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1. 发明申请

US20100193234A1 Method for producing an electrical and mechanical connection and an assembly comprising such a connection 审中-公开
标题翻译：用于生产电气和机械连接的方法以及包括这种连接的组件
公开(公告)号：US20100193234A1
公开(公告)日：2010-08-05
申请号：US12689780
申请日：2010-01-19
申请人： Sebastian Kisban , Ulrich Bartsch , Patrick Ruther , Johannes Kenntner , Oliver Paul
发明人： Sebastian Kisban , Ulrich Bartsch , Patrick Ruther , Johannes Kenntner , Oliver Paul
IPC分类号： H05K1/00 , H01R43/16 , H01R43/26
CPC分类号： H05K3/305 , H01L24/05 , H01L24/13 , H01L24/50 , H01L24/86 , H01L2224/0401 , H01L2224/0405 , H01L2224/16 , H01L2924/01005 , H01L2924/01013 , H01L2924/0102 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/07802 , H05K1/189 , H05K3/243 , H05K2201/10674 , H05K2201/10977 , H05K2203/0152 , Y02P70/613 , Y10T29/4921 , H01L2924/00
摘要： A method for producing an electrical and mechanical connection, wherein a solid body comprises a support, on which is disposed an electrical contact zone and an electrically insulating support zone. A flexible, flat cable comprises a support layer made of an electrically insulating material and a strip conductor, with an electrical contacting point and a laterally adjacent insulating cable zone. An adhesive layer is applied on the cable and the contacting point is disposed on the support layer so that the adhesive layer surrounds the contacting point and adheres to the cable. The support and the cable are positioned in a pre-assembly position so that the contacting point of the cable is facing the contact zone of the support and the adhesive layer is facing the electrically insulating support zone. The solid body and the cable are positioned so that the contacting point electrically contacts the contact zone and the adhesive layer adheres to the surface of the solid body.
摘要翻译：一种用于制造电气和机械连接的方法，其中固体包括支撑件，在所述支撑件上设置有电接触区域和电绝缘支撑区域。柔性扁平电缆包括由电绝缘材料制成的支撑层和带状导体，具有电接触点和横向相邻的绝缘电缆区域。将粘合剂层施加在电缆上，并且接触点设置在支撑层上，使得粘合剂层围绕接触点并粘附到电缆。支撑件和电缆定位在预组装位置，使得电缆的接触点面向支撑件的接触区域，并且粘合剂层面向电绝缘支撑区域。固体和电缆被定位成使得接触点电接触接触区域，并且粘合剂层粘附到固体的表面。

2. 发明申请

US20110048799A1 Microstructure and Process for its Assembly 审中-公开
标题翻译：其组装及其组装工艺
公开(公告)号：US20110048799A1
公开(公告)日：2011-03-03
申请号：US12857737
申请日：2010-08-17
申请人： Sebastian Kisban , Stanislav Herwik , Patrick Ruther , Tobias Holzhammer , Oliver Paul
发明人： Sebastian Kisban , Stanislav Herwik , Patrick Ruther , Tobias Holzhammer , Oliver Paul
IPC分类号： H02G3/00 , B81C1/00
CPC分类号： B81C3/004 , B81B2201/12 , B81B2207/07 , B81C3/008 , H01R12/79 , H05K1/118 , H05K3/0058 , H05K3/326 , H05K3/365 , H05K2201/091 , H05K2201/1059 , Y10T29/49002
摘要： In a process for assembling a microstructure (1), provision is made of a first microstructure piece (2) having a receiving recess (3) in its surface and a second microstructure piece (5) having a connecting region (6) fitting into the receiving recess (3) and on which is arranged at least one electrical contact element (7a, 7b). Provision is made of a flexible cable (8) having a flat substrate layer (9) made of an electrically insulating material and at least one strip conductor (10) arranged thereon. The cable (8) has at least one tongue (14a, 14b) on which is arranged at least one counter-contact element (11a, 11b) connected to the strip conductor (10). The cable (8) and the microstructure pieces (5) are positioned relative to each other in a preassembly position in which the connecting region (6) is opposite the receiving recess (3) and the tongue (14a, 14b) is aligned between the connecting region (6) and the receiving recess (3). The connecting region (6) is then introduced in the receiving recess (3) by displacement of the microstructure pieces (2, 5) toward one another. In doing so the at least one tongue (14a, 14b) is deflected in the receiving recess (3) in such a way that the at least one counter-contact element (11a, 11b) contacts the at least one contact element (7a, 7b).
摘要翻译：在组装微结构（1）的方法中，提供在其表面上具有接收凹槽（3）的第一微结构件（2）和具有连接区域（6）的第二微结构件（5）接收凹部（3），并且其上布置有至少一个电接触元件（7a，7b）。设置有具有由电绝缘材料制成的平坦基底层（9）的柔性电缆（8）和布置在其上的至少一个带状导体（10）。电缆（8）具有至少一个舌片（14a，14b），其上设置有至少一个连接到带状导体（10）的反接触元件（11a，11b）。电缆（8）和微结构件（5）在连接区域（6）与容纳凹部（3）相对的预组装位置中相对定位，并且舌部（14a，14b）在连接区域（6）和接收凹部（3）。然后通过使微结构件（2,5）彼此移位将连接区域（6）引入到容纳凹部（3）中。在这样做时，至少一个舌片（14a，14b）在接收凹部（3）中被偏转，使得至少一个反接触元件（11a，11b）接触至少一个接触元件（7a， 7b）。

