专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07134194B2 Method of developing an electronic module 失效
标题翻译：开发电子模块的方法
公开(公告)号：US07134194B2
公开(公告)日：2006-11-14
申请号：US10707004
申请日：2003-11-13
申请人： Scott D. Brandenburg , Todd P. Oman , Micheal E. Miller
发明人： Scott D. Brandenburg , Todd P. Oman , Micheal E. Miller
IPC分类号： H05K3/30
CPC分类号： H05K1/147 , H05K1/148 , H05K1/189 , H05K3/284 , H05K3/3436 , H05K3/363 , H05K2201/10189 , H05K2201/10303 , H05K2201/10674 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49153 , Y10T29/49158
摘要： An electronic module and method that enable circuitry required by one form of the module (e.g., a developmental unit) to be omitted in a second form of the module (e.g., a production unit), without necessitating additional changes in the module. The electronic module includes a motherboard, a multichip module (MCM) mounted to the motherboard, and a circuit unit connected to the MCM. The circuit unit comprises a flexible substrate, instrumentation circuitry mounted on the flexible substrate, and a connector coupled to the flexible substrate. The flexible substrate has signal lines that electrically communicate with the MCM, the instrumentation circuitry, and the connector. A portion of the flexible substrate is located between the MCM and the motherboard and permits electrical communication therebetween. The instrumentation circuitry does not occupy space on the motherboard.
摘要翻译：一种电子模块和方法，其使得模块的一种形式（例如，发展单元）所需的电路在模块的第二形式（例如，生产单元）中被省略，而不需要模块的额外改变。电子模块包括主板，安装到母板的多芯片模块（MCM）和连接到MCM的电路单元。电路单元包括柔性基板，安装在柔性基板上的仪器电路和耦合到柔性基板的连接器。柔性基板具有与MCM，仪表电路和连接器电连通的信号线。柔性基板的一部分位于MCM和母板之间并且允许它们之间的电连通。仪表电路不占用主板上的空间。

2. 发明授权

US07564128B2 Fully testable surface mount die package configured for two-sided cooling 有权
标题翻译：完全可测试的表面贴装模具封装配置为双面冷却
公开(公告)号：US07564128B2
公开(公告)日：2009-07-21
申请号：US11983247
申请日：2007-11-08
申请人： Todd P. Oman
发明人： Todd P. Oman
IPC分类号： H01L23/34
CPC分类号： H01L23/5389 , H01L23/49833 , H01L24/33 , H01L2924/1306 , H01L2924/181 , H01L2924/00
摘要： A power semiconductor die is sandwiched between upper and lower heat conducting laminate structures to form a surface mount component that is configured for double-sided cooling. The upper heat conducting laminate structure electrically couples top-side die terminal(s) to conductors formed on the inboard face of the lower heat conducting laminate structure, and all of the die terminals are electrically coupled to conductors formed on the outboard face of the lower heat conducting laminate structure. The die package can be placed in a test fixture for full power testing, and when installed in an electronic assembly including a circuit board and upper and lower heatsinks, the die is thermally coupled to the upper heatsink through the upper heat conducting laminate structure, and to the lower heatsink through the circuit board and the lower heat conducting laminate structure.
摘要翻译：功率半导体管芯夹在上部和下部导热层压结构之间以形成被配置为双面冷却的表面安装部件。上部导热层压结构将顶侧模头端子与形成在下部导热叠层结构的内侧面上的导体电耦合，并且所有模具端子电耦合到形成在下部导热叠层结构的外侧面上的导体导热层压结构。模具包可以放置在用于全功率测试的测试夹具中，并且当安装在包括电路板和上部和下部散热器的电子组件中时，模具通过上部导热层压结构热耦合到上部散热器，以及通过电路板和下部导热层压结构到下部散热器。

