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    • 4. 发明授权
    • Wafer dividing apparatus and laser processing apparatus
    • 晶圆分割装置和激光加工装置
    • US08642920B2
    • 2014-02-04
    • US12968733
    • 2010-12-15
    • Chikara AikawaJun AbatakeYasuyoshi YubiraHiroto Yoshida
    • Chikara AikawaJun AbatakeYasuyoshi YubiraHiroto Yoshida
    • B23K26/16H01L21/00
    • B28D5/0011B23K26/0853B23K26/702
    • A wafer dividing apparatus for dividing a wafer along a plurality of crossing streets in the condition where the wafer is attached to the upper surface of a dicing tape supported to an annular frame and the strength of the wafer is reduced along the streets. The wafer dividing apparatus includes a frame holding unit for holding the annular frame, a wafer holding table having a holding surface for holding the wafer through the dicing tape supported to the annular frame held by the frame holding unit, a tape expanding unit for relatively moving the frame holding unit and the wafer holding table in a direction perpendicular to the holding surface of the wafer holding table to thereby expand the dicing tape, and a vibration generating unit for applying vibration to the holding surface of the wafer holding table.
    • 一种晶圆分割装置,用于在将晶片安装在支撑在环形框架上的切割带的上表面的状态下沿着多个交叉街道分割晶片,并且晶片的强度沿街道减小。 晶片分割装置包括用于保持环形框架的框架保持单元,具有用于保持晶片的保持表面的晶片保持台通过支撑在由框架保持单元保持的环形框架的切割带,用于相对移动的带扩展单元 框架保持单元和晶片保持台在垂直于晶片保持台的保持表面的方向上,从而扩大切割带;以及振动产生单元,用于向晶片保持台的保持表面施加振动。
    • 5. 发明申请
    • WAFER DIVIDING APPARATUS AND LASER PROCESSING APPARATUS
    • 波浪分割装置和激光加工装置
    • US20110147349A1
    • 2011-06-23
    • US12968733
    • 2010-12-15
    • Chikara AikawaJun AbatakeYasuyoshi YubiraHiroto Yoshida
    • Chikara AikawaJun AbatakeYasuyoshi YubiraHiroto Yoshida
    • H01L21/463B28D5/00
    • B28D5/0011B23K26/0853B23K26/702
    • A wafer dividing apparatus for dividing a wafer along a plurality of crossing streets in the condition where the wafer is attached to the upper surface of a dicing tape supported to an annular frame and the strength of the wafer is reduced along the streets. The wafer dividing apparatus includes a frame holding unit for holding the annular frame, a wafer holding table having a holding surface for holding the wafer through the dicing tape supported to the annular frame held by the frame holding unit, a tape expanding unit for relatively moving the frame holding unit and the wafer holding table in a direction perpendicular to the holding surface of the wafer holding table to thereby expand the dicing tape, and a vibration generating unit for applying vibration to the holding surface of the wafer holding table.
    • 一种晶圆分割装置,用于在将晶片安装在支撑在环形框架上的切割带的上表面的状态下沿着多个交叉街道分割晶片,并且晶片的强度沿街道减小。 晶片分割装置包括用于保持环形框架的框架保持单元,具有用于保持晶片的保持表面的晶片保持台通过支撑在由框架保持单元保持的环形框架的切割带,用于相对移动的带扩展单元 框架保持单元和晶片保持台在垂直于晶片保持台的保持表面的方向上,从而扩大切割带;以及振动产生单元,用于向晶片保持台的保持表面施加振动。