3. 发明申请

US20130015847A1 MAGNETIC FIELD SENSOR AND METHOD FOR DETERMINING AND CORRECTING AN OFFSET VOLTAGE OF A MAGNETIC FIELD SENSOR 有权
标题翻译：用于确定和校正磁场传感器偏移电压的磁场传感器和方法
公开(公告)号：US20130015847A1
公开(公告)日：2013-01-17
申请号：US13542489
申请日：2012-07-05
申请人： Timo Kaufmann , Patrick Ruther , Roiy Raz , Oliver Paul
发明人： Timo Kaufmann , Patrick Ruther , Roiy Raz , Oliver Paul
IPC分类号： G01R33/07
CPC分类号： G01R33/0029 , G01R33/02 , G01R33/022 , G01R33/077
摘要： A magnetic field sensor having a Hall sensor with a first terminal contact and with a second terminal contact and with a third terminal contact and with a fourth terminal contact and with a fifth terminal contact, whereby a first switch with a control input is provided between the first terminal contact and the fifth terminal contact, and the first switch connects or disconnects the first terminal contact to/from the fifth terminal contact, and a control unit is provided and the control unit is connected to the control input of the first switch.
摘要翻译：一种磁场传感器，具有具有第一端子触点和第二端子触点的霍尔传感器，并具有第三端子触点，并具有第四端子触点和第五端子触点，由此具有控制输入的第一开关设置在第一端子触点和第五端子触点，并且第一开关将第一端子触头连接到/从第五端子触头断开，并且提供控制单元，并且控制单元连接到第一开关的控制输入。

4. 发明授权

US08915152B2 Force sensor with wings and force distribution component 有权
标题翻译：力传感器与翼和力分配组件
公开(公告)号：US08915152B2
公开(公告)日：2014-12-23
申请号：US13614731
申请日：2012-09-13
申请人： Marc Baumann , Patrick Ruther , Alexander Peter , Oliver Paul
发明人： Marc Baumann , Patrick Ruther , Alexander Peter , Oliver Paul
IPC分类号： G01L1/10 , G01L1/18 , G01L9/00
CPC分类号： G01L1/18 , G01L9/0054
摘要： A force sensor comprising a substrate, a semiconductor body, and a piezoresistive element provided on a top surface of the semiconductor body. The semiconductor body is connected to the substrate in a force-fit manner, and includes a first wing which is provided on the top surface of the semiconductor body and being connected to the semiconductor body in a force-fit manner. A first force application area is provided on the first wing. A second wing has a second force application area provided opposite the first wing. The piezoresistive element is disposed between the first wing and the second wing. A force distribution component is connected to the first force application area and the second force application area in a force-fit manner. The force distribution component having a first surface which is oriented away from the top surface of the semiconductor body and includes a third force application area.
摘要翻译：一种力传感器，包括设置在半导体本体的顶表面上的衬底，半导体本体和压阻元件。该半导体本体以力配合的方式与基板连接，并且包括设置在半导体主体的上表面并且以合力方式与半导体本体连接的第一翼。在第一机翼上设置第一力施加区域。第二翼具有与第一翼相对设置的第二施力区域。压阻元件设置在第一翼和第二翼之间。力分配部件以力配合的方式与第一施力部和第二施力部连接。所述力分配部件具有朝向远离所述半导体主体的上表面的第一表面，并且包括第三力施加区域。