3. 发明申请

US20090096596A1 Apparatus for medium-range vehicle communications and control 有权
标题翻译：中程车辆通讯和控制装置
公开(公告)号：US20090096596A1
公开(公告)日：2009-04-16
申请号：US12218848
申请日：2008-07-18
申请人： Michel F. Sultan , Dale L. Partin , Craig A. Tieman , Todd P. Oman
发明人： Michel F. Sultan , Dale L. Partin , Craig A. Tieman , Todd P. Oman
IPC分类号： B60R27/00
CPC分类号： G07C5/008 , G07C9/00309
摘要： Medium-range remote communication and control for a vehicle is achieved with a wireless vehicle telematics unit, a medium-range wireless portable fob, and an unmodified wireless personal communication device. The portable fob includes a medium-range RF transceiver for bi-directional communication with the telematics unit and a short-range wireless transceiver for bi-directional communication with the personal communication device. The fob communicates with the vehicle telematics unit in a conventional manner, and also relays information between the telematics unit and the personal communication device. Communication can be initiated by the telematics unit or by the operator via the fob or personal communication device. Once communication is initiated, the fob relays: (1) menu options and status information from the telematics unit to the personal communication device; and (2) menu selections from the personal communication device to the telematics unit. No cellular network service or special programming is required for the personal communications device.
摘要翻译：使用无线车辆远程信息处理单元，中程无线便携式小车和未修改的无线个人通信设备实现车辆的中程远程通信和控制。便携式支架包括用于与远程信息处理单元进行双向通信的中频射频收发器和用于与个人通信设备进行双向通信的短距离无线收发器。通过常规方式与车辆远程信息处理单元通信，并且还可以在远程信息处理单元和个人通信设备之间中继信息。通信可以由远程信息处理单元或操作者通过FOB或个人通信设备发起。一旦通信启动，FOB继电器：（1）从远程信息处理单元到个人通信设备的菜单选项和状态信息; 和（2）从个人通信设备到远程信息处理单元的菜单选择。个人通信设备不需要蜂窝网络服务或特殊编程。

4. 发明申请

US20090096576A1 Fault tolerant vehicle communication and control apparatus 有权
标题翻译：容错车辆通信和控制设备
公开(公告)号：US20090096576A1
公开(公告)日：2009-04-16
申请号：US12221183
申请日：2008-07-31
申请人： Todd P. Oman , Craig A. Tieman , Michel F. Sultan , Dale L. Partin , Clayton L. Nicholas
发明人： Todd P. Oman , Craig A. Tieman , Michel F. Sultan , Dale L. Partin , Clayton L. Nicholas
IPC分类号： H04B1/38
CPC分类号： G07C9/00309 , B60C23/0479 , G07C5/008
摘要： Medium-range and global network information and control for a vehicle is achieved with a portable wireless key fob, a user-provided nomadic device, and a vehicle-installed telematics unit including a medium-range RF transceiver and a wireless network transceiver. The fob includes a medium-range RF transceiver for bi-directional communication with the telematics unit, and a short-range wireless transceiver for bi-directional communication with the nomadic device. The fob communicates with the telematics unit in a conventional manner, and also relays information between the telematics unit and the nomadic device. If a communication initiated via the fob cannot be completed because the fob is out of range, the communication is sent to the nomadic device for network transmission to the telematics unit. If a communication initiated via the nomadic device cannot be completed due to inadequate signal reception, the communication is sent to the fob for RF transmission to the telematics unit.
摘要翻译：使用便携式无线钥匙扣，用户提供的游牧装置以及包括中程射频收发器和无线网络收发器的车载远程信息处理单元来实现车辆的中等和全球网络信息和控制。机架包括用于与远程信息处理单元进行双向通信的中频射频收发器，以及用于与游牧设备进行双向通信的短距离无线收发器。遥控器以常规方式与远程信息处理单元进行通信，并且还在远程信息处理单元和游牧设备之间中继信息。如果通过FOB发起的通信无法完成，因为FOB超出范围，则将通信发送到游牧设备，以便网络传输到远程信息处理单元。如果通过游牧设备发起的通信由于信号接收不足而无法完成，则通信被发送到小车，用于RF传输到远程信息处理单元。

5. 发明申请

US20090091889A1 Power electronic module having improved heat dissipation capability 审中-公开
标题翻译：功率电子模块具有改善的散热能力
公开(公告)号：US20090091889A1
公开(公告)日：2009-04-09
申请号：US11973518
申请日：2007-10-09
申请人： Todd P. Oman , Kevin M. Gertiser , Ronald M. Shearer
发明人： Todd P. Oman , Kevin M. Gertiser , Ronald M. Shearer
IPC分类号： H05K7/20
CPC分类号： H05K1/18 , H05K1/0209 , H05K2201/0949 , H05K2201/09781 , H05K2201/10166 , H05K2201/10189 , H05K2201/10446 , H05K2201/10515 , H05K2201/10522
摘要： A power electronic module includes heat generating power electronic devices mounted on a circuit board within a connector outline circumscribing circuit board through-holes for receiving pin terminals of a connector assembly. The power electronic devices are thermally and electrically coupled to the circuit board through-holes and connector pin terminals to dissipate heat generated by the power electronic devices.
摘要翻译：电力电子模块包括安装在连接器轮廓外接电路板通孔内的电路板上的发热电力电子装置，用于接收连接器组件的针端子。电力电子设备被热和电耦合到电路板通孔和连接器引脚端子，以散发由电力电子设备产生的热量。

