申请号：US12716766
申请日：2010-03-03
申请人： Seigi Aoyama , Takaaki Ichikawa , Hiroyoshi Hiruta , Hiromitsu Kuroda
发明人： Seigi Aoyama , Takaaki Ichikawa , Hiroyoshi Hiruta , Hiromitsu Kuroda
IPC分类号： C22C9/02 , C22F1/08 , B60M1/13
CPC分类号： C22C9/02 , C22F1/08
摘要： A method of manufacturing a Cu alloy conductor includes the steps of: adding and dissolving In of 0.1-0.7 weight % to a Cu matrix containing oxygen of 0.001-0.1 weight % (10-1000 weight ppm) to form a molten Cu alloy, performing a continuous casting with the molten Cu alloy, rapidly quenching a casting material to a temperature by at least 15° C. or more lower than a melting point of molten Cu alloy, controlling the casting material at a temperature equal to or lower than 900° C., and performing a plurality of hot rolling processes to the casting material such that a temperature of a final hot rolling is within a range of from 500 to 600° C. to form the rolled material.
摘要翻译：制造Cu合金导体的方法包括以下步骤：向含有0.001-0.1重量％（10-1000重量ppm）的氧的Cu基质中添加和溶解0.1-0.7重量％的In以形成熔融的Cu合金，进行与熔融的Cu合金连续铸造，将铸造材料快速淬火至熔融Cu合金的熔点至少15℃以上的温度，控制铸造材料的温度等于或低于900℃ 并且对铸造材料进行多次热轧工序，使得最终热轧的温度在500〜600℃的范围内，形成轧制材料。

4. 发明申请

US20100163139A1 Cu ALLOY MATERIAL, METHOD OF MANUFACTURING Cu ALLOY CONDUCTOR USING THE SAME, Cu ALLOY CONDUCTOR OBTAINED BY THE METHOD, AND CABLE OR TROLLEY WIRE USING THE Cu ALLOY CONDUCTOR 有权
标题翻译：铜合金材料，使用该方法制造Cu合金导体的方法，通过该方法获得的Cu合金导体，以及使用铜合金导体的电缆或拉杆
公开(公告)号：US20100163139A1
公开(公告)日：2010-07-01
申请号：US12716766
申请日：2010-03-03
申请人： Seigi AOYAMA , Takaaki Ichikawa , Hiroyoshi Hiruta , Hiromitsu Kuroda
发明人： Seigi AOYAMA , Takaaki Ichikawa , Hiroyoshi Hiruta , Hiromitsu Kuroda
IPC分类号： C22F1/08 , B22D11/00
CPC分类号： C22C9/02 , C22F1/08
摘要： A method of manufacturing a Cu alloy conductor comprises the steps of: adding and dissolving In of 0.1-0.7 weight % to a Cu matrix containing oxygen of 0.001-0.1 weight % (10-1000 weight ppm) to form a molten Cu alloy, performing a continuous casting with the molten Cu alloy, rapidly quenching a casting material to a temperature by at least 15° C. or more lower than a melting point of molten Cu alloy, controlling the casting material at a temperature equal to or lower than 900° C., and performing a plurality of hot rolling processes to the casting material such that a temperature of a final hot rolling is within a range of from 500 to 600° C. to form the rolled material.
摘要翻译：制造Cu合金导体的方法包括以下步骤：将含有0.1-0.7重量％的含有0.001-0.1重量％（10-1000重量ppm）的氧的Cu基质加入并溶解，以形成熔融的Cu合金，进行与熔融的Cu合金连续铸造，将铸造材料快速淬火至熔融Cu合金的熔点至少15℃以上的温度，控制铸造材料的温度等于或低于900℃ 并且对铸造材料进行多次热轧工序，使得最终热轧的温度在500〜600℃的范围内，形成轧制材料。