5. 发明申请

US20130015853A1 HALL SENSOR 有权
标题翻译：霍尔传感器
公开(公告)号：US20130015853A1
公开(公告)日：2013-01-17
申请号：US13542465
申请日：2012-07-05
申请人： Roiy Raz , Patrick Ruther , Timo Kaufmann , Oliver Paul
发明人： Roiy Raz , Patrick Ruther , Timo Kaufmann , Oliver Paul
IPC分类号： G01R33/07
CPC分类号： G01R33/07 , G01R33/066 , G01R33/077
摘要： A Hall sensor is provided having a first Hall element with a first terminal contact and with a second terminal contact and with a third terminal contact, a second Hall element with a fourth terminal contact and with a fifth terminal contact and with a sixth terminal contact, a third Hall element with a seventh terminal contact and with an eighth terminal contact and with a ninth terminal contact, and a fourth Hall element with a tenth terminal contact and with an eleventh terminal contact and with a twelfth terminal contact. The first Hall element and the second Hall element and the third Hall element and the fourth Hall element are connectable in series.
摘要翻译：霍尔传感器具有第一霍尔元件，第一霍尔元件具有第一端子触点和第二端子触点和第三端子触点，第二霍尔元件具有第四端子触点和第五端子触点以及第六端子触点，具有第七端子触点和第八端子触点和第九端子触点的第三霍尔元件，以及具有第十端子触点和第十一端子触点的第四霍尔元件以及与第十二端子触点相连接的第四霍尔元件。第一霍尔元件和第二霍尔元件以及第三霍尔元件和第四霍尔元件可串联连接。

6. 发明授权

US09689931B2 Magnetic field sensor and method for determining and correcting an offset voltage of a magnetic field sensor 有权
公开(公告)号：US09689931B2
公开(公告)日：2017-06-27
申请号：US13542489
申请日：2012-07-05
申请人： Timo Kaufmann , Patrick Ruther , Roiy Raz , Oliver Paul
发明人： Timo Kaufmann , Patrick Ruther , Roiy Raz , Oliver Paul
IPC分类号： G01R33/07 , G01R33/00 , G01R33/02 , G01R33/022
CPC分类号： G01R33/0029 , G01R33/02 , G01R33/022 , G01R33/077
摘要： A magnetic field sensor having a Hall sensor with a first terminal contact and with a second terminal contact and with a third terminal contact and with a fourth terminal contact and with a fifth terminal contact, whereby a first switch with a control input is provided between the first terminal contact and the fifth terminal contact, and the first switch connects or disconnects the first terminal contact to/from the fifth terminal contact, and a control unit is provided and the control unit is connected to the control input of the first switch.

7. 发明授权

US09097753B2 Hall sensor having serially connected hall elements 有权
标题翻译：霍尔传感器具有串联连接的霍尔元件
公开(公告)号：US09097753B2
公开(公告)日：2015-08-04
申请号：US13542465
申请日：2012-07-05
申请人： Roiy Raz , Patrick Ruther , Timo Kaufmann , Oliver Paul
发明人： Roiy Raz , Patrick Ruther , Timo Kaufmann , Oliver Paul
IPC分类号： G01R33/07 , G01R33/06
CPC分类号： G01R33/07 , G01R33/066 , G01R33/077
摘要： A Hall sensor is provided having a first Hall element with a first terminal contact and with a second terminal contact and with a third terminal contact, a second Hall element with a fourth terminal contact and with a fifth terminal contact and with a sixth terminal contact, a third Hall element with a seventh terminal contact and with an eighth terminal contact and with a ninth terminal contact, and a fourth Hall element with a tenth terminal contact and with an eleventh terminal contact and with a twelfth terminal contact. The first Hall element and the second Hall element and the third Hall element and the fourth Hall element are connectable in series.
摘要翻译：霍尔传感器具有第一霍尔元件，第一霍尔元件具有第一端子触点和第二端子触点和第三端子触点，第二霍尔元件具有第四端子触点和第五端子触点以及第六端子触点，具有第七端子触点和第八端子触点和第九端子触点的第三霍尔元件，以及具有第十端子触点和第十一端子触点的第四霍尔元件以及与第十二端子触点相连接的第四霍尔元件。第一霍尔元件和第二霍尔元件以及第三霍尔元件和第四霍尔元件可串联连接。

8. 发明申请

US20130327672A1 BLISTER PACKAGING FOR LIQUID AND USE THEREOF AND METHOD FOR SUPPLYING A LIQUID TO A FLUIDIC ASSEMBLY 审中-公开
标题翻译：用于液体及其用途的吸塑包装和液体向液体装置供应的方法
公开(公告)号：US20130327672A1
公开(公告)日：2013-12-12
申请号：US13883896
申请日：2011-11-03
申请人： Dirk Kurowski , Oliver Paul
发明人： Dirk Kurowski , Oliver Paul
IPC分类号： B65D85/00
CPC分类号： B65D85/00 , B01L3/502715 , B01L3/52 , B01L2400/0481 , B01L2400/0683 , B65D75/368 , B65D2205/02 , B65D2221/00 , B65D2575/362 , B65D2575/367
摘要： A packaging, particularly a blister packaging, is proposed, having at least one cavity for holding a liquid and having an integrated opening device. The packaging can be used as a reservoir for a liquid for connecting to a fluidic assembly. The packaging is opened by partial deformation of the packaging.
摘要翻译：提出了一种包装，特别是泡罩包装，其具有至少一个用于保持液体并具有集成打开装置的空腔。该包装可用作用于连接流体组件的液体的储存器。包装通过包装的部分变形而打开。