6. 发明授权

US07385828B2 Electronic shunt resistor assembly 失效
标题翻译：电子分流电阻器组件
公开(公告)号：US07385828B2
公开(公告)日：2008-06-10
申请号：US11341356
申请日：2006-01-27
申请人： Todd P. Oman , John V Caputo
发明人： Todd P. Oman , John V Caputo
IPC分类号： H05K1/18
CPC分类号： G01R1/203 , H05K3/4092 , H05K3/429
摘要： An electronic shunt resistor assembly comprises a planar shunt resistor and an electronic monitoring unit. The planar shunt resistor has a resistance element and first and second terminal bars at opposite ends of the resistance element. The electronic measuring unit has a circuit board that is supported on the planar shunt resistor and that includes input contacts for electronic components carried by the circuit board arranged along one edge of the circuit board and input/output contacts for the electronic components arranged along a opposite edge of the circuit board. A first plurality of electrical connectors connect the first terminal bar to the input contacts and a second plurality of electrical connectors connect the second terminal bar to the output contacts of the circuit board. The electrical connectors are attached to the terminal bars and the contacts solderlessly.
摘要翻译：电子分流电阻器组件包括平面分流电阻器和电子监控单元。平面分流电阻器具有电阻元件，并且在电阻元件的相对端处具有第一和第二端子条。电子测量单元具有支撑在平面分流电阻器上的电路板，并且包括用于沿着电路板的一个边缘布置的电路板承载的电子部件的输入触点，以及沿着相对的布置的电子部件的输入/输出触点边缘的电路板。第一多个电连接器将第一端子条连接到输入触点，并且第二多个电连接器将第二端子条连接到电路板的输出触点。电连接器无接点地连接到端子排和触点。

7. 发明申请

US20080128895A1 Wafer applied thermal-mechanical interface 审中-公开
标题翻译：晶圆应用热机械界面
公开(公告)号：US20080128895A1
公开(公告)日：2008-06-05
申请号：US11633936
申请日：2006-12-05
申请人： Todd P. Oman , Gordon A. Claucherty
发明人： Todd P. Oman , Gordon A. Claucherty
IPC分类号： H01L23/36 , H01L21/58
CPC分类号： H01L23/3675 , H01L23/433 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2224/0401
摘要： An improved semiconductor assembly that provides a highly efficient heat-dissipating property, while also providing enhanced mechanical properties, includes a semiconductor device mounted on a substrate, a layer of low modulus material laminated to the semiconductor device, and a heat-conductive member urged against the low modulus layer to provide improved mechanical isolation between the semiconductor and the heat-dissipating member.
摘要翻译：提供高效散热特性，同时提供增强的机械性能的改进的半导体组件包括安装在基板上的半导体器件，层叠在半导体器件上的低模量材料层，以及被推压的导热部件该低模量层在半导体和散热构件之间提供改进的机械隔离。

8. 发明申请

US20100198428A1 MULTI-PURPOSE FOB SYSTEM 审中-公开
标题翻译：多用途离岸价系统
公开(公告)号：US20100198428A1
公开(公告)日：2010-08-05
申请号：US12362629
申请日：2009-01-30
申请人： Michel F. Sultan , Dale L. Partin , Craig A. Tieman , Todd P. Oman
发明人： Michel F. Sultan , Dale L. Partin , Craig A. Tieman , Todd P. Oman
IPC分类号： G06F19/00 , G01S1/00
CPC分类号： G07C9/00309 , G07C2009/00507
摘要： A wireless device is provided having an integrated vehicle fob and entertainment functionality. The wireless device includes a vehicle fob transponder for providing signals to a vehicle for at least one of remote keyless entry, passive entry, passive start, and immobilization functions. The wireless device also includes one or more entertainment receivers for providing entertainment and information functionality on board the vehicle. A controller controls the vehicle fob transponder and the entertainment receivers. One or more communication links are provided for communicating between the wireless device and a vehicle to provide vehicle fob functionality and entertainment and information functionality.
摘要翻译：提供具有集成的车载和娱乐功能的无线设备。无线设备包括用于向远程无钥匙进入，被动进入，被动启动和固定功能中的至少一个向车辆提供信号的车载人员应答器。无线设备还包括用于在车辆上提供娱乐和信息功能的一个或多个娱乐接收器。控制器控制车载应答器和娱乐接收器。提供一个或多个通信链路用于在无线设备和车辆之间进行通信，以提供车载功能和娱乐和信息功能。

