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1. 发明授权

US5694287A Solid electrolytic capacitor with conductive polymer as solid electrolyte and method of manufacturing the same 失效
标题翻译：具有导电聚合物作为固体电解质的固体电解电容器及其制造方法
公开(公告)号：US5694287A
公开(公告)日：1997-12-02
申请号：US521430
申请日：1995-08-30
申请人： Toshihiko Nishiyama , Takashi Fukaumi , Satoshi Arai , Hiromichi Taniguchi , Atsushi Kobayashi
发明人： Toshihiko Nishiyama , Takashi Fukaumi , Satoshi Arai , Hiromichi Taniguchi , Atsushi Kobayashi
IPC分类号： H01G9/028 , H01G9/02 , H01G9/025 , H01G9/00
CPC分类号： H01G9/025 , H01G11/56 , Y02E60/13 , Y10T29/417 , Y10T29/43 , Y10T29/435
摘要： The solid electrolytic capacitor disclosed has a conducting polymer as a solid electrolyte and an antioxidant contained substantially only in a layer disposed in the neighborhood of a surface of the conducting polymer. The antioxidant serves to block the progress of oxidation of organic materials. A capacitor element with conducting polymer not containing the antioxidant is first prepared and this capacitor element is then dipped in a solution containing the antioxidant. Thus, the antioxidant at high concentration is caused to be introduced into the conducting polymer so as to be contained substantially only in a layer disposed in the neighborhood of the surface of the conducting polymer. Since the antioxidant can be introduced by merely dipping the capacitor element in the antioxidant solution, the method can be applied widely to capacitors irrespective of the process of conducting polymer formation. The antioxidant concentration inside the conducting polymer is substantially zero so that the conductivity thereof is not affected.
摘要翻译：公开的固体电解电容器具有作为固体电解质的导电聚合物，并且抗氧化剂基本上只包含在布置在导电聚合物表面附近的层中。该抗氧化剂用于阻止有机材料的氧化进程。首先制备具有不含抗氧化剂的导电聚合物的电容器元件，然后将该电容器元件浸入含有抗氧化剂的溶液中。因此，将高浓度的抗氧化剂引入导电聚合物中，以便仅基本上仅包含在导电聚合物表面附近的层中。由于通过仅将电容器元件浸渍在抗氧化剂溶液中可以引入抗氧化剂，所以无论进行聚合物形成的方法如何，该方法可以广泛地应用于电容器。导电聚合物内部的抗氧化剂浓度基本上为零，使得其导电性不受影响。

2. 发明授权

US5621608A Solid electrolytic capacitor having two solid electrolyte layers and method of manufacturing the same 失效
标题翻译：具有两个固体电解质层的固体电解电容器及其制造方法
公开(公告)号：US5621608A
公开(公告)日：1997-04-15
申请号：US562467
申请日：1995-11-24
申请人： Satoshi Arai , Takashi Fukaumi , Toshihiko Nishiyama , Hiromichi Taniguchi , Atsushi Kobayashi
发明人： Satoshi Arai , Takashi Fukaumi , Toshihiko Nishiyama , Hiromichi Taniguchi , Atsushi Kobayashi
IPC分类号： H01G9/02 , H01G9/025
CPC分类号： H01G9/025 , H01G11/48 , H01G11/56 , Y02E60/13 , Y10T29/417
摘要： In a solid electrolytic capacitor which employs a conducting polymer as the solid electrolyte, a first solid electrolytic layer (3) consisting of a sole conducting polymer is formed by chemical polymerization on an oxide film (2) formed on the surface of an anode body (1). Next, a second solid electrolytic layer (4) consisting of a conducting polymer containing fine powder, obtained by chemical polymerization using a solution in which fine powder is dispersed in a reaction solution for chemical polymerization, is formed on the first solid electrolytic layer (3). The fine powder is harder than the conducting polymer. With this arrangement, it is possible to prevent the application of a stress to the oxide film (2) by the solid electrolytic layer (4) consisting of a conducting polymer containing fine powder even if there is generated a stress at the time of curing of a molded resin (8).
摘要翻译：在采用导电性聚合物作为固体电解质的固体电解电容器中，通过在形成于阳极体的表面上的氧化膜（2）上进行化学聚合而形成由唯一导电聚合物构成的第一固体电解质层（3） 1）。接着，在第一固体电解质层（3）上形成第二固体电解质层（4），该第二固体电解质层（4）由含有细粉末的导电性聚合物构成，其中，该导电性聚合物含有微粉末分散在化学聚合反应液中的溶液，）。细粉末比导电聚合物硬。通过这种布置，即使固化时产生应力，也可以防止由含有细粉末的导电性聚合物构成的固体电解质层（4）对氧化膜（2）施加应力模制树脂（8）。