9. 发明授权

US09522520B2 Process for producing a microfluidic apparatus and related laminating devices 有权
标题翻译：用于生产微流体装置和相关层压装置的方法
公开(公告)号：US09522520B2
公开(公告)日：2016-12-20
申请号：US13819050
申请日：2011-08-30
申请人： Dirk Kurowski , Oliver Paul
发明人： Dirk Kurowski , Oliver Paul
IPC分类号： B32B37/00 , B32B37/30 , B01L3/00 , F16K99/00
CPC分类号： B32B37/30 , B01L3/502707 , B01L3/502738 , B01L2200/12 , B01L2300/0816 , B01L2300/0887 , B01L2300/123 , B01L2400/0481 , B01L2400/0655 , F16K99/0001 , F16K99/0015 , F16K2099/008 , Y10T156/16
摘要： A process and a laminating device for producing a microfluidic device are proposed, wherein a film is pressed onto a carrier under the effect of heat and thereby attached to it. During the attachment the film is lifted by the blowing in of gas on the carrier side to prevent it adhering in a non-attachment region and is vented on the remote side. The device is compressed between a holder and a thermode of the laminating device during the lamination. An elastic intermediate layer is arranged in each case between the device and the holder and between the device and the thermode, for evening out the contact pressure and obtaining uniform attachment of the film to the carrier.
摘要翻译：提出了一种用于制造微流体装置的方法和层压装置，其中膜在热作用下被压在载体上并由此附着于其上。在安装期间，通过在载体侧上的气体吹入而使膜被提升，以防止粘附在非附着区域并且在远端侧排出。在层压期间，该装置在夹持器和层压装置的热电偶之间被压缩。弹性中间层在每种情况下都布置在装置和夹持器之间以及装置与热电极之间，用于使接触压力过夜，并获得薄膜到载体的均匀附着。

10. 发明授权

US06351390B1 Method for applying a microsystem or a converter on a substrate, and device manufactured accordingly 失效
标题翻译：将微系统或转换器应用于基板的方法，以及相应地制造的装置
公开(公告)号：US06351390B1
公开(公告)日：2002-02-26
申请号：US09331135
申请日：1999-07-22
申请人： Felix Mayer , Oliver Paul
发明人： Felix Mayer , Oliver Paul
IPC分类号： H05K118
CPC分类号： G01N33/0009 , G01L19/0069 , G01L19/147 , H01L2224/16225 , H01L2224/73204 , H01L2924/15151
摘要： A process is given for permitting the application to a substrate (2) of a microsystem or transducer (1) having a first partial surface (13), whose interaction with the environment is to be possible, and a second partial surface (14), which is to be protected against external influences. The substrate (2) is prepared, a passage point (20) being produced in said substrate (2). The microsystem (1) and substrate (2) are so mutually positioned that the first partial surface (13) faces the substrate (2) and that the passage point (20) in the substrate (2) and the first partial surface (13) come to rest opposite one another. Contacts (50, 51.1, 51.2) are produced by flip-chip technology. A sealing contact (51.1, 51.2) seals the second partial surface (14) against external influences. A gap (3) between the microsystem (1) and substrate (2) is filled with a filling material (30). A selective cover (24) over the passage point (20) keeps undesired external influences away from the first partial surface (13). The microsystem (1) can e.g. contain a sensor, the first partial surface (13) containing the sensitive surface and the second partial surface (14) electronic functional units.
摘要翻译：给出了允许将其应用于具有第一部分表面（13）的微系统或换能器（1）的基板（2）的过程，该第一部分表面（13）与环境的相互作用是可能的，以及第二部分表面（14），这将受到外部影响的保护。准备衬底（2），在所述衬底（2）中产生通过点（20）。微系统（1）和基板（2）相互定位成使得第一部分表面（13）面向基板（2），并且基板（2）和第一部分表面（13）中的通过点（20）彼此相反休息。触点（50,51.1,51.2）通过倒装芯片技术生产。密封触点（51.1,51.2）密封第二部分表面（14）以抵抗外部影响。微系统（1）和衬底（2）之间的间隙（3）填充有填充材料（30）。在通过点（20）之上的选择性盖（24）使不期望的外部影响远离第一部分表面（13）。微系统（1）可以例如包含传感器，所述第一部分表面（13）包含所述敏感表面和所述第二部分表面（14）电子功能单元。

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