5. 发明授权

US09255311B2 Copper alloy conductor, and trolley wire and cable using same, and copper alloy conductor fabrication method 有权
标题翻译：铜合金导体和电线电缆使用相同，铜合金导体制造方法
公开(公告)号：US09255311B2
公开(公告)日：2016-02-09
申请号：US11328072
申请日：2006-01-10
申请人： Hiromitsu Kuroda , Kazuma Kuroki , Seigi Aoyama , Hiroyoshi Hiruta
发明人： Hiromitsu Kuroda , Kazuma Kuroki , Seigi Aoyama , Hiroyoshi Hiruta
IPC分类号： C22C9/02 , C22F1/08 , B60M1/13 , H01B1/02
CPC分类号： C22C9/02 , C22F1/08 , H01B1/026
摘要： A copper alloy conductor has a copper alloy material which has a copper parent material with 0.001 to 0.1 wt % (=10 to 1000 wt·ppm) of oxygen and 0.15 to 0.70 wt % (exclusive of 0.15 wt %) of Sn. A crystalline grain to form a crystalline structure of the copper alloy material has an average diameter of 100 μm or less, and 80% or more of an oxide of the Sn is dispersed in a matrix of the crystalline structure as a fine oxide grain with an average diameter of 1 μm or less.
摘要翻译：铜合金导体具有铜合金材料，其具有0.001至0.1重量％（= 10至1000重量ppm）的氧和0.15至0.70重量％（不包括0.15重量％）的Sn的母体材料。形成铜合金材料的晶体结构的晶粒的平均直径为100μm以下，Sn的氧化物的80％以上分散在作为细微氧化物晶粒的晶体结构的基体中，平均直径为1μm以下。

6. 发明申请

US20060157167A1 Copper alloy conductor, and trolley wire and cable using same, and copper alloy conductor fabrication method 有权
标题翻译：铜合金导体和电线电缆使用相同，铜合金导体制造方法
公开(公告)号：US20060157167A1
公开(公告)日：2006-07-20
申请号：US11328072
申请日：2006-01-10
申请人： Hiromitsu Kuroda , Kazuma Kuroki , Seigi Aoyama , Hiroyoshi Hiruta
发明人： Hiromitsu Kuroda , Kazuma Kuroki , Seigi Aoyama , Hiroyoshi Hiruta
IPC分类号： C22C9/02
CPC分类号： C22C9/02 , C22F1/08 , H01B1/026
摘要： A copper alloy conductor has a copper alloy material which has a copper parent material with 0.001 to 0.1 wt % (=10 to 1000 wt.ppm) of oxygen and 0.15 to 0.70 wt % (exclusive of 0.15 wt %) of Sn. A crystalline grain to form a crystalline structure of the copper alloy material has an average diameter of 100 μm or less, and 80% or more of an oxide of the Sn is dispersed in a matrix of the crystalline structure as a fine oxide grain with an average diameter of 1 μm or less.
摘要翻译：铜合金导体具有铜合金材料，其具有0.001至0.1重量％（= 10至1000重量ppm）的氧和0.15至0.70重量％（不包括0.15重量％）的Sn的母体材料。形成铜合金材料的晶体结构的结晶粒子的平均直径为100μm以下，并且Sn的氧化物的80％以上分散在晶体结构的基体中，作为细小的氧化物粒子，具有平均粒径为1mum以下。

7. 发明申请

US20140000932A1 SOFT DILUTE-COPPER ALLOY WIRE, SOFT DILUTE-COPPER ALLOY TWISTED WIRE, AND INSULATED WIRE, COAXIAL CABLE, AND COMPOSITE CABLE USING THESE 有权
标题翻译：软二次铜合金线，软质二次铜合金线，绝缘线，同轴电缆及复合电缆
公开(公告)号：US20140000932A1
公开(公告)日：2014-01-02
申请号：US14005224
申请日：2012-03-16
申请人： Seigi Aoyama , Toru Sumi , Hiromitsu Kuroda , Hideyuki Sagawa
发明人： Seigi Aoyama , Toru Sumi , Hiromitsu Kuroda , Hideyuki Sagawa
IPC分类号： H01B7/04
CPC分类号： H01B7/04 , C22C1/02 , C22C9/00 , C22F1/08 , H01B1/026
摘要： Provided are a soft dilute-copper alloy wire and soft dilute-copper alloy twisted wire which have high electrical conductivity and high bending life and can limit disconnection during use compared with oxygen-free copper wire, and also provided are an insulated wire, coaxial cable, and composite cable using the soft dilute-copper alloy wire and soft dilute-copper alloy twisted wire. The soft dilute-copper alloy wire is subjected to annealing treatment by elongation processing of soft dilute-copper alloy material comprising copper and an additive element selected from the group consisting of Ti, Mg, Zr, Nb, Ca, V, Ni, Hf, Fe, Mn and Cr, with inevitable impurities as the balance, wherein the soft dilute-copper alloy wire has an average grain size that is 20 μm or less in a surface layer having a depth of 50 μm from the surface, and an elongation value that is at least 1% higher than the average elongation value of oxygen-free copper wire that has been subjected to the aforementioned annealing treatment.
摘要翻译：提供一种柔软的稀铜合金线和软的稀铜铜合金绞线，具有高导电性和高弯曲寿命，并且与无氧铜线相比可以限制使用时的断开，并且还提供了绝缘线，同轴电缆，复合电缆采用软弱铜铜合金线和软铜铜合金绞合线。软铜铜合金线材通过伸长加工进行退火处理，该软质稀铜铜合金材料包含选自由Ti，Mg，Zr，Nb，Ca，V，Ni，Hf组成的组的铜和添加元素， Fe，Mn，Cr等不可避免的杂质作为平衡，其中，软质铜 - 铜合金线的表面的深度为50μm的表面层的平均粒径为20μm以下，伸长率值比经过上述退火处理的无氧铜线的平均伸长率高1％以上。