3. 发明授权

US5586000A Solid electrolytic capacitor and process for production thereof 失效
标题翻译：固体电解电容器及其生产方法
公开(公告)号：US5586000A
公开(公告)日：1996-12-17
申请号：US360582
申请日：1994-12-21
申请人： Koji Sakata , Maki Minamoto , Takashi Fukaumi , Toshihiko Nishiyama , Satoshi Arai , Hiromichi Taniguchi
发明人： Koji Sakata , Maki Minamoto , Takashi Fukaumi , Toshihiko Nishiyama , Satoshi Arai , Hiromichi Taniguchi
IPC分类号： C09K15/00 , H01G9/00 , H01G9/028 , H01G9/04 , H01G9/15 , H01G9/07
CPC分类号： H01G9/15 , H01G11/48 , H01G11/56 , Y02E60/13 , Y10T29/417
摘要： The present invention provides a solid electrolytic capacitor comprising a metal having a dielectric oxide film formed thereon, a conductive polymer compound layer formed on said dielectric oxide film, a conductive paste layer formed on said conductive polymer compound layer, a molded resin sheathing having all of the above members buried therein, and a pair of electrodes connected to said metal and said conductive paste layer, respectively, in which capacitor an antioxidant is scattered, in the form of particles, in at least one of said conductive polymer compound layer, said conductive paste layer and the interface between the conductive polymer compound layer and the conductive paste layer; and a process for production of said capacitor.
摘要翻译：本发明提供一种固体电解电容器，其包括其上形成有电介质氧化膜的金属，在所述电介质氧化膜上形成的导电高分子化合物层，形成在所述导电性高分子化合物层上的导电性糊料层，所述导电性高分子化合物层中的至少一种导电性高分子化合物层，所述导电性高分子化合物层中的至少一种，分别与所述金属和所述导电性糊剂层连接的电极，膏层和导电高分子化合物层与导电糊层之间的界面; 以及用于生产所述电容器的工艺。

4. 发明授权

US5707407A Method of forming chip-formed solid electrolytic capacitor without an anode lead projecting from anode member 失效
标题翻译：形成芯片形成的固体电解电容器的方法，而不具有从阳极部件突出的阳极引线
公开(公告)号：US5707407A
公开(公告)日：1998-01-13
申请号：US797315
申请日：1997-02-07
申请人： Masashi Ohi , Hiromichi Taniguchi , Atushi Kobayashi
发明人： Masashi Ohi , Hiromichi Taniguchi , Atushi Kobayashi
IPC分类号： H01G9/012 , H01G9/00 , H01G9/004 , H01G9/15
CPC分类号： H01G9/012 , Y10T29/417
摘要： A chip-formed solid electrolytic capacitor having a structure wherein a projecting anode lead is not provided for an anode member. The solid electrolytic capacitor is fabricated by the following manner: First, an electrically insulating resin such as a fluororesin is impregnated into an end face of a porous electrode member to form an insulating resin impregnated portion, and an electrode lead member is bonded to the anode member at the insulating resin impregnated portion. An anodic oxidation film, a solid electrolyte layer and a cathode layer successively are formed on the anode member. Then, an electrically insulating outer package is applied so that the cathode layer on a face of the anode member opposing to the face on which the electrode lead member is mounted is exposed. After removing the electrode lead member, an anode outer electrode layer is formed on the insulating resin impregnated portion, and a cathode outer electrode layer which electrically connects to the cathode layer is formed on the end face of the anode member opposing to the anode outer electrode layer.
摘要翻译：一种芯片形成的固体电解电容器，其具有不向阳极部件提供突出的阳极引线的结构。固体电解电容器通过以下方式制造：首先，在多孔电极构件的端面上浸渍诸如氟树脂的电绝缘树脂以形成绝缘树脂浸渍部分，并且将电极引线构件结合到阳极绝缘树脂浸渍部分的部件。在阳极部件上依次形成阳极氧化膜，固体电解质层和阴极层。然后，施加电绝缘的外包装，使阳极部件的与安装有电极引线部件的面相对的面上的阴极层露出。在除去电极引线部件之后，在绝缘树脂浸渍部分上形成阳极外部电极层，并且在与阳极外部电极相对的阳极部件的端面上形成与阴极层电连接的阴极外部电极层层。

