会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明授权
    • Lightly donor doped electrodes for high-dielectric-constant materials
    • 用于高介电常数材料的轻掺杂掺杂电极
    • US06593638B1
    • 2003-07-15
    • US08477957
    • 1995-06-07
    • Scott R. SummerfeltHoward R. BeratanBruce Gnade
    • Scott R. SummerfeltHoward R. BeratanBruce Gnade
    • H01L2900
    • H01G4/008H01L21/31691H01L27/11502H01L28/56Y10S257/917Y10T29/43Y10T29/435
    • A preferred embodiment of this invention comprises a conductive lightly donor doped perovskite layer (e.g. lightly La doped BST 34), and a high-dielectric-constant material layer (e.g. undoped BST 36) overlaying the conductive lightly donor doped perovskite layer. The conductive lightly donor doped perovskite layer provides a substantially chemically and structurally stable electrical connection to the high-dielectric-constant material layer. A lightly donor doped perovskite generally has much less resistance than undoped, acceptor doped, or heavily donor doped HDC materials. The amount of donor doping to make the material conductive (or resistive) is normally dependent on the process conditions (e.g. temperature, atmosphere, grain size, film thickness and composition). This resistivity may be further decreased if the perovskite is exposed to reducing conditions. The lightly donor doped perovskite can be deposited and etched by effectively the same techniques that are developed for the high-dielectric-constant material. The same equipment may used to deposit and etch both the perovskite electrode and the dielectric. These structures may also be used for multilayer capacitors and other thin-film ferroelectric devices such as pyroelectric materials, non-volatile memories, thin-film piezoelectric and thin-film electro-optic oxides.
    • 本发明的优选实施方案包括导电轻掺杂的钙钛矿层(例如轻掺杂的La掺杂的BST 34)和覆盖导电的轻掺杂的钙钛矿层的高介电常数材料层(例如未掺杂的BST 36)。 导电轻掺杂的钙钛矿层提供了与高介电常数材料层基本上化学和结构稳定的电连接。 掺杂的轻掺杂钙钛矿的电阻通常比未掺杂,受体掺杂或重掺杂的HDC材料具有更低的电阻。 导电(或电阻)材料的施主掺杂量通常取决于工艺条件(例如温度,气氛,晶粒尺寸,膜厚度和组成)。 如果钙钛矿暴露于还原条件下,该电阻率可以进一步降低。 通过有效地为高介电常数材料开发的相同技术,可以沉积和蚀刻轻掺杂的钙钛矿。 相同的设备可用于沉积和蚀刻钙钛矿电极和电介质。 这些结构也可以用于多层电容器和其他薄膜铁电体器件,例如热电材料,非易失性存储器,薄膜压电和薄膜电光氧化物。
    • 3. 发明授权
    • Lightly donor doped electrodes for high-dielectric-constant materials
    • 用于高介电常数材料的轻掺杂掺杂电极
    • US06319542B1
    • 2001-11-20
    • US08451853
    • 1995-05-26
    • Scott R. SummerfeltHoward R. BeratanBruce Gnade
    • Scott R. SummerfeltHoward R. BeratanBruce Gnade
    • B05D512
    • H01G4/008H01L21/31691H01L27/11502H01L28/56Y10S257/917Y10T29/43Y10T29/435
    • A preferred embodiment of this invention comprises a conductive lightly donor doped perovskite layer (e.g. lightly La doped BST 34), and a high-dielectric-constant material layer (e.g. undoped BST 36) overlaying the conductive lightly donor doped perovskite layer. The conductive lightly donor doped perovskite layer provides a substantially chemically and structurally stable electrical connection to the high-dielectric-constant material layer. A lightly donor doped perovskite generally has much less resistance than undoped, acceptor doped, or heavily donor doped HDC materials. The amount of donor doping to make the material conductive (or resistive) is normally dependent on the process conditions (e.g. temperature, atmosphere, grain size, film thickness and composition). This resistivity may be further decreased if the perovskite is exposed to reducing conditions. The lightly donor doped perovskite can be deposited and etched by effectively the same techniques that are developed for the high-dielectric-constant material. The same equipment may used to deposit and etch both the perovskite electrode and the dielectric. These structures may also be used for multilayer capacitors and other thin-film ferroelectric devices such as pyroelectric materials, non-volatile memories, thin-film piezoelectric and thin-film electro-optic oxides.
    • 本发明的优选实施方案包括导电轻掺杂的钙钛矿层(例如轻掺杂的La掺杂的BST 34)和覆盖导电的轻掺杂的钙钛矿层的高介电常数材料层(例如未掺杂的BST 36)。 导电轻掺杂的钙钛矿层提供了与高介电常数材料层基本上化学和结构稳定的电连接。 掺杂的轻掺杂钙钛矿的电阻通常比未掺杂,受体掺杂或重掺杂的HDC材料具有更低的电阻。 导电(或电阻)材料的施主掺杂量通常取决于工艺条件(例如温度,气氛,晶粒尺寸,膜厚度和组成)。 如果钙钛矿暴露于还原条件下,该电阻率可以进一步降低。 通过有效地为高介电常数材料开发的相同技术,可以沉积和蚀刻轻掺杂的钙钛矿。 相同的设备可用于沉积和蚀刻钙钛矿电极和电介质。 这些结构也可以用于多层电容器和其他薄膜铁电体器件,例如热电材料,非易失性存储器,薄膜压电和薄膜电光氧化物。