8. 发明授权

US07737370B2 Electromagnetic shielding filter 失效
标题翻译：电磁屏蔽滤波器
公开(公告)号：US07737370B2
公开(公告)日：2010-06-15
申请号：US11882089
申请日：2007-07-30
申请人： Seigi Aoyama , Toshiyuki Horikoshi , Hiromitsu Kuroda , Yuzo Ito , Hiroshi Komuro , Hiroshi Okikawa
发明人： Seigi Aoyama , Toshiyuki Horikoshi , Hiromitsu Kuroda , Yuzo Ito , Hiroshi Komuro , Hiroshi Okikawa
IPC分类号： H05K9/00
CPC分类号： H05K9/0096
摘要： An electromagnetic shielding filter has two transparent boards and a conductive mesh with plural wires, where the conductive mesh is sandwiched between the two transparent boards. The plural wires are formed of a Cu—Sn—In alloy or a Cu—Ag alloy.
摘要翻译：电磁屏蔽过滤器具有两个透明板和具有多个导线的导电网，其中导电网被夹在两个透明板之间。多根金属线由Cu-Sn-In合金或Cu-Ag合金形成。

9. 发明授权

US10030287B2 Soft-dilute-copper-alloy material, soft-dilute-copper-alloy wire, soft-dilute-copper-alloy sheet, soft-dilute-copper-alloy stranded wire, and cable, coaxial cable and composite cable using same 有权
公开(公告)号：US10030287B2
公开(公告)日：2018-07-24
申请号：US13577400
申请日：2011-02-08
申请人： Seigi Aoyama , Toru Sumi , Hiromitsu Kuroda , Hideyuki Sagawa
发明人： Seigi Aoyama , Toru Sumi , Hiromitsu Kuroda , Hideyuki Sagawa
IPC分类号： C22C9/00 , C22F1/08 , H01B1/02 , B21C1/00 , C22C1/10
摘要： A soft dilute copper alloy material includes 2 mass ppm to 12 mass ppm of sulfur, more than 2 mass ppm and not more than 30 mass ppm of oxygen, 4 mass ppm to 55 mass ppm of Ti, and a balance including copper. An average crystal grain size is not more than 20 μm in a surface layer up to a depth of 50 μm from a surface. The average crystal grain size in the surface layer is less than the average crystal grain size in an inner portion located more interiorly than the surface layer.

10. 发明授权

US09734937B2 Soft dilute-copper alloy wire, soft dilute-copper alloy twisted wire, and insulated wire, coaxial cable, and composite cable using these 有权
公开(公告)号：US09734937B2
公开(公告)日：2017-08-15
申请号：US14005224
申请日：2012-03-16
申请人： Seigi Aoyama , Toru Sumi , Hiromitsu Kuroda , Hideyuki Sagawa
发明人： Seigi Aoyama , Toru Sumi , Hiromitsu Kuroda , Hideyuki Sagawa
IPC分类号： H01B7/04 , C22C9/00 , H01B1/02 , C22F1/08 , C22C1/02
CPC分类号： H01B7/04 , C22C1/02 , C22C9/00 , C22F1/08 , H01B1/026
摘要： Provided are a soft dilute-copper alloy wire and soft dilute-copper alloy twisted wire which have high electrical conductivity and high bending life and can limit disconnection during use compared with oxygen-free copper wire, and also provided are an insulated wire, coaxial cable, and composite cable using the soft dilute-copper alloy wire and soft dilute-copper alloy twisted wire. The soft dilute-copper alloy wire is subjected to annealing treatment by elongation processing of soft dilute-copper alloy material comprising copper and an additive element selected from the group consisting of Ti, Mg, Zr, Nb, Ca, V, Ni, Hf, Fe, Mn and Cr, with inevitable impurities as the balance, wherein the soft dilute-copper alloy wire has an average grain size that is 20 μm or less in a surface layer having a depth of 50 μm from the surface, and an elongation value that is at least 1% higher than the average elongation value of oxygen-free copper wire that has been subjected to the aforementioned annealing treatment.

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