5. 发明授权

US5568354A Chip type solid electrolyte capacitor 失效
标题翻译：片式固体电解电容器
公开(公告)号：US5568354A
公开(公告)日：1996-10-22
申请号：US505997
申请日：1995-07-24
申请人： Hiromichi Taniguchi
发明人： Hiromichi Taniguchi
IPC分类号： H01G9/004 , H01G9/00 , H01G9/012 , H01G9/14
CPC分类号： H01G9/012
摘要： A chip type solid electrolyte capacitor is given a three-terminal structure, with cathode terminals at either end and an anode lead embedded in an anode body at the center of the device structure. This eliminates the possibility of device breakdown or short circuit when a chip-type solid electrolyte capacitor with rectifying characteristics is inadvertently mounted the wrong way on a circuit board, and assures a small device size.
摘要翻译：芯片型固体电解电容器被给予三端子结构，其两端的阴极端子和埋在器件结构中心的阳极体中的阳极引线。这就消除了当具有整流特性的芯片型固体电解电容器无意地在电路板上安装错误的方式时，器件击穿或短路的可能性，并且确保了小的器件尺寸。

6. 发明授权

US5654869A Chip-formed solid electrolytic capacitor without an anode lead projecting from anode member 失效
标题翻译：芯片形成的固体电解电容器，没有从阳极部件突出的阳极引线
公开(公告)号：US5654869A
公开(公告)日：1997-08-05
申请号：US569304
申请日：1995-12-08
申请人： Masashi Ohi , Hiromichi Taniguchi , Atushi Kobayashi
发明人： Masashi Ohi , Hiromichi Taniguchi , Atushi Kobayashi
IPC分类号： H01G9/012 , H01G9/00 , H01G9/004 , H01G9/02
CPC分类号： H01G9/012 , Y10T29/417
摘要： A chip-formed solid electrolytic capacitor having a structure wherein a projecting anode lead is not provided for an anode member. The solid electrolytic capacitor is fabricated by the following manner: First, an electrically insulating resin such as a fluororesin is impregnated into an end face of a porous electrode member to form an insulating resin impregnated portion, and an electrode lead member is bonded to the anode member at the insulating resin impregnated portion. An anodic oxidation film, a solid electrolyte layer and a cathode layer successively are formed on the anode member. Then, an electrically insulating outer package is applied so that the cathode layer on a face of the anode member opposing to the face on which the electrode lead member is mounted is exposed. After removing the electrode lead member, an anode outer electrode layer is formed on the insulating resin impregnated portion, and a cathode outer electrode layer which electrically connects to the cathode layer is formed on the end face of the anode member opposing to the anode outer electrode layer.
摘要翻译：一种芯片形成的固体电解电容器，其具有不向阳极部件提供突出的阳极引线的结构。固体电解电容器通过以下方式制造：首先，在多孔电极构件的端面上浸渍诸如氟树脂的电绝缘树脂以形成绝缘树脂浸渍部分，并且将电极引线构件结合到阳极绝缘树脂浸渍部分的部件。在阳极部件上依次形成阳极氧化膜，固体电解质层和阴极层。然后，施加电绝缘的外包装，使阳极部件的与安装有电极引线部件的面相对的面上的阴极层露出。在除去电极引线部件之后，在绝缘树脂浸渍部分上形成阳极外部电极层，并且在与阳极外部电极相对的阳极部件的端面上形成与阴极层电连接的阴极外部电极层层。