9. 发明申请

US20070298544A1 Manufacturing method for a leadless multi-chip electronic module 失效
标题翻译：无铅多芯片电子模块的制造方法
公开(公告)号：US20070298544A1
公开(公告)日：2007-12-27
申请号：US11471869
申请日：2006-06-21
申请人： Todd P. Oman
发明人： Todd P. Oman
IPC分类号： H01L21/00
CPC分类号： H01L23/3107 , H01L21/4832 , H01L23/49541 , H01L23/49575 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： A leadless multi-chip electronic module with leadframe bond pads is manufactured in a manner to place small signal bond pads in a central region of the module for significantly increased reliability of solder joints between such bond pads and a substrate of the module. A linear array of parallel leadframe elements disposed in a central region of the module and bridging first and second larger IC leadframe bond pads are converted into signal bond pads by a pair of partial bottom-side saw cuts. The saw cuts run parallel to and adjacent the first and second IC bond pads to electrically isolate the leadframe elements from the IC bond pads and other bond pads. The partial saw cuts are made following encapsulation and preferably before leadframe singulation.
摘要翻译：制造具有引线框接合焊盘的无引线多芯片电子模块，以便将小信号接合焊盘放置在模块的中心区域中，以显着增加这种焊盘与模块的基板之间的焊点的可靠性。布置在模块的中心区域并桥接第一和第二较大的IC引线框接合焊盘的并联引线框架元件的线性阵列通过一对局部底侧锯切转换成信号焊盘。锯切平行于第一和第二IC接合焊盘并与之相邻，以将引线框架元件与IC接合焊盘和其它接合焊盘电隔离。部分锯切是在封装之后并且优选地在引线框架切割之前制成的。

10. 发明授权

US07038308B2 Multi-path bar bond connector for an integrated circuit assembly 失效
标题翻译：用于集成电路组件的多路径接合连接器
公开(公告)号：US07038308B2
公开(公告)日：2006-05-02
申请号：US10919864
申请日：2004-08-17
申请人： Gary E. Oberlin , Todd P. Oman
发明人： Gary E. Oberlin , Todd P. Oman
IPC分类号： H01L23/48
CPC分类号： H01L23/49844 , H01L23/488 , H01L23/492 , H01L23/49562 , H01L24/37 , H01L24/40 , H01L2224/37011 , H01L2224/37599 , H01L2224/40091 , H01L2224/40225 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/14 , H01L2924/15787 , H01L2924/00 , H01L2224/37099
摘要： A solderable bar bond connector establishes a primary interconnect between a substrate and a high current terminal of an IC chip mounted on the substrate, and one or more secondary interconnects between the substrate and low current terminals of the IC chip. The bar bond connector includes a plate portion soldered to the high current terminal of the IC chip and a plurality of leg elements extending from the plate portion to multiple bond sites on the substrate. The underside of at least one leg element is provided with a secondary circuit including a conductor that is electrically isolated from the respective leg element. The conductor of the secondary circuit is soldered to both the substrate and a low current terminal of the IC chip for establishing a secondary interconnect in addition to the primary interconnect established by the plate portion and the other leg elements.
摘要翻译：可焊接棒接合连接器在衬底和安装在衬底上的IC芯片的高电流端子之间建立初级互连，并且在IC芯片的衬底和低电流端子之间建立一个或多个次互连。棒接合连接器包括焊接到IC芯片的高电流端子的板部分和从板部分延伸到衬底上的多个接合位置的多个腿部元件。至少一个腿元件的下侧设置有包括与相应的腿元件电隔离的导体的次级电路。次级电路的导体焊接到IC芯片的基板和低电流端子，除了由板部分和其它支脚元件建立的主互连之外，还建立辅助互连。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式