7. 发明授权

US5184287A Chip type solid electrolytic capacitor 失效
标题翻译：芯片型固体电解电容器
公开(公告)号：US5184287A
公开(公告)日：1993-02-02
申请号：US895843
申请日：1992-06-09
申请人： Hiromichi Taniguchi
发明人： Hiromichi Taniguchi
IPC分类号： H01G9/004 , H01G9/00 , H01G9/012 , H01G9/14
CPC分类号： H01G9/012
摘要： According to this invention, a chip type solid electrolytic capacitor includes a capacitor element, an insulating sheathing resin layer, two anode terminals, and a cathode terminal. The capacitor element is obtained by sequentially forming an oxide film, a solid electrolytic layer, and a cathode conductive layer on an anode body consisting of a valve metal in which anode leads are extracted from two opposite end faces. The insulating sheathing resin layer is coated on an entire outer surface except for both anode lead extraction end faces and a predetermined portion of one surface. The two anode terminals are formed on both the anode lead extraction end faces and peripheral portions thereof. The cathode terminal is formed on the cathode conductive layer exposed from said insulating sheathing resin layer.

8. 发明授权

US5349496A Chip-type solid electrolytic capacitor 失效
标题翻译：片式固体电解电容器
公开(公告)号：US5349496A
公开(公告)日：1994-09-20
申请号：US25874
申请日：1993-03-03
申请人： Hiromichi Taniguchi , Yoshihiko Saiki
发明人： Hiromichi Taniguchi , Yoshihiko Saiki
IPC分类号： H01G9/012 , H01G9/00 , H01G9/004 , H01G9/04
CPC分类号： H01G9/012
摘要： The invention relates to a chip-type solid elelctrolytic capacitor which uses a capacitor element having an anode lead protruding from one end face of an anode body of a valve metal. The capacitor element is covered by an insulating resin cover layer except a cathode end face and the protruding part of the anode lead. A cathode terminal is formed on the cathode end face and the resin cover layer in an area near the cathode end face, and an anode terminal is formed on the resin cover layer so as to make contact with the protruding anode lead. The anode terminal is made up of a conductive layer which is formed on the resin cover layer only in a limited area so as not to make contact with the anode lead and has a microscopically rough surface, a plating layer which is formed on the conductive layer and the resin cover layer in the area over the aforementioned end face of the anode body and covers the protruding anode lead and a solder layer formed on the plating layer. In the anode terminal the rough surface of the conductive layer enhances the adhesion of the overlaid plating layer, and the separation of the conductive layer from the anode lead eliminates the problem about different thermal expansion coefficients of the conductive layer and the anode lead. Therefore, when the chip-type capacitor is mounted on a printed circuit board the bonding strength is enhanced.
摘要翻译：本发明涉及一种芯片式固体电解电容器，其使用具有从阀金属的阳极体的一个端面突出的阳极引线的电容器元件。除了阴极端面和阳极引线的突出部分之外，电容器元件被绝缘树脂覆盖层覆盖。阴极端子形成在阴极端面附近的阴极端面和树脂覆盖层上，阳极端子形成在树脂覆盖层上，以与突出的阳极引线接触。阳极端子由仅在有限的区域形成在树脂覆盖层上的导体层构成，以便不与阳极引线接触并且具有微观粗糙的表面，形成在导电层上的镀层以及在阳极体的上述端面上方的区域中的树脂覆盖层，并且覆盖突出的阳极引线和形成在镀层上的焊料层。在阳极端子中，导电层的粗糙表面增强了覆盖的镀层的粘附性，并且导电层与阳极引线的分离消除了导电层和阳极引线的不同热膨胀系数的问题。因此，当将片式电容器安装在印刷电路板上时，结合强度提高。

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